AMD XC2V3000-6FGG676C

Overview

XC2V3000-6FGG676C from Xilinx is a high-density Virtex-II platform FPGA with 3 million system gates, 14,336 configurable logic blocks (CLBs), 96 Digital Clock Managers (DCMs), and 516 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It operates at commercial temperature range (0°C to +85°C) with -6 speed grade, supporting high-speed interfaces including LVDS, PCI-X, DDR SDRAM, and QDR SRAM for telecom and networking systems.

For engineers reviewing the XC2V3000-6FGG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (including DCI-enabled LVCMOS/LVDS/HSTL/SSTL), DCM timing parameters, CLB resource mapping, and real-world deployment context for FPGA-based signal processing and protocol bridging designs.

Technical Context

The XC2V3000-6FGG676C implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core supply (VCCINT), 3.3 V auxiliary supply (VCCAUX), and programmable I/O voltage (VCCO) per bank. Its architecture integrates 96 DCMs for precise clock de-skew, frequency synthesis, and ±1/256-cycle phase shifting - enabling deterministic timing closure in multi-clock domain systems.

Each of its 14,336 CLBs contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascading logic. The device includes 96 × 18-Kb Block SelectRAM modules (total 1.728 Mb dual-port RAM), 448 dedicated 18×18 multipliers, and Digitally Controlled Impedance (DCI) for on-die series/split termination across 19 single-ended and 6 differential I/O standards.

Key Specifications

Pinout & Package

XC2V3000-6FGG676C uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch, Pb-free construction, and wire-bond interconnect. The package supports 516 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-6FGG676C, XCV500E-8FGG256C offers reduced gate count and I/O but simpler clocking, while XC3S1500-4FGG456C trades DCM accuracy and DCI for lower cost and power - making both unsuitable as drop-in replacements but viable for scaled-down implementations where XC2V3000-6FGG676C's full feature set is unused.

Availability

XC2V3000-6FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and industrial machine vision requiring stable component supply across extended product lifecycles.

Supply support for XC2V3000-6FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the first commercial FPGA and continues to lead in adaptive computing architectures.

The Virtex-II family was designed for high-performance, high-density applications demanding advanced clock management, memory-rich logic fabric, and multi-standard I/O - targeting telecom, aerospace, and scientific instrumentation markets.

FAQ

What is the maximum operating frequency of the XC2V3000-6FGG676C core logic?

The XC2V3000-6FGG676C has a -6 speed grade, meaning its internal logic can operate up to 420 MHz under typical conditions as specified in DS031 Module 3. This rating applies to CLB-to-CLB paths with proper placement and routing; actual performance depends on design topology, temperature, and voltage margins. The XC2V3000-6FGG676C achieves this via its 0.15 µm/0.12 µm process and optimized carry chain architecture.

Does the XC2V3000-6FGG676C support JTAG boundary-scan testing?

Yes, the XC2V3000-6FGG676C fully complies with IEEE 1149.1 (JTAG) and supports BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions. Its Test Access Port (TAP) enables in-system programming, interconnect testing, and real-time debug via the TCK/TDI/TDO/TMS pins - a core capability confirmed in DS031 Module 1 and Module 2.

Can the XC2V3000-6FGG676C interface directly with DDR2 SDRAM?

Yes, the XC2V3000-6FGG676C supports DDR SDRAM interfaces through its SelectIO-Ultra I/O banks with built-in DDR input/output registers and programmable drive strength. When configured with SSTL-2 I/O standard and appropriate VCCO = 2.5 V, it meets JEDEC timing requirements for 200–400 Mb/s data rates - as validated in DS031 Module 2 and Application Note XAPP466.

What power supplies are required for the XC2V3000-6FGG676C?

The XC2V3000-6FGG676C requires three dedicated supplies: 1.5 V ±3% for core logic (VCCINT), 3.3 V ±5% for auxiliary circuitry (VCCAUX), and programmable 1.5–3.3 V per I/O bank (VCCO). These are specified in DS031 Module 3 and must be independently regulated; failure to meet VCCINT tolerance risks configuration corruption or timing violation in the XC2V3000-6FGG676C.

Is bitstream encryption supported on the XC2V3000-6FGG676C?

Yes, the XC2V3000-6FGG676C includes an on-chip Triple-DES decryptor for secure configuration. It supports one or two encrypted key sets to protect intellectual property in the bitstream - a feature documented in DS031 Module 1 and enabled via Xilinx ISE tools. This ensures the XC2V3000-6FGG676C remains tamper-resistant during field deployment.