AMD XC2V4000-4BF957I
- Part No.:
- XC2V4000-4BF957I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 957-BBGA, FCBGA
- Datasheet:
-
XC2V4000-4BF957I.pdf
- Description:
- IC FPGA 684 I/O 957FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2V4000-4BF957I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 4 million system gates, 23,040 CLBs, 120 Block SelectRAM™ modules (912 Kbits total), 720 dedicated 18×18 multipliers, and 12 Digital Clock Managers (DCMs). It delivers up to 420 MHz internal clock speed and supports 840+ Mb/s I/O performance in a 957-pin flip-chip BGA package, targeting high-speed telecom, networking, and DSP systems requiring PCI-X, LVDS, and DDR interfaces.
For engineers reviewing the XC2V4000-4BF957I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (including DCI-enabled LVCMOS/LVDS/SSTL/HSTL), DCM timing parameters, package-specific I/O count (684 user I/Os), and validated alternative FPGAs for migration or sourcing continuity.
Technical Context
The XC2V4000-4BF957I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates Configurable Logic Blocks (CLBs), 18-Kb dual-port Block SelectRAM, dedicated 18×18 multipliers, and 12 fully digital DCMs supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution).
It features SelectIO™-Ultra technology with 19 single-ended and 6 differential I/O standards-including PCI-X (133 MHz), LVDS (840 Mb/s), SSTL-2/3, HSTL, and GTL-plus Digitally Controlled Impedance (DCI) for on-die series/split termination. The BF957 flip-chip BGA package provides 684 user I/Os, excluding 15 dedicated configuration and boundary-scan control pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 4 million - defines logic capacity for complex RTL integration and IP core deployment. |
| Configurable Logic Blocks (CLBs) | 23,040 - each contains 4 slices with dual LUTs, registers, carry chains, and horizontal cascading for efficient arithmetic and state-machine logic. |
| Block SelectRAM™ | 120 modules (912 Kbits total) - configurable as dual-port RAM (e.g., 16K×1 to 512×36), enabling embedded buffering and FIFOs without external memory. |
| 18×18 Multiplier Blocks | 720 - hardware-accelerated multiply-accumulate operations for DSP filtering and signal processing pipelines. |
| Digital Clock Managers (DCMs) | 12 - provide jitter-tolerant clock synthesis, phase alignment, and de-skew across global clock networks for synchronous system timing. |
| User I/O Count | 684 - available in BF957 package; supports mixed-voltage I/O banks (1.5V–3.3V) with per-bank VCCO and programmable drive strength (2–24 mA). |
| I/O Standards | LVTTL, LVCMOS (1.5/1.8/2.5/3.3V), PCI-X, SSTL, HSTL, GTL, LVDS, BLVDS, LDT, LVPECL - enables direct interfacing to memory, processors, and high-speed serial links. |
| Digitally Controlled Impedance (DCI) | Supported for LVCMOS, SSTL, HSTL, GTL, and LVDS - eliminates external termination resistors and improves signal integrity in point-to-point and stub-bus topologies. |
Pinout & Package
The XC2V4000-4BF957I is housed in a 40 mm × 40 mm, 1.27 mm pitch flip-chip BGA package (BF957) with 957 balls. It provides 684 user I/Os distributed across 12 I/O banks, plus 15 dedicated configuration and test pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master/slave serial or SelectMAP modes; requires stable 0–100 MHz clock source. |
| DONE | Configuration Status Output | Open-drain output pulled high after successful configuration; used to enable downstream logic or reset sequencing. |
| M0–M2 | Mode Selection Inputs | Set configuration mode at power-up (e.g., M2:M1:M0 = 0:0:0 → Slave Serial; 1:0:0 → Master SelectMAP). |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts configuration sequence. |
| TCK/TDI/TDO/TMS | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification. |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-Based In-System Configuration | Enables unlimited reprogramming via JTAG or SelectMAP; supports partial reconfiguration for dynamic function swapping without full reload. |
| Dual-Port Block SelectRAM™ | Each 18-Kb block supports independent read/write on two ports with three read-during-write modes - ideal for ping-pong buffers and real-time data streaming. |
| Digital Clock Manager (DCM) | 12 independent DCMs deliver deterministic clock deskew (<±50 ps), frequency multiplication/division (M/D integer ratios), and 180°/90°/270° phase shifts - critical for source-synchronous interfaces like DDR SDRAM. |
| SelectIO™-Ultra DCI | On-chip series or split termination (e.g., 50 Ω, 75 Ω) auto-calibrated against external reference resistors - reduces PCB area, BOM cost, and signal reflections in high-speed traces. |
| Triple-DES Bitstream Encryption | Optional on-chip decryption using one or two 168-bit keys prevents reverse engineering and unauthorized cloning of configured logic. |
| Integrated Logic Analyzer (ILA) | Embedded debug core captures real-time signal activity across user-defined probes - enables in-system validation without external logic analyzers. |
Applications
| Telecom Line Card Processing | High-Speed Network Switch Fabric |
|---|---|
|
Use Scenario: Real-time packet classification, header parsing, and QoS enforcement in OC-192/STM-64 line cards. IC Role / Device Role / Timing Role: Programmable datapath accelerator implementing custom forwarding engines and traffic shapers synchronized to 155.52 MHz SONET clocks. Use Value: 12 DCMs enable precise clock domain crossing between SERDES, MAC, and memory interfaces; 684 I/Os support parallel bus widths for multiple PHYs and backplane links. |
Use Scenario: Layer-2/Layer-3 switching fabric with 10 GbE and 1000BASE-X interface aggregation. IC Role / Device Role / Timing Role: Central switch controller managing ingress/egress queues, CAM lookups, and crossbar arbitration with sub-nanosecond timing control. Use Value: LVDS I/Os handle 840 Mb/s SerDes lanes; Block SelectRAM provides 912 Kbits of on-chip buffer memory for packet buffering and statistics collection. |
| Medical Imaging Data Acquisition | Industrial Video Processing Engine |
|
Use Scenario: Real-time preprocessing of raw sensor data from MRI or CT scanner detector arrays before transmission to host CPU. IC Role / Device Role / Timing Role: High-throughput digital signal processor implementing FIR filters, FFTs, and pixel interpolation using 720 multiplier blocks and distributed arithmetic logic. Use Value: 420 MHz internal clock speed sustains >2 Gbps data throughput; DCI-enabled SSTL-2 I/Os interface directly to DDR2 SDRAM for frame buffering. |
Use Scenario: Multi-channel HD video encoding pipeline with HDMI input, motion estimation, and H.264 compression. IC Role / Device Role / Timing Role: Reconfigurable video processing unit handling pixel-level operations, chroma subsampling, and entropy coding across parallel data paths. Use Value: 23,040 CLBs implement scalable pipeline stages; LVPECL I/Os drive high-speed video DACs; 120 Block SelectRAM modules store coefficient tables and intermediate frames. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture; 2.5× higher logic density (2,586K LUTs vs. ~23K CLBs); integrated 100G Ethernet MAC and PCIe Gen4 hard IP. | Targets new designs requiring hardened high-speed transceivers and AI/ML inference acceleration; not pin-compatible. | Choose for greenfield designs needing >10 Gb/s serial connectivity and hardware-accelerated compute; requires full RTL and board redesign. |
| XC7VX690T-2FFG1927I | Virtex-7 architecture; 690K logic cells, 3,600 DSP slices, 4,860 Kb BRAM; supports DDR3/DDR4, PCIe Gen3, and 13.1 Gb/s transceivers. | Offers higher bandwidth memory controllers and lower static power than Virtex-II; suitable for legacy upgrade paths with moderate I/O expansion. | Prefer for drop-in replacement where existing PCB layout allows FF1927 package; retains similar I/O voltage flexibility but adds modern memory and protocol support. |
Compared with XC2V4000-4BF957I, the XC7VX690T-2FFG1927I delivers 3× more logic resources and native DDR4 support, while the XCVU9P-2FLGA2104I introduces hardened AI engines and 100G Ethernet - both require toolchain migration but offer extended lifecycle and higher performance per watt.
Availability
XC2V4000-4BF957I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, and high-speed networking applications requiring stable component supply, long-term obsolescence management, and traceable sourcing for legacy FPGA-based systems.
Supply support for XC2V4000-4BF957I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance, system-level FPGAs for demanding communications and computing applications.
The Virtex-II product line was engineered for high-speed, high-density logic implementation in telecom, networking, and DSP systems - emphasizing clock management, memory integration, and multi-standard I/O flexibility.
FAQ
What is the maximum operating junction temperature for the XC2V4000-4BF957I?
The XC2V4000-4BF957I is rated for industrial temperature range (–40°C to +100°C), with maximum junction temperature (TJ) of +100°C under specified thermal conditions. This rating is confirmed in DS031 Module 3, Electrical Characteristics, and applies to all speed grades (-4, -5, -6) in the BF957 package.
Does the XC2V4000-4BF957I support IEEE 1532 boundary-scan configuration?
Yes, the XC2V4000-4BF957I supports IEEE 1532-compliant boundary-scan configuration via its JTAG TAP controller. This enables in-system programming, readback, and verification of configuration bitstreams without requiring external configuration PROMs or microcontrollers.
How many global clock lines are available in the XC2V4000-4BF957I?
The XC2V4000-4BF957I provides 16 global clock lines - eight per quadrant - routed through dedicated low-skew networks. Each of the 12 DCMs can drive up to four of these global clock MUX buffers, enabling hierarchical clock distribution across large logic regions.
Can the XC2V4000-4BF957I interface directly with DDR2 SDRAM?
Yes, the XC2V4000-4BF957I supports DDR2 SDRAM interfacing using its SelectIO™-Ultra I/Os with SSTL_18_I/II standards and DCM-controlled phase-aligned capture clocks. Reference designs and timing constraints for 400–800 Mbps DDR2 operation are documented in Xilinx UG071 and application notes.
Is triple-DES bitstream encryption enabled by default on the XC2V4000-4BF957I?
No, triple-DES bitstream encryption is optional and must be explicitly enabled during bitstream generation using Xilinx ISE tools. When activated, it requires loading one or two 168-bit keys into on-chip non-volatile memory; the XC2V4000-4BF957I includes dedicated hardware decryptor logic to enforce security at configuration time.
XC2V4000-4BF957I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 957-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5760
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 2211840
- Number of I/O:
- 684
- Number of Gates:
- 4000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 957-FCBGA (40x40)
XC2V4000-4BF957I FAQ
1.How can I place an order for XC2V4000-4BF957I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V4000-4BF957I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V4000-4BF957I reliable?
The price and inventory of XC2V4000-4BF957I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V4000-4BF957I is usually 5 days.
3.What payment methods are accepted for XC2V4000-4BF957I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V4000-4BF957I transactions.
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XC2V4000-4BF957I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V4000-4BF957I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V4000-4BF957I?
For technical support, including XC2V4000-4BF957I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V4000-4BF957I requirements.
6.How does Aetrix verify that XC2V4000-4BF957I is sourced from the original manufacturer or authorized distributors?
All XC2V4000-4BF957I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V4000-4BF957I meets industry standards.
7.What is the process for return or replacement of XC2V4000-4BF957I?
All XC2V4000-4BF957I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V4000-4BF957I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V4000-4BF957I part is unused and in its original packaging.
Return procedure for XC2V4000-4BF957I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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