AMD XC2V3000-4BF957I

Overview

XC2V3000-4BF957I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 CLB slices, 96 Block SelectRAM™ modules (720 Kbits total RAM), 448 dedicated 18×18 multipliers, and 12 Digital Clock Managers (DCMs). It implements configurable logic, embedded memory, high-speed I/O, and clock synthesis for telecom, networking, and DSP systems requiring PCI-X, LVDS, and DDR interfaces.

For engineers reviewing the XC2V3000-4BF957I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability (684 user I/Os in BF957 flip-chip BGA), DC/switching characteristics, DCM timing parameters, and confirmed alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V3000-4BF957I uses a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates Configurable Logic Blocks (CLBs), 18-Kb dual-port Block SelectRAM, 18×18 multipliers, and 12 DCMs supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period).

It supports 19 single-ended I/O standards (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and 6 differential standards (LVDS, BLVDS, LVPECL, LDT), with Digitally Controlled Impedance (DCI) for on-chip termination. The BF957 package provides 684 user I/Os, excluding 15 control pins and VBATT, and enables high-pin-count, high-thermal-capacity deployment in industrial environments (–40°C to +100°C).

Key Specifications

Pinout & Package

XC2V3000-4BF957I is housed in a 957-ball flip-chip BGA (BF957) package with 1.27 mm pitch, 40 mm × 40 mm body size, and 684 user I/Os. The package excludes 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC2V3000-4BF957I, XC2V3000-5FF1152I delivers greater I/O scalability and timing headroom, while XC3S1500-4FG456C trades robust clock management, industrial reliability, and advanced I/O for lower unit cost and power-making it unsuitable for telecom infrastructure or medical imaging where deterministic timing and thermal resilience are mandatory.

Availability

XC2V3000-4BF957I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-4BF957I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It develops FPGA, SoC, and adaptive compute platforms for high-performance, mission-critical applications.

The Virtex-II family was engineered for high-speed, high-density programmable logic in telecom, networking, and DSP systems-delivering industry-first features including DCM-based clock management, SelectRAM hierarchy, and SelectIO-Ultra I/O technology.

FAQ

What is the maximum number of user I/Os supported by XC2V3000-4BF957I?

XC2V3000-4BF957I supports 684 user I/Os in its BF957 flip-chip BGA package. This count excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The I/Os are fully programmable for single-ended or differential signaling per the Virtex-II SelectIO-Ultra specification.

Does XC2V3000-4BF957I support DDR memory interfaces?

Yes, XC2V3000-4BF957I natively supports DDR SDRAM and DDR SRAM interfaces through dedicated DDR input/output registers in its IOBs and programmable I/O standards (SSTL2_I/II, SSTL3_I/II). Its 12 DCMs provide precise clock deskew and phase alignment critical for meeting DDR setup/hold timing requirements.

What clock management resources does XC2V3000-4BF957I include?

XC2V3000-4BF957I integrates 12 Digital Clock Managers (DCMs), each capable of clock de-skew, frequency synthesis (M/D ratio), and coarse/fine phase shifting (including 90°, 180°, 270° and 1/256-period resolution). These feed 16 global clock multiplexer buffers to distribute low-jitter clocks across the FPGA fabric.

Is XC2V3000-4BF957I compatible with PCI-X 133 MHz operation?

Yes, XC2V3000-4BF957I is PCI-X 133 MHz compliant at 3.3 V, as confirmed in the Virtex-II DS031 specification. Its IOBs support PCI-X signaling with appropriate VCCO = 3.3 V and meet timing, voltage, and drive strength requirements defined in the PCI-X specification.

What security features are implemented in XC2V3000-4BF957I?

XC2V3000-4BF957I includes on-chip Triple-DES bitstream encryption using one or two key sets, IEEE 1532 boundary-scan configuration, and readback protection. These features prevent unauthorized access to configuration data and protect intellectual property in deployed systems.