AMD XC2V3000-5BF957C

Overview

XC2V3000-5BF957C from Xilinx is a high-density, 3-million-system-gate Virtex-II platform FPGA in a 957-pin flip-chip BGA (BF957) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 14,336 CLB slices, 96 Digital Clock Managers (DCMs), 96 Block SelectRAM™ modules (720 Kbits total), and 448 dedicated 18×18 multipliers - enabling complex telecommunication baseband processing, high-speed video frame buffering, and PCI-X 133 MHz interface bridging.

For engineers reviewing the XC2V3000-5BF957C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, and validated alternative FPGAs for migration or second-sourcing - all grounded in DS031 (v3.5) November 2007 official documentation.

Technical Context

The XC2V3000-5BF957C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-data-rate (DDR) input/output paths using two phase-opposed clocks generated by integrated DCMs, enabling true 840 Mb/s LVDS signaling.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), carry chains, and horizontal cascading logic; each Block SelectRAM provides synchronous dual-port RAM (16K×1 to 512×36), while associated 18×18 multipliers enable efficient read-multiply-accumulate operations for DSP filtering.

Key Specifications

Pinout & Package

XC2V3000-5BF957C uses the BF957 flip-chip BGA package: 40 mm × 40 mm body, 1.27 mm pitch, 684 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC2V3000-5BF957C, the -4 variant trades performance for cost in stable environments, while the XC2V4000-5FF1152C extends gate count and I/O count at the expense of larger footprint and higher power - making the XC2V3000-5BF957C optimal for balanced high-performance, high-I/O density applications within its 40×40 mm constraint.

Availability

XC2V3000-5BF957C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video systems, and industrial automation requiring stable component supply across extended production lifecycles.

Supply support for XC2V3000-5BF957C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGAs and IP-centric platform architectures.

The Virtex-II family was designed for high-performance, system-level integration in wireline/wireless infrastructure, video processing, and high-speed computing - emphasizing clock management, memory hierarchy, and I/O flexibility over raw logic density alone.

FAQ

What is the maximum supported I/O standard voltage for XC2V3000-5BF957C?

The XC2V3000-5BF957C supports single-ended I/O standards at VCCO = 1.5V, 1.8V, 2.5V, and 3.3V, and differential standards including LVDS_25 (2.5V), LVDS_33 (3.3V), and LVPECL_33 (3.3V). It does not support 5V-tolerant I/O natively; external current-limiting resistors are required for 5V input interfacing, per DS031 Module 2.

Does XC2V3000-5BF957C support partial reconfiguration?

Yes, XC2V3000-5BF957C supports partial reconfiguration as documented in DS031 Module 1 and Module 2. This allows dynamic replacement of specific logic modules (e.g., communication protocol engines) without resetting the entire device - critical for uptime-sensitive telecom and defense applications.

How many Digital Clock Managers (DCMs) are available in XC2V3000-5BF957C?

XC2V3000-5BF957C contains 96 Digital Clock Managers (DCMs), as specified in Table 1 of DS031-1 (v3.5). Each DCM provides clock de-skew, multiplication/division (M/D ratio), and fine-grained phase shifting (1/256 cycle resolution) - enabling precise timing control across heterogeneous I/O interfaces.

What is the configuration method supported by XC2V3000-5BF957C?

XC2V3000-5BF957C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Fast SelectMAP mode enables configuration from external flash at up to 100 MHz, while boundary-scan allows in-system programming and verification.

Is XC2V3000-5BF957C RoHS compliant?

XC2V3000-5BF957C is not inherently Pb-free; however, Xilinx offered Pb-free variants (e.g., XC2V3000-6BGG728C) in BGG packages. The BF957 package used in XC2V3000-5BF957C was not listed in DS031's Pb-free package table, and no RoHS compliance statement appears in the referenced documentation.