AMD XC2V3000-4FG676I

Overview

XC2V3000-4FG676I from Xilinx is a 3-million-system-gate Virtex-II platform FPGA in a 676-pin fine-pitch BGA (FG676) package, rated for industrial temperature range (–40°C to +100°C), with 484 user I/Os, 14,336 CLB slices, and 96 Digital Clock Manager (DCM) modules. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring DDR/LVDS interfaces and on-chip memory.

For engineers reviewing the XC2V3000-4FG676I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource allocation, and wire-bond BGA package constraints - all specific to the FG676 footprint and -4 speed grade.

Technical Context

The XC2V3000-4FG676I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, two storage elements (DFF/latch), carry chains, and horizontal cascade logic; block SelectRAM provides 18-Kb dual-port RAM configurable from 16K×1 to 512×36, paired with dedicated 18×18 multipliers for efficient MAC operations.

Key Specifications

Pinout & Package

XC2V3000-4FG676I uses a 27 mm × 27 mm fine-pitch ball grid array (FG676) with 1.00 mm pitch, wire-bond interconnect, and Pb-free FGG676 variant compatibility. The package supports 484 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, etc.).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V3000-4FG676I, the -5 speed grade offers tighter timing margins without layout change, while the XC2V4000-4FF957I expands I/O count and logic capacity at the cost of mechanical incompatibility - making the former a timing upgrade path and the latter a capacity upgrade path.

Availability

XC2V3000-4FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, broadcast video equipment, and industrial motion control applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and historically responsible for introducing the first commercial FPGA architecture.

The Virtex-II family was designed for high-performance, IP-centric system integration in wireline/wireless infrastructure and DSP-heavy applications, emphasizing clock management, memory hierarchy, and I/O flexibility over raw gate count.

FAQ

What is the maximum operating junction temperature for XC2V3000-4FG676I?

The XC2V3000-4FG676I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is validated under worst-case voltage (VCCINT = 1.5V ±3%, VCCAUX = 3.3V ±5%) and airflow conditions per DS031 Module 3. Thermal design must ensure case temperature remains ≤85°C at full static/dynamic power dissipation.

Does XC2V3000-4FG676I support JTAG boundary-scan testing?

Yes, XC2V3000-4FG676I fully complies with IEEE 1149.1 (JTAG) and supports EXTEST, INTEST, and HIGHZ instructions. The TCK/TMS/TDI/TDO pins implement a dedicated Test Access Port (TAP) controller, enabling board-level interconnect testing and in-system configuration without requiring external programming hardware.

Can XC2V3000-4FG676I interface directly with DDR SDRAM?

Yes, XC2V3000-4FG676I supports DDR SDRAM interfaces via its SelectIO-Ultra I/O banks using SSTL_2_I or SSTL_2_II standards. Each I/O pin includes dedicated DDR input/output registers clocked by DCM-generated phase-aligned clocks, enabling reliable 200 MHz data rates with on-die termination (DCI) for signal integrity.

What configuration modes are supported by XC2V3000-4FG676I?

XC2V3000-4FG676I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is performed through dedicated pins (CCLK, DIN/DOUT, PROG_B, DONE, M0–M2), with bitstream encryption optional via on-chip triple-DES decryption.

Is XC2V3000-4FG676I pin-compatible with other Virtex-II devices in FG676 packaging?

Yes, all Virtex-II devices offered in FG676/FGG676 packages - including XC2V1000, XC2V1500, XC2V2000, and XC2V3000 - share identical pinouts and footprint. This allows hardware reuse across density tiers, provided I/O banking constraints and VCCO assignments match the target device's resource map.