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AMD XC2V3000-4BG728I
- Part No.:
- XC2V3000-4BG728I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 728-BBGA
- Datasheet:
-
XC2V3000-4BG728I.pdf
- Description:
- IC FPGA 516 I/O 728MBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC2V3000-4BG728I from Xilinx is a 3-million-system-gate Virtex-II platform FPGA in a 728-pin standard BGA (1.27 mm pitch), rated for industrial temperature range (–40°C to +100°C), with 516 user I/Os, 14,336 CLB slices, and 96 Digital Clock Manager (DCM) modules. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring DDR/LVDS interfaces and on-chip memory.
For engineers reviewing the XC2V3000-4BG728I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (516), DCM count (96), SelectRAM capacity (720 Kbits), core voltage (1.5 V), and industrial-grade thermal operation - all confirmed in DS031 v3.5.
Technical Context
The XC2V3000-4BG728I implements a hierarchical, segmented Active Interconnect routing architecture with predictable delay independent of fanout. Its 14,336 CLB slices each contain dual 4-input LUTs, dual storage elements, carry chains, and horizontal cascading logic - enabling efficient arithmetic and wide-function synthesis.
It integrates 96 fully digital DCM blocks supporting precise clock de-skew, M/D ratio frequency synthesis, and fine-grained phase shifting (1/256 period resolution). All 516 user I/Os support SelectIO-Ultra with 19 single-ended and 6 differential standards, including LVDS, LVPECL, SSTL, and HSTL, plus Digitally Controlled Impedance (DCI) for on-chip termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 3 million system gates; enables large-scale RTL integration with up to 14,336 CLB slices and 93,184 registers. |
| User I/O Count | 516 pins; supports high-bandwidth parallel interfaces such as DDR SDRAM, QDR SRAM, and PCI-X at 133 MHz. |
| Block RAM | 720 Kbits total (96 × 18-Kb dual-port SelectRAM); configurable from 16K×1 to 512×36, with read-during-write capability. |
| Multiplier Blocks | 448 dedicated 18-bit × 18-bit multipliers; accelerates DSP filtering, FFT, and MAC operations without consuming LUT resources. |
| Digital Clock Managers | 96 DCMs; provide jitter-tolerant clock synthesis, phase alignment, and de-skew across multiple clock domains. |
| Core Voltage | 1.5 V VCCINT; reduces dynamic power vs. older 2.5 V FPGAs while maintaining high-speed performance. |
| I/O Standards | Supports LVDS, LVPECL, SSTL-2/3, HSTL, PCI-X, and GTL/GTLP; enables direct interfacing to memory, processors, and serial links. |
Pinout & Package
XC2V3000-4BG728I uses the BG728 standard BGA package (1.27 mm pitch, 35 mm × 35 mm), with 516 user I/Os distributed across four quadrants and 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration state machine during SelectMAP or slave-serial programming; must be stable before PROG_B release. |
| DONE | Configuration status output | Open-drain signal pulled high externally; goes high when configuration completes successfully and CRC passes. |
| M0–M2 | Mode select inputs | Set configuration mode (slave-serial, master-serial, SelectMAP, boundary-scan) at power-up; sampled on PROG_B release. |
| PROG_B | Program initiation input | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence. |
| TCK/TDI/TDO/TMS | JTAG test access port | IEEE 1149.1-compliant interface for boundary-scan testing, configuration, and debug via Xilinx iMPACT or ChipScope. |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series or split termination for LVDCI, SSTL, HSTL, and GTL standards - eliminates external resistors and improves signal integrity. |
| DDR I/O Registers | Dual-edge capture and launch per I/O pin using two independent clocks (180° phase offset) - enables true 840 Mb/s LVDS and DDR data rates. |
| Triple-DES Bitstream Encryption | Hardware-accelerated encryption using one or two DES key sets - protects intellectual property against unauthorized bitstream readback or cloning. |
| Integrated Logic Analyzer (ILA) | Configurable embedded core for real-time signal capture and trigger-based debugging without external probes or logic analyzers. |
| Partial Reconfiguration Support | Dynamic replacement of logic modules during operation - enables field-upgradable functions and adaptive hardware acceleration. |
Applications
| Telecom Line Card | Video Processing Engine |
|---|---|
Use Scenario: High-density packet-processing line card in carrier-class routers handling OC-192/STM-64 traffic with SERDES-to-FPGA bridging. IC Role / Device Role / Timing Role: Configurable protocol mapper and traffic manager implementing HDLC, POS, and GFP framing with deterministic latency control. Use Value: 96 DCMs enable precise clock domain crossing between 10 Gbps serial lanes and parallel backplane buses, while 516 I/Os support multi-lane DDR2 interfaces to packet buffers. | Use Scenario: Real-time 4K video scaler and chroma-key compositing engine in broadcast production switchers. IC Role / Device Role / Timing Role: Parallel pixel pipeline processor with synchronized input capture, motion-adaptive deinterlacing, and HDMI output timing generation. Use Value: 448 18×18 multipliers accelerate 2D convolution kernels; dual-port SelectRAM provides frame buffering with zero-cycle read-during-write for seamless field transitions. |
| DSP Accelerator Module | Industrial Motion Controller |
Use Scenario: PCIe-attached FPGA co-processor for radar beamforming and synthetic aperture processing in defense EW systems. IC Role / Device Role / Timing Role: High-throughput FFT and matrix inversion accelerator with deterministic latency under hard real-time constraints. Use Value: 14,336 CLB slices implement pipelined CORDIC and butterfly units; 720 Kbits block RAM stores coefficient tables and intermediate results without off-chip DRAM access. | Use Scenario: Multi-axis servo drive controller with synchronized PWM generation, encoder feedback decoding, and safety-critical position loop closure. IC Role / Device Role / Timing Role: Deterministic real-time I/O hub managing 16-channel SPI encoders, 8-channel isolated analog inputs, and 32-channel PWM outputs. Use Value: Industrial temperature rating (–40°C to +100°C) ensures reliability in motor cabinets; DCI-enabled HSTL I/Os interface directly to high-speed position feedback ASICs with matched impedance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V3000-5FG676C | Fine-pitch BGA (1.00 mm, 676 pins); lower speed grade (-5 vs. -4); commercial temp (0°C to +85°C); 484 user I/Os. | Suitable for cost-sensitive, non-industrial designs where PCB space is constrained and thermal margin is sufficient. | Select when board layout prioritizes smaller footprint over industrial temperature range and maximum I/O count. |
| XC2V4000-4FF900I | Flip-chip BGA (1.00 mm, 900 pins); higher density (4M gates); 912 user I/Os; same speed grade and industrial temp rating. | Required for designs needing >3M gates or >516 I/Os, e.g., multi-protocol baseband processing with simultaneous LTE/5G PHY layers. | Choose when logic capacity or I/O expansion exceeds XC2V3000-4BG728I limits, accepting higher cost and thermal management complexity. |
Compared with XC2V3000-5FG676C, the XC2V3000-4BG728I offers 32 more I/Os and industrial temperature operation but requires larger PCB area; compared with XC2V4000-4FF900I, it trades 1M gates and 396 extra I/Os for lower power, simpler thermal design, and mature wire-bond packaging.
Availability
XC2V3000-4BG728I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial motion control systems requiring stable component supply across extended product lifecycles.
Supply support for XC2V3000-4BG728I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.
The Virtex-II family was designed for high-performance, system-level integration in wireline/wireless infrastructure and DSP-intensive applications, emphasizing clock management, memory hierarchy, and I/O flexibility - directly embodied in the XC2V3000-4BG728I.
FAQ
What is the maximum operating junction temperature for XC2V3000-4BG728I?
The XC2V3000-4BG728I is rated for industrial temperature operation with a maximum junction temperature of +100°C, validated per DS031 v3.5 Section 1.2. This allows deployment in enclosed industrial enclosures or telecom chassis without forced air cooling, provided PCB thermal design meets Xilinx's recommended copper pour and via guidelines.
Does XC2V3000-4BG728I support partial reconfiguration?
Yes, XC2V3000-4BG728I supports partial reconfiguration as documented in DS031 Module 2. This capability enables dynamic logic module swapping during runtime - for example, loading different filter coefficients or protocol stacks into designated CLB regions without resetting the entire device or disrupting active I/O channels.
How many 18-Kb Block SelectRAM modules does XC2V3000-4BG728I contain?
The XC2V3000-4BG728I contains 96 Block SelectRAM modules, totaling 720 Kbits of dual-port RAM. Each block is independently configurable from 16K×1 to 512×36, with three read-during-write modes, enabling efficient frame buffering, FIFO construction, and coefficient storage in DSP pipelines.
Is XC2V3000-4BG728I compatible with 5V-tolerant I/O standards?
No, XC2V3000-4BG728I IOBs are not 5V-tolerant. As stated in DS031 Module 2, outputs are incompatible with 5V standards, and inputs require external current-limiting resistors for safe 5V interface - making it unsuitable for direct connection to legacy 5V logic without level-shifting circuitry.
What configuration modes are supported by XC2V3000-4BG728I?
XC2V3000-4BG728I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. These are selected via M0–M2 pins at power-up and allow flexible integration with microcontrollers, flash memory, JTAG programmers, or host processors.
XC2V3000-4BG728I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 728-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3584
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 1769472
- Number of I/O:
- 516
- Number of Gates:
- 3000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 728-MBGA (35x35)
XC2V3000-4BG728I FAQ
1.How can I place an order for XC2V3000-4BG728I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V3000-4BG728I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V3000-4BG728I reliable?
The price and inventory of XC2V3000-4BG728I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V3000-4BG728I is usually 5 days.
3.What payment methods are accepted for XC2V3000-4BG728I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V3000-4BG728I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V3000-4BG728I?
XC2V3000-4BG728I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V3000-4BG728I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V3000-4BG728I?
For technical support, including XC2V3000-4BG728I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V3000-4BG728I requirements.
6.How does Aetrix verify that XC2V3000-4BG728I is sourced from the original manufacturer or authorized distributors?
All XC2V3000-4BG728I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V3000-4BG728I meets industry standards.
7.What is the process for return or replacement of XC2V3000-4BG728I?
All XC2V3000-4BG728I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V3000-4BG728I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V3000-4BG728I part is unused and in its original packaging.
Return procedure for XC2V3000-4BG728I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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