AMD XC2V4000-4FFG1152I

Overview

XC2V4000-4FFG1152I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 4 million system gates, 23,040 configurable logic blocks (CLBs), 120 Digital Clock Manager (DCM) modules, and 912 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It supports LVDS, DDR, PCI-X, and SSTL I/O standards and targets high-speed telecommunication, networking, and DSP applications requiring deterministic clock management and embedded memory.

For engineers reviewing the XC2V4000-4FFG1152I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability mapping, DCM timing parameters, SelectRAM configuration options, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V4000-4FFG1152I implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates 120 DCMs for precise de-skew, phase shifting (1/256 period resolution), and M/D frequency synthesis, plus 120 dual-port 18-Kb Block SelectRAM modules supporting configurations from 16K×1 to 512×36 bits.

It features 720 dedicated 18×18-bit multipliers, Digitally Controlled Impedance (DCI) for on-die termination across 19 single-ended and 6 differential I/O standards, and Active Interconnect routing with 24 long lines per row/column, ensuring predictable timing independent of fanout.

Key Specifications

Pinout & Package

XC2V4000-4FFG1152I uses the FF1152 flip-chip fine-pitch BGA package (1.00 mm pitch, 35 mm × 35 mm body), offering 912 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V4000-4FFG1152I, XC2V6000-4FF1152I offers scalable density within identical mechanical and thermal constraints, while XC3S1600E-4FG456I represents a cost-reduced, functionally limited alternative lacking DCM-based clock synthesis and high-speed I/O compliance.

Availability

XC2V4000-4FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial radar systems, and broadcast video equipment requiring stable component supply across extended lifecycle programs.

Supply support for XC2V4000-4FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA technology enables customizable digital logic implementation without mask costs.

The Virtex-II family was designed for high-performance, IP-intensive applications in telecommunications, wireless infrastructure, and high-end DSP, emphasizing clock precision, memory bandwidth, and I/O flexibility over cost-optimized logic density.

FAQ

What is the maximum guaranteed internal clock frequency for XC2V4000-4FFG1152I?

The XC2V4000-4FFG1152I speed grade -4 guarantees a maximum internal clock frequency of 420 MHz under industrial temperature conditions (-40°C to +100°C), as specified in Module 3 (DC and Switching Characteristics) of DS031 v3.5. This rating applies to CLB-to-CLB paths with standard timing constraints and accounts for process, voltage, and temperature variation.

Does XC2V4000-4FFG1152I support PCI-X 133 MHz operation?

Yes, XC2V4000-4FFG1152I supports PCI-X 133 MHz operation at 3.3 V, as confirmed in the "SelectIO™-Ultra Technology" section of DS031 v3.5. It meets PCI-X electrical and timing specifications natively, without external level shifters or termination components, when configured with appropriate IOSTANDARD attributes and VCCO = 3.3 V.

How many 18-Kb Block SelectRAM modules does XC2V4000-4FFG1152I contain?

XC2V4000-4FFG1152I contains 120 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. These modules support independent read/write operations on both ports, three read-during-write modes, and cascading to implement larger memory structures - totaling 912 Kbits of embedded block RAM.

Is XC2V4000-4FFG1152I compatible with Xilinx ISE 14.7 design tools?

No, XC2V4000-4FFG1152I requires Xilinx ISE Foundation or Alliance Series software versions 6.3 through 10.1, as documented in DS031 v3.5 and Xilinx AR# 19542. ISE 14.7 targets 7-series and later FPGAs; using it with Virtex-II devices will result in unrecognized part errors and synthesis failure.

What configuration modes are supported by XC2V4000-4FFG1152I?

XC2V4000-4FFG1152I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. All modes use the dedicated CCLK, DIN/DOUT, and control pins (PROG_B, DONE, M0–M2); SelectMAP enables high-speed parallel loading via microprocessor or FPGA companion device.