AMD XC2V3000-4FGG676C

Overview

XC2V3000-4FGG676C from Xilinx is a 3-million-system-gate Virtex-II platform FPGA in a 676-pin fine-pitch BGA (FGG676) package, operating at commercial temperature range (0°C to +85°C), with 484 user I/Os, 14,336 CLB slices, and 96 Digital Clock Manager (DCM) modules. It delivers high-speed logic, embedded memory, and dedicated arithmetic for telecom infrastructure, video processing, and high-bandwidth data acquisition systems.

For engineers reviewing the XC2V3000-4FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include its 1.5 V core voltage, support for LVDS/DDR/SSTL I/O standards, on-chip digitally controlled impedance (DCI), 18 × 18-bit multipliers, and dual-port 18-Kb Block SelectRAM resources - all critical for timing-critical, high-density programmable logic designs.

Technical Context

The XC2V3000-4FGG676C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support DDR input/output registers clocked by phase-opposed DCM outputs, enabling precise source-synchronous interfaces up to 840 Mb/s.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, carry chains, and horizontal cascading logic; each Block SelectRAM provides synchronous dual-port RAM configurable from 16K × 1 to 512 × 36 bits, with three read-during-write modes and direct association to a dedicated 18 × 18 multiplier block.

Key Specifications

Pinout & Package

XC2V3000-4FGG676C uses a 676-ball fine-pitch BGA (FGG676) package with 1.00 mm pitch, 27 mm × 27 mm body size, and Pb-free construction. Pin definitions follow Xilinx DS031 Module 4, with dedicated configuration pins (PROG_B, CCLK, DONE), JTAG TAP signals (TCK/TMS/TDI/TDO), and dual-purpose I/O banks grouped by VCCO supply domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-4FGG676C, the -5 speed grade offers tighter timing margins for aggressive clock rates, while the XC2V4000-4FF957C expands I/O and logic capacity at the cost of larger board area and flip-chip assembly complexity.

Availability

XC2V3000-4FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and high-speed data acquisition requiring stable component supply across extended production lifecycles.

Supply support for XC2V3000-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and known for FPGA, SoC, and adaptive compute solutions serving aerospace, communications, and industrial markets.

The Virtex-II family was designed for high-performance, high-density system-on-chip implementations using IP cores - targeting wireline/wireless infrastructure, video processing, and DSP-intensive applications where flexibility and performance exceed ASIC economics.

FAQ

What is the maximum operating frequency of the XC2V3000-4FGG676C core logic?

The XC2V3000-4FGG676C supports internal clock speeds up to 365 MHz for CLB logic under typical commercial conditions, as specified in DS031 Module 3. This value derives from the -4 speed grade characterization and assumes proper placement, routing, and DCM-based clock management. Actual achievable frequency depends on design topology, resource utilization, and PCB signal integrity - the XC2V3000-4FGG676C datasheet provides detailed timing parameters for setup/hold and propagation delays.

Does the XC2V3000-4FGG676C support JTAG boundary-scan testing?

Yes, the XC2V3000-4FGG676C fully complies with IEEE 1149.1 (JTAG) standards and includes dedicated TCK, TMS, TDI, and TDO pins for boundary-scan testing, configuration, and debug. The Test Access Port (TAP) supports EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect verification and in-system programming - all documented in DS031 Module 2 and Module 4 for the XC2V3000-4FGG676C device.

Can the XC2V3000-4FGG676C interface directly with DDR2 SDRAM?

No, the XC2V3000-4FGG676C does not natively support DDR2 SDRAM interfaces. It supports DDR SDRAM (single-data-rate DDR, not DDR2) and QDR SRAM through its SelectIO-Ultra I/O banks and dedicated memory controller IP. DDR2 requires stricter timing, on-die termination, and fly-by topology not addressed in the XC2V3000-4FGG676C architecture - interfacing would require external PHY or custom logic with careful timing closure, which is not recommended per Xilinx documentation for this device.

What power supply rails are required for the XC2V3000-4FGG676C?

The XC2V3000-4FGG676C requires three distinct supply rails: VCCINT = 1.5 V ±3% for core logic, VCCAUX = 3.3 V for configuration, JTAG, and DCM circuitry, and multiple VCCO rails (1.5 V, 1.8 V, 2.5 V, or 3.3 V) assigned per I/O bank depending on selected I/O standard. Each VCCO rail must be independently filtered and decoupled, as specified in the XC2V3000-4FGG676C power distribution guidelines in DS031 Module 3.

Is the XC2V3000-4FGG676C RoHS compliant?

Yes, the XC2V3000-4FGG676C is RoHS compliant and manufactured in Pb-free packaging, as indicated by the "G" in FGG676 (Pb-free fine-pitch BGA). Xilinx confirms RoHS compliance for all FGG-series packages per its Pb-Free Packaging program referenced in DS031 Module 1 - no lead content is used in solder balls or substrate materials for the XC2V3000-4FGG676C device.