AMD XC2V3000-4FFG1152I

Overview

XC2V3000-4FFG1152I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 CLB slices, 96 DCMs, and 720 user I/Os in a 1152-pin flip-chip fine-pitch BGA (FFG1152) package. It delivers 420 MHz internal logic performance and supports 840 Mb/s LVDS I/O for telecom, networking, and video processing systems requiring deterministic clock management and embedded memory.

For engineers reviewing the XC2V3000-4FFG1152I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, and real-world deployment context for high-speed synchronous design validation.

Technical Context

The XC2V3000-4FFG1152I implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with dedicated 18×18-bit multipliers, 720 Kbits of block SelectRAM™ (dual-port 18 Kb RAM blocks), and distributed RAM resources. Its IOBs support DDR input/output registers per pin with independent clock enables and programmable drive strength (2–24 mA).

Each of its 96 Digital Clock Managers (DCMs) provides fully digital clock de-skew, frequency synthesis (M/D ratio), and phase shifting in 1/256-clock-period increments. Global clocking uses 16 multiplexer buffers with glitch-free switching between two clock sources, enabling robust multi-domain timing architectures.

Key Specifications

Pinout & Package

XC2V3000-4FFG1152I uses the FFG1152 flip-chip fine-pitch BGA package (1.00 mm pitch, 35×35 mm body, 1152 balls). This package supports 720 user I/Os plus dedicated configuration, clock, and power pins. Pin definitions are documented in DS031 Module 4 (Pinout Information), with I/O banks organized into 12 groups supporting independent VCCO voltages (1.5V–3.3V).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V4000-4FF957I and XC2V2000-4FF896I, the XC2V3000-4FFG1152I uniquely balances 3M gates, 720 I/Os, and 96 DCMs in a thermally efficient 35×35 mm flip-chip package - making it optimal for space-constrained, multi-interface industrial systems requiring guaranteed industrial-temperature operation.

Availability

XC2V3000-4FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial test equipment, broadcast video processing, and ruggedized PCIe bridging applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-4FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic manufacturer acquired by AMD in 2022, historically known for FPGA innovation, silicon architecture leadership, and comprehensive design tool ecosystems.

The Virtex-II family was engineered for high-performance, system-level integration in wireline/wireless infrastructure and video processing - delivering scalable logic density, deterministic clocking, and heterogeneous I/O to replace ASICs in evolving standards-based systems.

FAQ

What is the maximum operating temperature range for XC2V3000-4FFG1152I?

The XC2V3000-4FFG1152I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is guaranteed per DS031 Module 3 (DC and Switching Characteristics) and applies to all speed grades including the -4 grade. Thermal derating is required above 85°C ambient depending on airflow and PCB copper area.

Does XC2V3000-4FFG1152I support JTAG boundary scan for production testing?

Yes, XC2V3000-4FFG1152I fully supports IEEE 1149.1 boundary scan with dedicated TCK, TMS, TDI, and TDO pins. It implements EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect testing, in-system programming, and debug access without physical probes - critical for high-reliability manufacturing.

Can XC2V3000-4FFG1152I interface directly with DDR SDRAM without external level shifters?

Yes, XC2V3000-4FFG1152I supports SSTL-2 Class II and SSTL-3 Class II I/O standards natively. When configured with VCCO = 2.5 V (for DDR) or 3.3 V (for SDR), and using its built-in DDR input/output registers, it drives and receives DDR SDRAM signals directly - no external bus switches or level translators required.

How many 18 Kb block RAMs does XC2V3000-4FFG1152I contain?

XC2V3000-4FFG1152I contains 96 block SelectRAM™ modules, each providing 18 Kb of dual-port RAM. This totals 1,728 Kbits (216 Kbytes) of dedicated memory, configurable as 16K×1 to 512×36, with three independent read-during-write modes per port - essential for buffering high-throughput data streams.

Is XC2V3000-4FFG1152I compatible with Xilinx ISE 14.7 design tools?

No - XC2V3000-4FFG1152I requires Xilinx ISE Foundation or Alliance Series software versions 6.3 through 10.1. ISE 14.7 targets 7-series and later FPGAs. Legacy Virtex-II devices are unsupported in post-10.1 toolchains due to architecture-specific primitives and timing models not carried forward.