AMD XC2V3000-5FG676I

Overview

XC2V3000-5FG676I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 configurable logic blocks (CLBs), 96 Digital Clock Managers (DCMs), and 516 user I/Os in a 676-pin Fine-Pitch BGA (FG676) package. It supports LVDS, DDR, PCI-X, and SSTL I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and video processing applications.

For engineers reviewing the XC2V3000-5FG676I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support, DCM timing parameters, DCI termination capability, and industrial temperature range (-40°C to +100°C) operation - all critical for high-reliability embedded FPGA integration.

Technical Context

The XC2V3000-5FG676I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with SRAM-based configuration, 1.5V core supply (VCCINT), and dual 3.3V supplies (VCCAUX and VCCO). Its architecture integrates 96 DCMs for precise clock de-skew, frequency synthesis, and ±1/256-period phase shifting, plus 18 Kb Block SelectRAM modules supporting dual-port configurations from 16K×1 to 512×36 bits.

It features Digitally Controlled Impedance (DCI) for on-chip series or split termination across 19 single-ended and 6 differential I/O standards, including LVDS_25_DCI, HSTL_I_DCI, and SSTL3_II_DCI. Routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2V3000-5FG676I uses the FG676 fine-pitch ball grid array package (1.00 mm pitch, 27 mm × 27 mm body), wire-bond construction, with 676 solder balls arranged in a 27×27 array. The package supports 516 user I/Os plus dedicated configuration, clock, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-5FG676I, the -4 variant trades performance for lower power and cost in thermally limited deployments, while the XC2V4000-5FF896I offers scalable logic and I/O headroom at the expense of package compatibility and increased thermal management complexity.

Availability

XC2V3000-5FG676I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial video acquisition, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-5FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute solutions targeting high-performance digital systems.

The Virtex-II family was designed for high-speed, high-density applications in telecommunications, networking, and video processing - delivering platform-level integration of logic, memory, DSP, and clock management in a single device.

FAQ

What is the maximum operating junction temperature for XC2V3000-5FG676I?

The XC2V3000-5FG676I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is validated per Xilinx DS031-3 (v3.5) switching characteristics and applies under specified VCCINT = 1.5V ±3%, VCCAUX = 3.3V ±5%, and appropriate thermal management per package thermal resistance values.

Does XC2V3000-5FG676I support DDR2 SDRAM interfaces?

XC2V3000-5FG676I supports DDR SDRAM interfaces through its SelectIO-Ultra I/O banks and built-in DDR input/output registers, but does not natively support DDR2-specific timing or command encoding. DDR2 implementation requires external logic or soft-core controllers, as DDR2 was introduced after the Virtex-II generation and is not covered in DS031 documentation.

How many 18-Kb Block SelectRAM modules does XC2V3000-5FG676I contain?

XC2V3000-5FG676I contains 96 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. This yields a total of 720 Kbits of dedicated block memory, configurable in widths from 16K×1 to 512×36 bits, as confirmed in Table 1 of DS031-1 (v3.5).

Is XC2V3000-5FG676I pin-compatible with other Virtex-II devices in FG676 packaging?

Yes - all Virtex-II devices offered in the FG676/FGG676 package are pinout compatible per Table 6 of DS031-1 (v3.5), meaning XC2V3000-5FG676I shares identical footprint, power pin locations, and I/O bank assignments with XC2V1000-5FG676I, XC2V1500-5FG676I, and XC2V2000-5FG676I, enabling scalable logic density within the same PCB layout.

What configuration modes are supported by XC2V3000-5FG676I?

XC2V3000-5FG676I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. These are selected via M0–M2 pins at power-up and documented in the Configuration section of DS031-2 (v3.5), enabling flexible integration with microcontrollers, flash memory, or JTAG programmers.