AMD XC2V4000-4FFG1152C

Overview

XC2V4000-4FFG1152C from Xilinx is a 4-million-system-gate Virtex-II platform FPGA in a 1152-pin flip-chip fine-pitch BGA (FF1152) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 23,040 Configurable Logic Blocks (CLBs), 120 Digital Clock Managers (DCMs), 912 Kbits of block SelectRAM™ memory, and supports up to 824 user I/Os. It is used in high-bandwidth telecom infrastructure for protocol bridging between PCI-X, LVDS, and DDR interfaces.

For engineers reviewing the XC2V4000-4FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed 1.5V core voltage, DCI-enabled on-die termination for HSTL/SSTL/LVCMOS I/O standards, dual-port 18-Kb RAM block configurability, 18×18 dedicated multiplier density, and DCM-based phase-shifting capability for clock deskew in synchronous interface designs.

Technical Context

The XC2V4000-4FFG1152C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support DDR input/output registers with two-phase clocks generated by integrated DCMs, enabling source-synchronous data capture at up to 840 Mb/s.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, fast carry chains, and horizontal cascade logic. Block SelectRAM resources are configurable from 16K×1 to 512×36 bits in dual-port mode with three read-during-write options, and each is paired with a dedicated 18×18 multiplier optimized for DSP filtering and accumulate operations.

Key Specifications

Pinout & Package

XC2V4000-4FFG1152C uses the FF1152 flip-chip fine-pitch BGA package (1.00 mm pitch, 35 mm × 35 mm body size), offering 824 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V3000-4FFG1152C and XC2V6000-4FFG1152C, the XC2V4000-4FFG1152C delivers optimal balance of logic capacity, memory bandwidth, and I/O count for PCIe-to-serial RapidIO bridging - avoiding underutilization penalties of the XC2V6000 while exceeding XC2V3000's capacity for dual-10G MAC implementations.

Availability

XC2V4000-4FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, wireless baseband processing, and high-speed video capture systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2V4000-4FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance digital system design.

The Virtex-II family was designed for high-density, high-speed applications including telecommunications, networking, and DSP - delivering scalable logic, memory, and clocking resources on a unified platform.

FAQ

What is the maximum supported I/O standard voltage for XC2V4000-4FFG1152C?

The XC2V4000-4FFG1152C supports single-ended I/O standards at VCCO = 1.5V, 1.8V, 2.5V, and 3.3V, and differential standards including LVDS_25 (2.5V), LVDS_33 (3.3V), LVPECL_33 (3.3V), and LDT_25 (2.5V). All configurations require VCCAUX = 3.3V and VCCINT = 1.5V. The device does not support 5V-tolerant I/O without external current-limiting resistors.

Does XC2V4000-4FFG1152C support partial reconfiguration?

Yes, XC2V4000-4FFG1152C supports partial reconfiguration through its SRAM-based configuration architecture. This allows dynamic modification of specific logic regions without resetting the entire device, enabling runtime adaptation in protocols like multi-standard radio or field-upgradable packet processing pipelines.

What is the purpose of the HSWAP_EN pin on XC2V4000-4FFG1152C?

The HSWAP_EN pin on XC2V4000-4FFG1152C enables hot-swap protection during power-up sequencing. When asserted high, it disables all I/O drivers until configuration completes, preventing bus contention or back-driving on live backplanes - critical for telecom line cards with hot-plug capability.

Can XC2V4000-4FFG1152C implement PCI-X 133 MHz interfaces?

Yes, XC2V4000-4FFG1152C is PCI-X 133 MHz compliant at 3.3V. Its SelectIO-Ultra technology, combined with Digitally Controlled Impedance (DCI) and dedicated DDR I/O registers, meets PCI-X timing requirements including setup/hold margins and skew control across all 64-bit data lanes.

How many 18-Kb block RAMs does XC2V4000-4FFG1152C contain?

XC2V4000-4FFG1152C contains 120 × 18-Kb block SelectRAM™ memory modules, totaling 912 Kbits of dedicated dual-port RAM. Each block is independently configurable from 16K×1 to 512×36 bits and supports three read-during-write modes for pipeline-efficient memory access.