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AMD XC2V4000-4FF1517I
- Part No.:
- XC2V4000-4FF1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XC2V4000-4FF1517I.pdf
- Description:
- IC FPGA 912 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,448
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Product details
Overview
XC2V4000-4FF1517I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 4 million system gates, 23,040 configurable logic blocks (CLBs), 120 Digital Clock Manager (DCM) modules, and 912 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It supports LVDS, DDR, PCI-X, and HSTL I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and DSP applications.
For engineers reviewing the XC2V4000-4FF1517I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O capability mapping, DCM timing parameters, DCI termination support, and industrial-temperature operation context - all confirmed against DS031 (v3.5) November 2007.
Technical Context
The XC2V4000-4FF1517I implements a 0.15 µm / 0.12 µm CMOS 8-layer metal process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates 120 DCMs for precise clock de-skew, frequency synthesis, and ±1/256-cycle phase shifting, plus 120 dedicated 18×18 multipliers and 912 user I/Os with Digitally Controlled Impedance (DCI) for on-die series/split termination.
It features 120 Block SelectRAM™ modules (18 Kb each, dual-port configurable), distributed RAM resources, active interconnect routing with 24 long lines per row/column, and boundary-scan compliance per IEEE 1149.1 and 1532. Configuration uses SRAM-based bitstream loading via Slave/Master SelectMAP or JTAG, with optional Triple-DES encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 4 million - defines logic capacity for large-scale digital systems including protocol stacks and signal processing pipelines. |
| Configurable Logic Blocks (CLBs) | 23,040 - each contains four slices with dual 4-LUTs, dual registers, carry chains, and horizontal cascade for arithmetic and state-machine implementation. |
| Digital Clock Managers (DCMs) | 120 - provide fully digital, self-calibrating clock de-skew, M/D ratio frequency synthesis, and fine-grained phase adjustment (1/256 period resolution). |
| User I/O Count | 912 - available in FF1517 flip-chip BGA; supports 19 single-ended and 6 differential I/O standards including LVDS, SSTL, HSTL, and PCI-X. |
| Block SelectRAM™ | 912 Kbits (120 × 18 Kb) - dual-port, synchronous RAM configurable from 16K×1 to 512×36, enabling embedded FIFOs, buffers, and lookup tables. |
| Multiplier Blocks | 720 - dedicated 18×18-bit hardware multipliers optimized for DSP filtering, FFT, and MAC operations with independent use from SelectRAM. |
| Operating Temperature | –40°C to +100°C - industrial-grade thermal rating validated for base station, industrial control, and avionics environments. |
Pinout & Package
XC2V4000-4FF1517I is housed in a 1517-ball flip-chip fine-pitch BGA (FF1517) with 1.00 mm pitch, 40 mm × 40 mm body size, and 912 user I/Os. The package excludes 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial or SelectMAP configuration; must be stable during bitstream load; not used in JTAG mode. |
| DONE | Configuration Status Output | Open-drain output pulled high externally; goes high after successful configuration and CRC check completion. |
| M0–M2 | Mode Selection Inputs | Set configuration mode at power-up (e.g., Master Serial, Slave SelectMAP); sampled on PROG_B release. |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts initialization sequence. |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port; enables configuration, readback, and debug via boundary-scan instructions. |
| VCCINT | Core Power Supply | 1.5 V ±3% supply for CLB, DCM, and routing logic; requires low-noise regulation and local decoupling. |
| VCCAUX | Auxiliary Power Supply | 3.3 V ±5% supply for DCMs, SelectIO™ drivers, and configuration logic; shared across multiple I/O banks. |
| VCCO | I/O Bank Power Supply | Programmable per-bank voltage (1.5 V to 3.3 V) setting I/O standard compatibility and drive strength. |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series/split termination resistors auto-matched to external reference resistors - eliminates external termination components for HSTL, SSTL, and GTL interfaces. |
| DDR I/O Registers | Dual-edge capture and launch using paired registers clocked 180° out-of-phase - enables true double-data-rate signaling without external delay elements. |
| Active Interconnect Routing | Predictable, fanout-independent delay via fourth-generation segmented routing matrix with 24 long lines, 120 hex lines, and hierarchical switch matrices. |
| SelectLink™ Technology | Proprietary high-bandwidth DDR link supporting source-synchronous data transfers - optimized for memory controller and high-speed interface designs. |
| Triple-DES Bitstream Encryption | On-chip decryptor with one or two key sets secures configuration data against reverse engineering and unauthorized cloning. |
Applications
| Wireless Baseband Processing | High-Speed Network Switching |
|---|---|
Use Scenario: Real-time channel coding, modulation/demodulation, and MIMO signal processing in 3G/LTE infrastructure equipment. IC Role / Device Role / Timing Role: Configurable fabric executing parallelized DSP kernels with synchronized multi-clock domains managed by 120 DCMs. Use Value: 720 hardware multipliers and 912 Kbits of dual-port Block SelectRAM enable concurrent filter banks and symbol-level buffering without external memory latency. |
Use Scenario: Line-rate packet classification, forwarding table lookups, and traffic shaping in 10 GbE and OC-192 edge routers. IC Role / Device Role / Timing Role: Protocol-aware logic engine interfacing to QDR SRAM and SerDes PHYs via 912 LVDS-capable I/Os and SelectLink™ DDR links. Use Value: 912 user I/Os with PCI-X 133 MHz and LVDS 840 Mb/s support allow direct attachment to high-throughput memory and backplane interfaces. |
| Industrial Motion Control | Medical Imaging Data Acquisition |
Use Scenario: Multi-axis servo synchronization, real-time PID loop execution, and safety-critical encoder feedback processing in CNC and robotics systems. IC Role / Device Role / Timing Role: Deterministic logic fabric with sub-nanosecond routing predictability and industrial-temperature DCM stability (–40°C to +100°C). Use Value: 120 DCMs provide jitter-free, phase-aligned clocks for simultaneous ADC sampling, PWM generation, and fieldbus communication. |
Use Scenario: High-fidelity ultrasound beamforming, CT detector readout, and MRI gradient waveform synthesis requiring precise timing and parallel data paths. IC Role / Device Role / Timing Role: Time-critical acquisition controller managing >100-channel ADCs and DACs with deterministic latency via dedicated carry chains and register-rich CLBs. Use Value: 23,040 CLBs with 93,184 registers/latches ensure cycle-accurate control of analog front-end timing, trigger distribution, and DMA coordination. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V6000-4FF1152I | 6M gates, 33,792 CLBs, 144 DCMs, 824 I/Os in FF1152 (1152-pin) package - higher density but fewer I/Os and smaller footprint. | Better suited for compute-bound logic with moderate I/O count; less optimal for I/O-intensive protocols like PCI-X or multi-bank memory interfaces. | Select when gate count dominates over I/O count and board space constraints favor 35×35 mm vs. 40×40 mm. |
| XC2V4000-5FF1517I | Same 4M-gate architecture and FF1517 package, but -5 speed grade - 25% slower maximum internal clock (336 MHz vs. 420 MHz) and relaxed setup/hold timing. | Acceptable for non-critical timing paths or legacy designs where margin exists; not suitable for 420 MHz DCM-synthesized clocks or 840 Mb/s LVDS links. | Choose only if cost sensitivity outweighs performance headroom and full -4 timing closure is unnecessary. |
Compared with XC2V6000-4FF1152I and XC2V4000-5FF1517I, the XC2V4000-4FF1517I uniquely balances 912 I/Os, 420 MHz internal speed, and industrial temperature range in a single 1517-ball package - making it optimal for I/O-rich, timing-critical infrastructure applications where pin count and clock performance are co-constrained.
Availability
XC2V4000-4FF1517I is available at Aetrix Electronics and suitable for wireless infrastructure, network switching, industrial motion control, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC2V4000-4FF1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the Virtex family as the industry's first platform FPGA solution for high-performance system integration.
The Virtex-II product line was engineered for telecom, wireless, and DSP applications demanding high gate count, multi-standard I/O, and deterministic clock management - with XC2V4000-4FF1517I targeting industrial-grade, I/O-intensive implementations.
FAQ
What is the maximum internal clock speed supported by XC2V4000-4FF1517I?
The XC2V4000-4FF1517I supports up to 420 MHz internal clock speed per DS031 (v3.5) specifications. This performance is achievable using its 120 Digital Clock Manager (DCM) modules for frequency synthesis and skew compensation. The -4 speed grade guarantees timing closure at this rate under industrial temperature conditions (–40°C to +100°C), provided PCB layout and power delivery meet Xilinx design guidelines for the FF1517 package.
Does XC2V4000-4FF1517I support DDR I/O interfaces?
Yes, XC2V4000-4FF1517I natively supports DDR I/O through dedicated input and output registers within each IOB block. These registers can be clocked 180° out-of-phase using DCM outputs to achieve true double-data-rate capture and launch. Supported standards include DDR SDRAM, DDR SRAM, and source-synchronous interfaces compliant with JEDEC SSTL-2 and SSTL-3 specifications.
How many Block SelectRAM™ modules does XC2V4000-4FF1517I contain?
XC2V4000-4FF1517I contains 120 Block SelectRAM™ modules, each providing 18 Kb of dual-port RAM. This yields a total of 912 Kbits of dedicated block memory, configurable from 16K×1 to 512×36, with three read-during-write modes and cascading capability for larger memory structures - essential for FIFOs, frame buffers, and coefficient storage in DSP designs.
Is XC2V4000-4FF1517I compatible with 5V-tolerant I/O standards?
No, XC2V4000-4FF1517I is not 5V-tolerant. Its IOBs are designed for VCCO between 1.5 V and 3.3 V and lack internal 5V-compatible clamping. As an input, it may interface with 5V signals only when external current-limiting resistors are used per Xilinx Tech Topic "5V Tolerant I/Os"; as an output, it cannot drive 5V logic levels directly.
What configuration modes are supported by XC2V4000-4FF1517I?
XC2V4000-4FF1517I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). It also includes an on-chip DES decryptor for optional Triple-DES bitstream encryption, enabling secure remote updates and IP protection in deployed systems.
XC2V4000-4FF1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5760
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 2211840
- Number of I/O:
- 912
- Number of Gates:
- 4000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XC2V4000-4FF1517I FAQ
1.How can I place an order for XC2V4000-4FF1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V4000-4FF1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V4000-4FF1517I reliable?
The price and inventory of XC2V4000-4FF1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V4000-4FF1517I is usually 5 days.
3.What payment methods are accepted for XC2V4000-4FF1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V4000-4FF1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V4000-4FF1517I?
XC2V4000-4FF1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V4000-4FF1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V4000-4FF1517I?
For technical support, including XC2V4000-4FF1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V4000-4FF1517I requirements.
6.How does Aetrix verify that XC2V4000-4FF1517I is sourced from the original manufacturer or authorized distributors?
All XC2V4000-4FF1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V4000-4FF1517I meets industry standards.
7.What is the process for return or replacement of XC2V4000-4FF1517I?
All XC2V4000-4FF1517I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V4000-4FF1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V4000-4FF1517I part is unused and in its original packaging.
Return procedure for XC2V4000-4FF1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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