AMD XC2V4000-4FF1152I

Overview

XC2V4000-4FF1152I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 4 million system gates, 23,040 configurable logic blocks (CLBs), 120 Digital Clock Manager (DCM) modules, and 912 user I/O pins in a 1152-ball flip-chip fine-pitch BGA package. It supports LVDS, DDR, PCI-X, and SSTL I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and DSP applications.

For engineers reviewing the XC2V4000-4FF1152I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O capability mapping, DCM timing parameters, SelectRAM memory configuration options, and industrial-temperature (-40°C to +100°C) operational validation - all specific to the FF1152 package variant.

Technical Context

The XC2V4000-4FF1152I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with dedicated 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates 120 DCMs for precise clock de-skew, frequency synthesis, and ±1/256-cycle phase shifting, plus 18 Kb dual-port Block SelectRAM modules configurable from 16K×1 to 512×36 bits.

It features 720 dedicated 18×18-bit multipliers, Digitally Controlled Impedance (DCI) for on-die termination across 19 single-ended and 6 differential I/O standards, and Active Interconnect routing with 24 long lines per row/column - enabling predictable timing independent of fanout for high-speed synchronous designs.

Key Specifications

Pinout & Package

XC2V4000-4FF1152I uses a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.00 mm pitch, 35 mm × 35 mm body size, and 824 maximum user I/Os - of which 912 are enabled for this device variant per Table 6 in DS031. The package supports thermal dissipation required for sustained 420 MHz operation and includes dedicated configuration pins (CCLK, DONE, PROG_B, M0–M2), JTAG TAP signals (TCK/TMS/TDI/TDO), and power/ground balls distributed for low-noise core and I/O domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V6000-4FF1152I, the XC2V4000-4FF1152I offers lower static power and reduced PCB routing complexity for mid-scale systems; compared with XC2V4000-5FF1152I, it trades 5% timing margin for cost efficiency where thermal and layout constraints limit performance headroom.

Availability

XC2V4000-4FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, and high-speed data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2V4000-4FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic with FPGA architectures optimized for high-performance system integration, signal processing, and protocol acceleration.

The Virtex-II family - including XC2V4000-4FF1152I - was designed for wireline/wireless infrastructure, video processing, and DSP-intensive applications demanding scalable logic density, deterministic timing, and multi-standard I/O flexibility.

FAQ

What is the maximum operating frequency of the XC2V4000-4FF1152I core logic?

The XC2V4000-4FF1152I supports up to 420 MHz internal clock speed per DS031 v3.5 specifications. This applies to registered logic paths under typical industrial conditions and assumes proper placement, routing, and DCM-based clock distribution. Actual achievable frequency depends on design topology, resource usage, and timing constraints - the -4 speed grade guarantees timing closure at this rate for critical paths defined in the data sheet.

Does the XC2V4000-4FF1152I support DDR SDRAM interfaces?

Yes, the XC2V4000-4FF1152I supports DDR SDRAM interfaces through its SelectIO-Ultra I/O banks with dedicated DDR input and output registers, programmable I/O drive strength (2–24 mA), and VCCO per bank configuration. It meets JEDEC-compliant timing for DDR-200/266/333 when used with appropriate board layout and termination - confirmed in Module 2 of DS031.

How many Block SelectRAM modules does the XC2V4000-4FF1152I contain?

The XC2V4000-4FF1152I contains 120 Block SelectRAM modules, each providing 18 Kbits of dual-port RAM. As stated in Table 1 of DS031, this yields 912 Kbits total on-chip memory, configurable from 16K×1 to 512×36 with independent clocks and three read-during-write modes - enabling efficient FIFOs, frame buffers, and coefficient storage.

Is the XC2V4000-4FF1152I pin-compatible with other Virtex-II devices in FF1152 packaging?

All Virtex-II devices offered in FF1152 packaging - including XC2V3000-4FF1152I, XC2V4000-4FF1152I, and XC2V6000-4FF1152I - share identical pinouts and footprint compatibility per Table 6 in DS031. However, I/O bank voltage assignments, configuration pin behavior, and resource availability differ; migration requires functional validation and pin assignment review.

What configuration modes are supported by the XC2V4000-4FF1152I?

The XC2V4000-4FF1152I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary Scan. Mode selection is controlled by M0–M2 pins at power-up, and all modes are fully documented in Module 2 of DS031 - with SelectMAP enabling high-speed parallel loading at up to 100 MHz.