AMD XC2V3000-4FGG676I

Overview

XC2V3000-4FGG676I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 configurable logic blocks (CLBs), 96 Digital Clock Manager (DCM) modules, and 516 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It supports LVDS, PCI-X, SSTL, HSTL, and DCI I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and DSP applications.

For engineers reviewing the XC2V3000-4FGG676I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O capability mapping, DCM timing parameters, SelectRAM memory configurations, and industrial-temperature (-40°C to +100°C) operational validation - all specific to the FGG676 wire-bond package and -4 speed grade.

Technical Context

The XC2V3000-4FGG676I implements Xilinx's IP-Immersion architecture with 96 independent DCM blocks enabling precise clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution). Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), carry chains, and horizontal cascading; block SelectRAM provides 18 Kb dual-port RAM (configurable from 16K×1 to 512×36), and dedicated 18×18 multipliers enable efficient read/multiply/accumulate operations for DSP filtering.

Key Specifications

Pinout & Package

XC2V3000-4FGG676I uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch, Pb-free wire-bond construction, and 516 user I/O pins. The package supports boundary-scan (IEEE 1149.1), configuration via SelectMAP or JTAG (IEEE 1532), and dedicated power/ground ball allocation for signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V3000-4FGG676I, the -5 speed grade offers tighter timing margins without altering logic or I/O allocation, while the XC2V4000-4FGG900I provides gate count headroom and I/O scalability at the cost of mechanical redesign - both alternatives retain identical DCM architecture, SelectRAM structure, and DCI functionality.

Availability

XC2V3000-4FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and avionics applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XC2V3000-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the Virtex family as the industry's first platform FPGA solution targeting high-performance system integration.

The Virtex-II product line was designed for high-speed, high-density logic implementation in telecommunications, wireless infrastructure, and DSP-intensive systems - emphasizing clock management, memory hierarchy, and I/O flexibility over raw gate count alone.

FAQ

What is the maximum operating frequency of the XC2V3000-4FGG676I core logic?

The XC2V3000-4FGG676I has a -4 speed grade specifying guaranteed internal clock performance up to 420 MHz under industrial temperature conditions. This value reflects worst-case timing across all CLBs and routing paths as validated in Xilinx DS031 Module 3. Actual achievable frequency depends on design topology, placement, and routing; the XC2V3000-4FGG676I DCM can generate higher-frequency clocks internally, but logic propagation must meet setup/hold constraints relative to the -4 grade.

Does the XC2V3000-4FGG676I support DDR SDRAM interfaces?

Yes, the XC2V3000-4FGG676I supports DDR SDRAM interfaces through dedicated DDR input and output registers in its IOBs, combined with DCM-generated 180° phase-shifted clocks. It complies with JEDEC-standard DDR timing and supports SSTL_2 and SSTL_3 I/O standards at 2.5 V and 3.3 V VCCO. The XC2V3000-4FGG676I also provides DCI termination for impedance matching on DDR buses.

How many block RAM resources does the XC2V3000-4FGG676I include?

The XC2V3000-4FGG676I includes 96 block SelectRAM modules, each providing 18 Kbits of dual-port RAM, for a total of 720 Kbits. These blocks are configurable from 16K×1 to 512×36 bits and support three read-during-write modes. Each block pairs with a dedicated 18×18 multiplier, enabling efficient DSP operations - a confirmed specification documented in Table 1 of DS031 Module 1 for the XC2V3000 device.

Is the XC2V3000-4FGG676I pin-compatible with other Virtex-II packages?

No - the XC2V3000-4FGG676I is only pin-compatible with other devices in the same FGG676 package family (e.g., XC2V2000-4FGG676I, XC2V1500-4FGG676I), as stated in Table 6 of DS031 Module 1. It is not compatible with FG456, BG575, or FF896 packages due to differing ball counts, pitch, and I/O allocation. Pin compatibility is strictly limited to identical FGG676 footprints across speed grades and temperature variants of the XC2V3000.

What configuration modes does the XC2V3000-4FGG676I support?

The XC2V3000-4FGG676I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). Configuration is controlled by M0–M2 pins and initiated by PROG_B. Bitstream encryption via Triple-DES is supported in all modes, and readback capability allows verification of both configuration memory and flip-flop states - all features explicitly confirmed for XC2V3000 in DS031 Module 2.