AMD XC2V3000-4FF1152I

Overview

XC2V3000-4FF1152I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 CLB slices, 96 DCMs, and 720 user I/Os in a 1152-pin flip-chip fine-pitch BGA (FF1152) package. It supports LVDS, DDR, PCI-X, and SSTL I/O standards, and integrates 720 Kbits of block SelectRAM™ memory and 448 dedicated 18×18 multipliers - enabling high-throughput DSP, telecom baseband processing, and reconfigurable networking hardware.

For engineers reviewing the XC2V3000-4FF1152I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability mapping, DCM timing constraints, DCI termination support, and industrial-temperature validated switching characteristics per DS031 (v3.5).

Technical Context

The XC2V3000-4FF1152I implements a fully synchronous, SRAM-based configurable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its routing uses Active Interconnect Technology with 24 long lines per row/column and hierarchical switch matrices for predictable delay independent of fanout.

Each IOB supports single- or double-data-rate (DDR) registers clocked by phase-aligned DCM outputs, and includes Digitally Controlled Impedance (DCI) for on-die series or split termination matching HSTL, SSTL, and LVDCI standards. The device contains 96 Digital Clock Managers (DCMs) supporting precise de-skew, 90°/180°/270° phase shifts, and M/D frequency synthesis.

Key Specifications

Pinout & Package

XC2V3000-4FF1152I is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) package with 1.00 mm pitch, 35 mm × 35 mm body size, and 720 user I/Os. The package uses copper pillar flip-chip interconnect for low-inductance power delivery and thermal performance suitable for industrial ambient (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-4FF1152I, the XC7VX690T offers higher BRAM capacity and transceiver integration for modern protocols, while the XCVU3P delivers advanced AI and networking features - both require architectural re-architecting rather than pin-compatible replacement.

Availability

XC2V3000-4FF1152I is available at Aetrix Electronics and suitable for industrial motion control, telecom baseband processing, avionics data concentration, and high-speed test equipment requiring stable component supply across extended lifecycle programs.

Supply support for XC2V3000-4FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic with FPGA architectures optimized for high-performance, system-level integration and IP-centric design flows.

The Virtex-II family - including XC2V3000-4FF1152I - was engineered for demanding telecommunications, wireless infrastructure, and industrial automation applications requiring deterministic timing, high I/O bandwidth, and reconfigurable compute resources.

FAQ

What is the maximum operating temperature range for XC2V3000-4FF1152I?

The XC2V3000-4FF1152I is rated for industrial temperature operation from –40°C to +100°C junction temperature, as indicated by the "I" suffix in its part number. This rating applies under specified VCCINT = 1.5 V ±3%, VCCAUX = 3.3 V ±5%, and appropriate thermal management per DS031 thermal derating curves.

Does XC2V3000-4FF1152I support DDR2 SDRAM interfaces?

Yes, XC2V3000-4FF1152I supports DDR2 SDRAM interfaces through its SelectIO-Ultra I/O banks configured for SSTL-18 Class II, with programmable drive strength and on-die termination (DCI). The device's 96 DCMs provide precise phase alignment for DQS strobe capture, and its 720 I/Os allow full 32-bit or 64-bit data bus implementation.

How many 18×18 multipliers does XC2V3000-4FF1152I contain?

XC2V3000-4FF1152I contains 448 dedicated 18-bit × 18-bit hard multipliers, as confirmed in Table 1 of DS031 (v3.5). Each multiplier is paired with a 18-Kb SelectRAM block but can operate independently for arithmetic-intensive tasks such as digital filtering and matrix multiplication.

Is XC2V3000-4FF1152I compatible with IEEE 1532 boundary-scan configuration?

Yes, XC2V3000-4FF1152I fully supports IEEE 1532 boundary-scan configuration via its JTAG TAP controller (TCK/TMS/TDI/TDO pins). This enables in-system programming, readback verification, and partial reconfiguration - all documented in Module 2 of DS031.

What package type and pin count does XC2V3000-4FF1152I use?

XC2V3000-4FF1152I uses the FF1152 flip-chip fine-pitch BGA package with 1152 solder balls, 1.00 mm pitch, and 35 mm × 35 mm footprint. It provides 720 user I/Os, as specified in Table 5 and Table 6 of DS031 (v3.5), and is distinct from wire-bond packages like BG728.