AMD XC2V3000-5FGG676I

Overview

XC2V3000-5FGG676I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 3 million system gates, 14,336 CLB slices, 96 Digital Clock Manager (DCM) modules, and 516 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It supports LVDS, DDR, PCI-X, and SSTL I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and video processing applications.

For engineers reviewing the XC2V3000-5FGG676I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O capability mapping, DCM timing parameters, SelectRAM memory configuration options, and industrial-temperature (-40°C to +100°C) operation context essential for high-reliability embedded FPGA design.

Technical Context

The XC2V3000-5FGG676I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with SRAM-based configuration, 1.5V core (VCCINT), 3.3V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates Configurable Logic Blocks (CLBs), 18-Kb dual-port Block SelectRAM, 18×18 multipliers, and Digitally Controlled Impedance (DCI) I/O for on-chip termination.

It features 96 independent DCM modules supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution), plus 16 global clock multiplexer buffers. Routing uses Active Interconnect Technology with predictable delay independent of fanout, and supports boundary-scan (IEEE 1149.1/1532) and Triple-DES bitstream encryption.

Key Specifications

Pinout & Package

XC2V3000-5FGG676I uses a 676-ball Fine-Pitch BGA (FGG676) package with 1.00 mm pitch, Pb-free construction, and wire-bond interconnect. The package supports 516 user I/Os distributed across four quadrants, plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V3000-4FGG676I, the XC2V3000-5FGG676I delivers tighter setup/hold timing margins for high-speed interfaces; compared with XC2V4000-5FF957I, it offers identical speed grade and temperature range but in a lower-cost wire-bond package with fewer I/Os and reduced gate count - making it optimal for mature, volume-optimized industrial FPGA deployments.

Availability

XC2V3000-5FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, PCI-X controller design, and automated test equipment requiring stable component supply across extended lifecycle programs.

Supply support for XC2V3000-5FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was designed for high-bandwidth, low-latency applications in telecommunications, networking, and video processing - delivering scalable logic density, integrated memory, and advanced clock management in a single programmable platform.

FAQ

What is the operating temperature range for XC2V3000-5FGG676I?

The XC2V3000-5FGG676I is rated for industrial temperature operation from –40°C to +100°C (junction temperature), as confirmed in DS031 Module 1 ordering conventions and Module 3 DC characteristics. This specification applies to the full device functionality including CLBs, DCMs, SelectRAM, and I/O banks when powered within recommended voltage ranges (VCCINT = 1.5V ±3%, VCCAUX = 3.3V ±5%, VCCO = 1.5V/1.8V/2.5V/3.3V).

Does XC2V3000-5FGG676I support DDR memory interfaces?

Yes, XC2V3000-5FGG676I supports DDR memory interfaces through dedicated input and output registers in its IOBs, enabling double-data-rate capture and launch. It natively supports DDR SDRAM and DDR SRAM protocols via programmable I/O standards including SSTL2_I/II and SSTL3_I/II, with timing parameters documented in DS031 Module 3 for -5 speed grade.

How many Block SelectRAM resources does XC2V3000-5FGG676I include?

XC2V3000-5FGG676I includes 96 Block SelectRAM modules, each providing 18 Kb of dual-port RAM, totaling 720 Kbits. These blocks are configurable from 16K×1 to 512×36, support three read-during-write modes, and can be cascaded to implement larger memory structures - all detailed in DS031 Module 2 functional description.

Is XC2V3000-5FGG676I pin-compatible with other Virtex-II devices in the FGG676 package?

Yes, all Virtex-II devices in the FGG676 package - including XC2V1500, XC2V2000, and XC2V3000 - share identical pinouts and footprint compatibility per DS031 Table 6. This allows migration between densities without PCB redesign, though I/O bank voltage assignments and configuration pin usage must be verified per device-specific resource allocation.

What configuration modes are supported by XC2V3000-5FGG676I?

XC2V3000-5FGG676I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). Configuration is SRAM-based and reprogrammable; optional Triple-DES encryption secures bitstreams, and readback capability enables verification and debugging of both configuration memory and internal state.