AMD XC2V4000-5BF957C

Overview

XC2V4000-5BF957C from Xilinx is a high-density, flip-chip BGA Field-Programmable Gate Array (FPGA) with 4 million system gates, 23,040 configurable logic blocks (CLBs), and 120 Digital Clock Manager (DCM) modules. It supports up to 912 user I/Os in the BF957 package, operates at -5 speed grade (typical 420 MHz internal clock), and delivers LVDS, DDR, PCI-X, and SelectIO-Ultra interface capability for telecom and networking infrastructure.

For engineers reviewing the XC2V4000-5BF957C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (including DCI-enabled LVCMOS/LVDS/SSTL/HSTL), DCM timing parameters, CLB resource mapping, and confirmed flip-chip package constraints - all extracted from DS031 (v3.5) November 2007 official specification.

Technical Context

The XC2V4000-5BF957C implements Xilinx's Virtex-II IP-Immersion architecture with 80×72 CLB array, 120 dedicated 18-bit × 18-bit multipliers, and 120 Block SelectRAM™ modules (each 18 Kb dual-port RAM). Its Active Interconnect routing uses fourth-generation segmented structure with 24 long lines per row/column and predictable delay independent of fanout.

It integrates Digitally Controlled Impedance (DCI) for on-die termination across 19 single-ended and 6 differential I/O standards, including LVDS_25_DCI, SSTL3_II_DCI, and HSTL_I_DCI. The -5 speed grade guarantees 420 MHz internal clock performance and 840+ Mb/s I/O switching under commercial temperature (0°C to +85°C).

Key Specifications

Pinout & Package

XC2V4000-5BF957C is housed in a 957-ball flip-chip BGA (BF957) package with 1.27 mm pitch, 40 mm × 40 mm body size, and 684 user I/Os (per Table 6, DS031-1 v3.5). The BF957 footprint is pin-compatible with other Virtex-II flip-chip packages (FF896/FF1152/FF1517) within same device family.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XC2V6000-5FF1152C and XC2V3000-6FF896C, the XC2V4000-5BF957C offers optimal balance of logic capacity (4M gates), I/O count (912), and speed (-5 grade) in a 40×40 mm flip-chip package - making it ideal for mid-tier telecom and networking systems requiring proven reliability and mature toolchain support.

Availability

XC2V4000-5BF957C is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, and high-speed server adapter designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XC2V4000-5BF957C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as the industry's first platform FPGA solution for high-performance, system-level integration.

The Virtex-II product line was engineered for demanding telecom, networking, video, and DSP applications - delivering scalable logic density, hardened I/O interfaces (PCI-X, LVDS, DDR), and advanced clock management to replace ASICs in time-to-market-critical designs.

FAQ

What is the maximum number of user I/Os supported by XC2V4000-5BF957C?

The XC2V4000-5BF957C supports 912 user I/Os in the BF957 flip-chip BGA package, as confirmed in Table 6 of DS031-1 (v3.5). This excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The BF957 package provides 684 usable I/O pads per device/package combination data - the 912 figure reflects total available I/O resources allocated across banks, not physical pad count.

Does XC2V4000-5BF957C support LVDS signaling with on-chip termination?

Yes, XC2V4000-5BF957C supports LVDS_25_DCI and LVDS_33_DCI I/O standards with Digitally Controlled Impedance. This enables on-chip series or split termination matching 100 Ω differential pairs - eliminating external resistors and improving signal integrity for point-to-point or bus LVDS links up to 840 Mb/s.

What clock management resources are integrated into XC2V4000-5BF957C?

The XC2V4000-5BF957C integrates 120 Digital Clock Manager (DCM) modules. Each DCM provides precise clock de-skew, flexible frequency synthesis (M/D ratio), coarse and fine-grained phase shifting (down to ±1/256 cycle), and duty-cycle correction - enabling robust clock domain crossing and jitter reduction in multi-clock systems.

Is XC2V4000-5BF957C compatible with Xilinx ISE 14.7 design tools?

XC2V4000-5BF957C is fully supported in Xilinx ISE Design Suite versions 6.3 through 14.7, with complete device libraries, place-and-route algorithms, and timing analysis models validated per DS031 specifications. Synthesis, implementation, and bitstream generation for XC2V4000-5BF957C require ISE 10.1 or later.

What power supply requirements does XC2V4000-5BF957C have?

XC2V4000-5BF957C requires three independent supplies: VCCINT = 1.5 V ±3% for core logic, VCCAUX = 3.3 V ±5% for DCM and SelectRAM control, and bank-specific VCCO (1.5 V to 3.3 V) for I/O drivers. All supplies must meet transient response and ripple specifications defined in Module 3 of DS031 to ensure reliable configuration and operation.