AMD XC2V3000-4FFG1152C

Overview

XC2V3000-4FFG1152C from Xilinx is a high-density Virtex-II platform FPGA with 3 million system gates, 14,336 configurable logic blocks (CLBs), 96 Digital Clock Manager (DCM) modules, and 720 user I/Os in a 1152-pin flip-chip fine-pitch BGA package. It supports LVDS, DDR, PCI-X, and HSTL I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and video processing applications.

For engineers reviewing the XC2V3000-4FFG1152C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O capability mapping, DCM timing parameters, SelectRAM memory configurations, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V3000-4FFG1152C implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with SRAM-based configuration, 1.5 V core supply (VCCINT), and dedicated 3.3 V auxiliary (VCCAUX) and I/O (VCCO) supplies. Its architecture integrates 96 DCMs for precise clock de-skew, frequency synthesis, and ±1/256-cycle phase shifting, plus 16 global clock multiplexer buffers.

It features 96 × 18-Kb dual-port Block SelectRAM modules (totaling 720 Kb RAM), 448 dedicated 18×18 multipliers, Digitally Controlled Impedance (DCI) for on-die termination across 19 single-ended and 6 differential I/O standards, and Active Interconnect routing with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2V3000-4FFG1152C uses a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high I/O count and signal integrity. Pin definitions follow Xilinx DS031 Module 4, with dedicated power, ground, configuration, JTAG, and user I/O balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V3000-4FFG1152C, XC2V4000-4FF952C offers higher gate count but demands board rework, while XC3S1600E-4FG484C reduces cost and power at the expense of clock management precision, memory bandwidth, and high-speed I/O capability.

Availability

XC2V3000-4FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and broadcast video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-4FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II family was designed for high-performance, high-density logic implementation in wireline/wireless infrastructure, where deterministic timing, mixed-signal I/O flexibility, and large embedded memory are critical.

FAQ

What is the maximum operating temperature range for XC2V3000-4FFG1152C?

The "C" suffix in XC2V3000-4FFG1152C denotes Commercial temperature grade, specifying operation from 0 °C to +85 °C junction temperature. This rating applies to the full device functionality including all 96 DCMs, 720 I/Os, and Block SelectRAM resources under specified VCCINT/VCCAUX/VCCO conditions per DS031 Module 3.

Does XC2V3000-4FFG1152C support PCI-X 133 MHz at 3.3 V?

Yes, XC2V3000-4FFG1152C supports PCI-X 133 MHz at 3.3 V as a native single-ended I/O standard per DS031 Module 1 and Module 2. It meets timing and drive strength requirements without external components when configured with appropriate VCCO and termination settings.

How many 18-Kb Block SelectRAM modules does XC2V3000-4FFG1152C contain?

XC2V3000-4FFG1152C contains 96 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. This yields 720 Kb total embedded memory, configurable in widths from 1 bit to 36 bits and depths from 512 to 16,384 words as documented in Table 3 of DS031 Module 1.

Is XC2V3000-4FFG1152C pin-compatible with other Virtex-II devices in FF1152 packaging?

No - while all FF1152-packaged Virtex-II devices share the same mechanical footprint and ball pitch, XC2V3000-4FFG1152C is not fully pin-compatible with XC2V4000-4FF1152C or XC2V6000-4FF1152C due to differing I/O bank assignments, power pin allocations, and configuration pin mappings per DS031 Table 6 and Module 4.

What configuration modes are supported by XC2V3000-4FFG1152C?

XC2V3000-4FFG1152C supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. All modes use the same dedicated configuration pins (CCLK, DIN/DOUT, PROG_B, INIT_B, DONE) and are selectable via mode pins M0–M2 per DS031 Module 1 Section "Configuration".