AMD XC2V3000-5FF1152I

Overview

XC2V3000-5FF1152I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 CLB slices, 96 DCMs, and 720 user I/Os in a 1152-pin flip-chip fine-pitch BGA package. It supports LVDS, DDR, PCI-X, and HSTL I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and DSP applications.

For engineers reviewing the XC2V3000-5FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include its 1.5 V core voltage, dual-port 18-Kb Block SelectRAM resources (720 Kbits total), 448 dedicated 18×18 multipliers, digitally controlled impedance (DCI) I/O termination, and support for partial reconfiguration and bitstream encryption.

Technical Context

The XC2V3000-5FF1152I implements Xilinx's IP-Immersion architecture with a segmented Active Interconnect routing matrix, enabling predictable timing independent of fanout. Its 96 Digital Clock Manager (DCM) modules provide precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution).

Each IOB supports single- or double-data-rate (DDR) registers with independent clock inputs, and all 720 user I/Os are configurable across 19 single-ended and 6 differential standards-including LVDS, LVPECL, and SSTL-with on-die DCI termination for HSTL, SSTL, and LVCMOS families.

Key Specifications

Pinout & Package

XC2V3000-5FF1152I uses a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction. Pin definitions follow Xilinx DS031 Module 4, with 720 user I/Os plus dedicated configuration, clock, and supply pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V3000-4FF1152I, the XC2V3000-5FF1152I delivers higher clock frequency headroom for demanding signal processing; compared with XC2V4000-5FF1152I, it offers identical packaging and I/O compatibility but at lower cost and power for mid-scale implementations.

Availability

XC2V3000-5FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and defense electronics requiring stable component supply across extended lifecycle programs.

Supply support for XC2V3000-5FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneer in programmable logic technology and was acquired by AMD in 2022. It develops FPGA, SoC, and adaptive compute platforms for high-performance digital systems.

The Virtex-II family was designed for high-speed, high-density logic implementation in telecommunications, networking, and DSP applications-emphasizing I/O flexibility, clock management, and embedded memory/multiplier resources.

FAQ

What is the maximum operating junction temperature for XC2V3000-5FF1152I?

The XC2V3000-5FF1152I is rated for industrial temperature range: –40°C to +100°C junction temperature. This specification is guaranteed across all speed grades and I/O configurations per DS031 Module 3. The "I" suffix explicitly denotes industrial qualification, and thermal design must ensure sustained operation within this limit using appropriate heatsinking and airflow.

Does XC2V3000-5FF1152I support JTAG boundary-scan testing?

Yes, XC2V3000-5FF1152I fully supports IEEE 1149.1 boundary-scan with dedicated TCK, TDI, TDO, and TMS pins. It implements BYPASS, SAMPLE, EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect testing and in-system programming. The Test Access Port (TAP) controller operates independently of configuration state, allowing test access even during active logic operation.

Can XC2V3000-5FF1152I be configured via SPI flash memory?

No, XC2V3000-5FF1152I does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 boundary-scan modes only. External SPI flash must be interfaced through user logic (e.g., MicroBlaze soft-core) or an external microcontroller that drives the configuration interface-Xilinx does not provide hardware-level SPI boot support for Virtex-II devices.

What is the purpose of the VBATT pin on XC2V3000-5FF1152I?

The VBATT pin on XC2V3000-5FF1152I supplies backup power to retain configuration data in the internal configuration memory during main power loss. It is optional and typically connected to a coin-cell battery or supercapacitor. When active, VBATT maintains SRAM cell states, enabling fast resume after power interruption-though full reconfiguration is still required upon main power restoration.

Is XC2V3000-5FF1152I RoHS compliant?

Yes, XC2V3000-5FF1152I is RoHS compliant and lead-free. Xilinx offered Pb-free versions of Virtex-II devices under the "BG" and "BGG" package designators, and FF1152 packages were manufactured with lead-free solder spheres. Compliance documentation (including material declarations and test reports) is available via Xilinx's archived product pages and third-party distributor certifications.