AMD XC2V3000-5FGG676C

Overview

XC2V3000-5FGG676C from Xilinx is a 3-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, operating at commercial temperature range (0°C to +85°C) with -5 speed grade. It integrates 14,336 CLB slices, 96 DCMs, 720 user I/Os, and supports LVDS, DDR, PCI-X, and SSTL I/O standards for high-speed interface design.

For engineers reviewing the XC2V3000-5FGG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability mapping, clock management specs, memory resource allocation, and real-world deployment context for telecom, video processing, and embedded DSP systems.

Technical Context

The XC2V3000-5FGG676C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and glitch-free global clock MUX buffers driving up to eight clock nets per quadrant. Its IOBs support dual-data-rate (DDR) input/output paths with independent rising/falling-edge registers clocked by 180° phase-shifted DCM outputs.

Each CLB contains four slices with dual 4-input LUTs, two storage elements (DFF/latch), fast carry chains, and horizontal cascade logic; block SelectRAM provides 18-Kb dual-port RAM configurable from 16K×1 to 512×36, while dedicated 18×18 multipliers enable efficient read-multiply-accumulate operations.

Key Specifications

Pinout & Package

XC2V3000-5FGG676C uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch, Pb-free construction, and wire-bond interconnect. The package supports 516 user I/Os plus 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-5FGG676C, XC2V4000-5FF957C offers higher I/O count and logic capacity but demands redesign for flip-chip packaging and increased power delivery; XC3S1600E-4FG456C reduces cost and complexity but sacrifices DCM precision, DCI, and security-making it unsuitable for high-integrity telecom or video infrastructure.

Availability

XC2V3000-5FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial motion controllers, and network packet processors requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms.

The Virtex-II family was designed for high-performance, system-level integration in bandwidth-intensive applications-including wireless base stations, video codecs, and high-speed networking-leveraging SRAM-based reconfigurability and hardened I/O subsystems.

FAQ

What is the maximum operating frequency of the XC2V3000-5FGG676C internal logic?

The XC2V3000-5FGG676C has a -5 speed grade, meaning its internal CLB logic is characterized for 420 MHz operation under typical conditions. This value reflects worst-case timing closure for combinational paths within CLBs-not guaranteed for all user designs but validated across process/voltage/temperature corners in Xilinx DS031.

Does the XC2V3000-5FGG676C support JTAG boundary-scan testing?

Yes, the XC2V3000-5FGG676C fully complies with IEEE 1149.1 and supports EXTEST, INTEST, and HIGHZ boundary-scan instructions via its dedicated TCK/TMS/TDI/TDO pins. This enables board-level interconnect testing, in-system programming, and real-time debug access without requiring additional test fixtures.

Can the XC2V3000-5FGG676C interface directly with DDR2 SDRAM?

No-the XC2V3000-5FGG676C supports DDR SDRAM (not DDR2) through its SelectIO-Ultra I/O banks with SSTL-2 Class I/II standards and built-in DDR registers. DDR2 requires stricter timing margins and on-die termination not present in Virtex-II; interfacing would require external termination and careful PCB layout to meet setup/hold windows.

What power supplies are required for the XC2V3000-5FGG676C?

The XC2V3000-5FGG676C requires three independent supplies: VCCINT = 1.5 V ±3% for core logic, VCCAUX = 3.3 V ±5% for auxiliary circuits (DCMs, JTAG, configuration), and VCCO = 1.5/1.8/2.5/3.3 V (per bank) for I/O signaling-each bank configurable independently to match connected peripherals.

Is partial reconfiguration supported on the XC2V3000-5FGG676C?

Yes, the XC2V3000-5FGG676C supports partial reconfiguration via its SelectMAP interface and dedicated configuration logic. Users can dynamically reload specific regions of the configuration memory while keeping other logic operational-enabling runtime adaptation in software-defined radio, protocol gateways, and fault-tolerant control systems.