AMD XC2V3000-5FFG1152C

Overview

XC2V3000-5FFG1152C from Xilinx is a high-density, flip-chip fine-pitch BGA FPGA with 3 million system gates, 14,336 CLB slices, 96 Digital Clock Manager (DCM) modules, and 720 user I/Os in the FF1152 package. It operates at -5 speed grade (max internal clock 420 MHz) and supports LVDS, DDR, PCI-X, and SSTL I/O standards for telecom, networking, and video processing systems.

For engineers reviewing the XC2V3000-5FFG1152C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability mapping, DCM timing parameters, SelectRAM memory configuration support, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V3000-5FFG1152C implements Xilinx's Virtex-II IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, 1.5 V core supply (VCCINT), and dedicated 3.3 V auxiliary (VCCAUX) and I/O (VCCO) supplies. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, HSTL, SSTL) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) enabling on-chip termination. The device integrates 96 DCMs for precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution).

Key Specifications

Pinout & Package

XC2V3000-5FFG1152C is housed in a 1152-ball Flip-Chip Fine-Pitch BGA (FF1152) package with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced flip-chip interconnect delivering high I/O density and improved thermal dissipation over wire-bond alternatives.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-5FFG1152C, XC2V4000-5FF1152C offers scalable logic headroom within identical mechanical and thermal constraints, while XC3S1500-4FG456C represents a cost-optimized, lower-performance alternative with reduced I/O count and simplified clock architecture.

Availability

XC2V3000-5FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, and broadcast video applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-5FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, specializing in FPGA, SoC, and adaptive compute acceleration platforms for high-performance digital systems.

The Virtex-II family, including XC2V3000-5FFG1152C, was engineered for high-speed, high-density applications in telecommunications, networking, and video processing-emphasizing I/O flexibility, clock precision, and embedded memory scalability.

FAQ

What is the maximum operating frequency of the XC2V3000-5FFG1152C?

The XC2V3000-5FFG1152C has a -5 speed grade, guaranteeing up to 420 MHz internal clock performance under commercial temperature conditions (0°C to +85°C). This rating is validated across all CLB paths and applies to both registered and combinational logic, assuming proper timing closure and DCM-based clock distribution. Actual system frequency depends on design complexity and placement-routing quality.

Does the XC2V3000-5FFG1152C support DDR memory interfaces?

Yes, the XC2V3000-5FFG1152C supports DDR SDRAM interfaces through dedicated DDR input and output registers in its IOBs, along with DCM-controlled phase alignment and source-synchronous timing guidelines. It complies with JEDEC DDR specifications and supports data rates up to 200 MHz clock frequency (400 Mb/s per pin) with appropriate PCB layout and termination.

How many block RAM resources does the XC2V3000-5FFG1152C provide?

The XC2V3000-5FFG1152C integrates 96 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. This yields a total of 1.728 Mb of embedded memory, configurable from 512 × 36 bits to 16K × 1 bit, with full support for read-during-write operations and cascading for larger memory structures.

Is the XC2V3000-5FFG1152C pin-compatible with other Virtex-II devices in the FF1152 package?

Yes, all Virtex-II devices offered in the FF1152 package-including XC2V2000, XC2V3000, XC2V4000, XC2V6000, and XC2V8000-are footprint-compatible. This allows scalable design reuse: a board designed for XC2V3000-5FFG1152C can accommodate higher-density variants without layout changes, provided power delivery and thermal management meet the target device's requirements.

What configuration modes does the XC2V3000-5FFG1152C support?

The XC2V3000-5FFG1152C supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Configuration is initiated via PROG_B, controlled by M0–M2 mode pins, and clocked by CCLK. Bitstream encryption using Triple-DES is supported for secure deployment.