AMD XC2V3000-5FFG1152I

Overview

XC2V3000-5FFG1152I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 CLB slices, 96 DCMs, 720 user I/Os in FF1152 flip-chip BGA package, and 1.5 V core voltage - deployed in telecom line cards requiring high-speed DDR memory interfaces and LVDS serial links.

For engineers reviewing the XC2V3000-5FFG1152I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, and real-world FPGA deployment context for signal integrity-critical designs.

Technical Context

The XC2V3000-5FFG1152I implements a segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and glitch-free global clock MUX buffers - enabling predictable timing closure independent of fanout. Its IOBs integrate dual DDR registers per path with 180° phase-shifted clocks generated by on-chip DCMs.

Each CLB contains four slices with dual 4-LUTs, two storage elements, carry chains, and horizontal cascade logic; block SelectRAM provides 18 Kb dual-port RAM configurable from 16K×1 to 512×36, paired with dedicated 18×18 multipliers for DSP-intensive tasks.

Key Specifications

Pinout & Package

XC2V3000-5FFG1152I uses the FF1152 flip-chip fine-pitch BGA package (1.00 mm pitch, 35 mm × 35 mm body), offering 720 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-5FFG1152I, the XC7VX690T offers higher logic density and modern transceiver integration but fewer dedicated DCMs; the XCVU3P delivers superior serial bandwidth and AI acceleration yet requires complete board redesign and toolchain migration.

Availability

XC2V3000-5FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, high-speed data acquisition, and broadcast video processing requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-5FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions with industry-leading FPGA architectures, process technology partnerships, and integrated development tools.

The Virtex-II family was engineered for high-performance, system-level integration in wireline/wireless infrastructure - delivering scalable logic density, advanced clock management, and multi-standard I/O to replace ASICs in time-to-market-sensitive applications.

FAQ

What is the maximum operating junction temperature for XC2V3000-5FFG1152I?

The XC2V3000-5FFG1152I is rated for industrial temperature range (–40°C to +100°C) as indicated by the "I" suffix. Its maximum allowable junction temperature is +100°C under steady-state thermal conditions with proper PCB heat sinking and airflow per Xilinx Thermal Management Guidelines UG075.

Does XC2V3000-5FFG1152I support 5V-tolerant I/Os?

No, XC2V3000-5FFG1152I does not support native 5V-tolerant I/Os. All IOBs require VCCO matching the selected I/O standard (e.g., 3.3 V for LVTTL), and inputs are not 5V tolerant without external current-limiting resistors. Refer to Xilinx Tech Topic "5V Tolerant I/Os" for safe interfacing methods.

How many global clock networks are available in XC2V3000-5FFG1152I?

The XC2V3000-5FFG1152I provides 16 global clock multiplexer buffers, with eight per quadrant. Each buffer selects between two clock inputs and switches glitch-free between them. Up to four buffers can be driven by each of the 96 DCM modules for hierarchical clock distribution.

Can XC2V3000-5FFG1152I perform partial reconfiguration?

Yes, XC2V3000-5FFG1152I supports partial reconfiguration through its SRAM-based configuration architecture and dedicated ICAP (Internal Configuration Access Port). This allows dynamic logic module swapping without resetting the entire device - critical for adaptive radio or runtime protocol switching.

What configuration modes does XC2V3000-5FFG1152I support?

XC2V3000-5FFG1152I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at power-up, and configuration bitstreams may be encrypted using on-chip Triple-DES.