AMD XC2V3000-6FFG1152C

Overview

XC2V3000-6FFG1152C from Xilinx is a high-density, flip-chip fine-pitch BGA FPGA with 3 million system gates, 14,336 CLB slices, 96 DCMs, and 720 user I/Os. It operates at commercial temperature range (0°C to +85°C), supports LVDS, DDR, PCI-X, and SSTL interfaces, and targets high-speed telecom and DSP systems requiring embedded memory and arithmetic acceleration.

For engineers reviewing the XC2V3000-6FFG1152C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, clock management specs, package mapping to FF1152, and real-world FPGA integration considerations for signal integrity, thermal design, and configuration security.

Technical Context

The XC2V3000-6FFG1152C implements the Virtex-II platform architecture with 64×56 CLB array, 96 dedicated 18-bit × 18-bit multipliers, and 120 dual-port 18-Kb Block SelectRAM modules totaling 720 Kbits RAM. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

It integrates 96 Digital Clock Managers (DCMs) supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution), plus 16 global clock MUX buffers. I/O subsystem includes Digitally Controlled Impedance (DCI) for on-chip termination across 19 single-ended and 6 differential standards including LVDS, LVPECL, and SSTL.

Key Specifications

Pinout & Package

XC2V3000-6FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) package with 1.00 mm ball pitch and 35 mm × 35 mm body size. The package supports 720 user I/Os plus dedicated configuration, clock, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-5FFG1152C and XC2V4000-6FFG1152C, the XC2V3000-6FFG1152C delivers optimal balance of performance, I/O count, and power efficiency for mid-tier telecom and instrumentation applications - offering guaranteed 420 MHz operation without the cost or thermal overhead of the 4M-gate variant.

Availability

XC2V3000-6FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply across extended production lifecycles.

Supply support for XC2V3000-6FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022. It developed the first commercial FPGA and continues to lead in adaptive computing architectures.

The Virtex-II family, including XC2V3000-6FFG1152C, was engineered for high-performance signal processing, networking, and embedded computing - delivering scalable logic density, hardened I/O, and clock management for systems demanding both flexibility and deterministic timing.

FAQ

What is the maximum operating junction temperature for XC2V3000-6FFG1152C?

The XC2V3000-6FFG1152C is rated for commercial temperature range (0°C to +85°C) at the junction. Its flip-chip FF1152 package provides enhanced thermal conductivity versus wire-bond variants, supporting sustained operation at 85°C ambient with appropriate PCB copper pour and airflow. Thermal design must maintain T_j ≤ 85°C under worst-case logic utilization and I/O switching activity, as specified in DS031 Module 3.

Does XC2V3000-6FFG1152C support partial reconfiguration?

Yes, XC2V3000-6FFG1152C supports partial reconfiguration as documented in the Virtex-II Functional Description (DS031-2). This capability allows dynamic modification of specific logic regions without resetting the entire device, enabling adaptive systems such as software-defined radios and real-time protocol translators. Implementation requires Xilinx ISE tools with Partial Reconfiguration license and careful floorplanning of modular design partitions.

What configuration modes are supported by XC2V3000-6FFG1152C?

XC2V3000-6FFG1152C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Master modes use internal oscillator for clock generation; SelectMAP enables high-speed parallel configuration via microprocessor bus. All modes are accessible through dedicated pins (CCLK, DIN, PROG_B, etc.) and are detailed in DS031 Module 1 Section "Configuration".

Can XC2V3000-6FFG1152C interface directly with 5V TTL devices?

No, XC2V3000-6FFG1152C I/Os are not 5V-tolerant. Its VCCO rails support only 1.5V, 1.8V, 2.5V, and 3.3V standards. Direct connection to 5V TTL may damage the device. For interfacing, use level-shifting buffers (e.g., TXB0108) or external current-limiting resistors with clamping diodes - though the latter requires careful validation per Xilinx Tech Topic "5V Tolerant I/Os".

Is bitstream encryption available on XC2V3000-6FFG1152C?

Yes, XC2V3000-6FFG1152C includes on-chip Triple-DES (3DES) bitstream encryption as a standard feature. It supports one or two encrypted key sets stored in non-volatile memory, preventing unauthorized readback or cloning of configuration data. Encryption is enabled during bitstream generation in Xilinx ISE and requires proper key management and secure programming workflows to maintain IP protection integrity.