AMD XC2V3000-5BF957I

Overview

XC2V3000-5BF957I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 CLB slices, 96 Block SelectRAM™ modules (720 Kbits total RAM), 448 dedicated 18×18 multipliers, and 12 Digital Clock Managers (DCMs). It features 720 user I/Os in a 957-pin flip-chip BGA (BF957) package and supports LVDS, SSTL, HSTL, PCI-X, and DDR I/O standards for telecom and high-speed interface applications.

For engineers reviewing the XC2V3000-5BF957I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, DCM timing parameters, CLB resource allocation, and industrial-temperature (-40°C to +100°C) operation - all critical for FPGA-based protocol bridging, DSP acceleration, and reconfigurable networking hardware design.

Technical Context

The XC2V3000-5BF957I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with SRAM-based configuration, 1.5 V core supply (VCCINT), and separate 3.3 V auxiliary (VCCAUX) and programmable I/O (VCCO) supplies. Its architecture integrates Configurable Logic Blocks (CLBs), dual-port 18-Kb Block SelectRAM™, dedicated 18×18 multipliers, and self-calibrating DCMs for clock de-skew, frequency synthesis, and fine-grained phase shifting (1/256 period resolution).

It supports Digitally Controlled Impedance (DCI) for on-die termination across LVDCI, SSTL_DCI, HSTL_DCI, and GTL/GTLP standards, and delivers up to 840 Mb/s differential signaling via LVDS, BLVDS, LDT, and LVPECL I/Os - all accessible through 720 user I/O pins in the BF957 flip-chip BGA package with 1.27 mm pitch.

Key Specifications

Pinout & Package

The XC2V3000-5BF957I is housed in a 957-ball flip-chip BGA (BF957) package with 1.27 mm pitch, 40 mm × 40 mm body size, and thermal-enhanced construction optimized for high I/O count and signal integrity in industrial environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC2V3000-4BF957I, the XC2V3000-5BF957I delivers guaranteed 420 MHz internal performance and 840 Mb/s I/O for demanding telecom interfaces; versus XC2V4000-5FF1152I, it offers identical speed grade but smaller footprint and lower power, making it optimal for space-constrained industrial FPGA applications requiring 3M gate capacity.

Availability

XC2V3000-5BF957I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, high-speed protocol bridging, and reconfigurable security appliance development requiring stable component supply across extended temperature ranges.

Supply support for XC2V3000-5BF957I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design toolchains for high-performance digital systems.

The Virtex-II family was engineered for high-bandwidth, low-latency reconfigurable computing in telecom, wireless infrastructure, and video processing - delivering scalable logic density, hardened I/O, and deterministic clock management before the advent of modern SoC-FPGAs.

FAQ

What is the maximum operating junction temperature for XC2V3000-5BF957I?

The XC2V3000-5BF957I is rated for industrial temperature range operation with a maximum junction temperature of +100°C. This specification is validated under continuous operation with proper thermal management, including adequate PCB copper pour and airflow, and aligns with its "I" suffix designation per Xilinx DS031-1 (v3.5) Module 1.

Does XC2V3000-5BF957I support IEEE 1532 boundary-scan configuration?

Yes, XC2V3000-5BF957I supports IEEE 1532-compliant boundary-scan configuration via its JTAG TAP controller. The device implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions, enabling in-system programming and verification without requiring external configuration PROMs.

How many 18-Kb Block SelectRAM™ modules does XC2V3000-5BF957I contain?

XC2V3000-5BF957I contains 96 Block SelectRAM™ modules, each providing 18 Kbits of dual-port RAM. This yields 720 Kbits total on-chip memory, configurable in widths from 1 to 36 bits and depths from 512 to 16K words - confirmed in Table 1 of DS031-1 (v3.5) Module 1.

Can XC2V3000-5BF957I perform true DDR I/O without external logic?

Yes, XC2V3000-5BF957I supports native DDR I/O using dual registers per IOB path - one clocked on the rising edge and one on the falling edge of complementary clocks generated by its DCMs. This enables single-cycle DDR capture and launch without external DDR PHYs or glue logic.

Is XC2V3000-5BF957I compatible with 5V-tolerant I/O standards?

No, XC2V3000-5BF957I is not 5V-tolerant. Its IOBs are designed for 1.5V, 1.8V, 2.5V, and 3.3V I/O standards only. As an input, it can interface with 5V signals only when external current-limiting resistors are used; as an output, it cannot drive 5V logic levels directly - per DS031-2 (v3.5) Module 2 Section "5V Tolerant I/Os".