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AMD XC2V4000-5FF1152I

Part No.:
XC2V4000-5FF1152I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1152-BBGA, FCBGA
Datasheet:
AetrixXC2V4000-5FF1152I.pdf
Description:
IC FPGA 824 I/O 1152FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,761

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Product details

Overview

XC2V4000-5FF1152I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 4 million system gates, 23,040 CLBs, 120 Block SelectRAM™ modules (912 Kbits total), 720 dedicated 18×18 multipliers, and 12 Digital Clock Managers (DCMs). It delivers up to 420 MHz internal logic speed and supports 840 Mb/s LVDS I/O for telecom, video processing, and high-speed DSP applications.

For engineers reviewing the XC2V4000-5FF1152I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, flip-chip BGA package mapping, and validated alternative FPGAs for migration or sourcing continuity.

Technical Context

The XC2V4000-5FF1152I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates Configurable Logic Blocks (CLBs), dual-port 18-Kb Block SelectRAM, dedicated 18×18 multipliers, and DCMs with precise phase shifting (1/256 clock period resolution) and frequency synthesis (M/D ratio).

It features SelectIO™-Ultra I/O with 19 single-ended and 6 differential standards-including LVDS, BLVDS, LVPECL, and SSTL-plus Digitally Controlled Impedance (DCI) for on-die series or split termination. The FF1152 flip-chip fine-pitch BGA package provides 824 user I/Os, excluding 15 dedicated configuration and boundary-scan pins.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Density 4 million system gates; enables complex protocol stacks, multi-channel video pipelines, or full-system-on-FPGA integration.
Configurable Logic Blocks 23,040 CLBs (each with 4 slices); supports >93K registers/latches and >93K LUTs for large state machines or parallel datapaths.
Block RAM 120 × 18-Kb dual-port SelectRAM blocks (912 Kbits total); configurable as 16K×1 to 512×36, enabling embedded FIFOs or frame buffers.
Digital Clock Managers 12 DCMs per device; provide jitter-free clock de-skew, ±180° phase shift, and M/D frequency synthesis without external PLLs.
I/O Standards Supports LVDS, SSTL-2/3, HSTL-I/II/III/IV, PCI-X (133 MHz), GTL/GTLP, and AGP-2X; eliminates need for level-shifting ICs in memory or bus interfaces.
Digitally Controlled Impedance On-chip series/split termination for LVCMOS, SSTL, HSTL, GTL; removes external resistors and improves signal integrity for point-to-point links.
Package & I/O Count FF1152 flip-chip BGA (1.00 mm pitch, 35×35 mm); 824 user I/Os with dedicated global clock routing and low-inductance power delivery.

Pinout & Package

XC2V4000-5FF1152I uses the FF1152 flip-chip fine-pitch BGA package (1.00 mm pitch, 35×35 mm body), optimized for high I/O count (824 user I/Os), thermal performance, and signal integrity in high-speed designs. Pin definitions follow Xilinx DS031 Module 4 - Pinout Information, with dedicated banks supporting independent VCCO voltages and I/O standards.

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration clock input Drives internal configuration logic during master serial or SelectMAP mode; must be stable before PROG_B deassertion.
DONE Configuration status output Open-drain active-high signal indicating successful bitstream loading; used to enable downstream logic after configuration.
M0–M2 Mode select inputs Set configuration mode (slave/master serial/SelectMAP/boundary-scan); sampled at PROG_B rising edge.
PROG_B Program initiation input Active-low asynchronous reset that clears configuration memory and initiates reload; requires minimum 300 ns pulse width.
TCK/TMS/TDI/TDO JTAG test access port IEEE 1149.1-compliant interface for boundary-scan testing, programming, and debug; supports IEEE 1532 configuration.

Key Features

Feature Design Value
Active Interconnect Technology Predictable, fanout-independent routing delay via fourth-generation segmented structure; enables timing closure in multi-GHz designs.
SelectLink™ DDR Interface Proprietary high-bandwidth link with built-in DDR input/output registers; reduces external PHY complexity for memory or inter-chip data transfer.
Triple-DES Bitstream Encryption On-chip DES decryptor with one or two key sets; protects intellectual property against unauthorized readback or cloning.
Integrated Logic Analyzer (ILA) Embedded debug core accessible via JTAG; captures real-time signal behavior without external probes or design modification.
Partial Reconfiguration Dynamic replacement of logic regions while system remains operational; enables field-upgradable functions or runtime hardware adaptation.

Applications

Telecom Line Card Processing High-Definition Video Frame Buffering

Use Scenario: Aggregating and grooming multiple TDM/Ethernet streams in carrier-grade line cards.

IC Role / Device Role / Timing Role: Programmable fabric implementing HDLC, GFP, and Ethernet MAC layers with deterministic latency control via DCM-synchronized clocks.

Use Value: 824 I/Os support parallel bus interfaces to multiple PHYs; LVDS I/O and DCI ensure clean 840 Mb/s backplane signaling without external termination.

Use Scenario: Real-time buffering and format conversion of 1080p60 video streams between HDMI, SDI, and DDR2 SDRAM subsystems.

IC Role / Device Role / Timing Role: Dual-role controller managing simultaneous read/write to 912 Kbits of block RAM while synchronizing pixel clocks across multiple domains using 12 DCMs.

Use Value: 120 Block SelectRAM modules eliminate external frame buffers; SSTL-2/3 I/O directly interfaces DDR2 memory at 400 Mb/s per pin.

PCI-X Embedded Computing Multi-Channel DSP Acceleration

Use Scenario: High-throughput data acquisition and preprocessing in industrial PCIe/PCI-X host systems.

IC Role / Device Role / Timing Role: Bridge logic handling 133 MHz PCI-X transactions with DMA arbitration, scatter-gather list management, and on-the-fly data packing.

Use Value: PCI-X compliance at 3.3 V eliminates level translators; 720 dedicated multipliers accelerate FIR filtering or FFT pre-processing in hardware.

Use Scenario: Real-time radar signal processing requiring parallel FFT, beamforming, and CFAR detection across 16+ channels.

IC Role / Device Role / Timing Role: Reconfigurable datapath executing fixed-point arithmetic with pipelined 18×18 multipliers and carry-chain optimized for sum-of-products.

Use Value: 420 MHz internal clock speed sustains >2 GMAC/s throughput; distributed RAM and CLB resources enable deep pipeline stages without external memory bottlenecks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCVU3P-2FFVA1760I UltraScale+ architecture; 1.1M logic cells, 48.4 Mb block RAM, 4,096 DSP slices; 0.85 V core; supports PCIe Gen4, DDR4, and 28 Gb/s transceivers. Targets next-gen protocols (PCIe Gen4, DDR4, 28G SerDes); not pin-compatible; requires full RTL and toolchain migration. Choose for new designs needing higher bandwidth, lower power, or advanced I/O; not suitable for drop-in replacement.
XC7VX485T-2FFG1761I Virtex-7 architecture; 485K logic cells, 36.9 Mb block RAM, 3,600 DSP48E1 slices; 1.0 V core; supports PCIe Gen3, DDR3, and 13.1 Gb/s transceivers. Offers higher density and transceiver speed than XC2V4000; same 1.0 mm pitch BGA footprint as FF1152 but different pinout and power delivery. Consider for legacy-compatible upgrades where board redesign is feasible and higher DSP/memory bandwidth is required.

Compared with XC2V4000-5FF1152I, the XC7VX485T-2FFG1761I delivers 2.5× more logic capacity and integrated transceivers, while the XCVU3P-2FFVA1760I adds hardened PCIe/DDR4 controllers and AI-optimized DSP-but both require new PCB layout, power delivery, and toolchain validation.

Availability

XC2V4000-5FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial embedded computing requiring stable component supply across extended product lifecycles.

Supply support for XC2V4000-5FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II family was designed for high-performance, high-density system-level integration in wireline/wireless infrastructure, video, and DSP applications-emphasizing I/O flexibility, clock management, and embedded memory.

FAQ

What is the maximum operating junction temperature for XC2V4000-5FF1152I?

The XC2V4000-5FF1152I is rated for industrial temperature range (–40°C to +100°C), with maximum junction temperature of +100°C under specified thermal conditions. This rating is confirmed in DS031 Module 3 (DC and Switching Characteristics) and applies to continuous operation with appropriate board-level thermal management.

Does XC2V4000-5FF1152I support partial reconfiguration?

Yes, XC2V4000-5FF1152I supports partial reconfiguration as documented in DS031 Module 2 (Functional Description). This capability allows dynamic replacement of logic modules during operation, enabling field-upgradable functions and runtime hardware adaptation without full device reset.

What I/O standards with Digitally Controlled Impedance (DCI) are supported by XC2V4000-5FF1152I?

XC2V4000-5FF1152I supports DCI for LVCMOS (1.5V–3.3V), SSTL (1.8V/2.5V/3.3V), HSTL (I/II/III/IV), GTL/GTLP, and LVDS_25_DCI/LVDSEXT_25_DCI. These are listed in DS031 Module 2 Table 3 and enable on-die series or split termination without external resistors.

Is XC2V4000-5FF1152I compatible with Xilinx ISE Design Suite?

Yes, XC2V4000-5FF1152I is fully supported by Xilinx ISE 14.7 and earlier versions, including synthesis, place-and-route, timing analysis, and bitstream generation. It is not supported by Vivado, which targets 7-series and newer architectures.

What is the configuration mode compatibility of XC2V4000-5FF1152I?

XC2V4000-5FF1152I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). Mode selection is controlled by M0–M2 pins at PROG_B assertion, as defined in DS031 Module 1.

XC2V4000-5FF1152I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II
Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
5760
Number of Logic Elements/Cells:
-
Total RAM Bits:
2211840
Number of I/O:
824
Number of Gates:
4000000
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1152-FCBGA (35x35)

XC2V4000-5FF1152I FAQ

1.How can I place an order for XC2V4000-5FF1152I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V4000-5FF1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V4000-5FF1152I reliable?

The price and inventory of XC2V4000-5FF1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V4000-5FF1152I is usually 5 days.

3.What payment methods are accepted for XC2V4000-5FF1152I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V4000-5FF1152I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V4000-5FF1152I?

XC2V4000-5FF1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V4000-5FF1152I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V4000-5FF1152I?

For technical support, including XC2V4000-5FF1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V4000-5FF1152I requirements.

6.How does Aetrix verify that XC2V4000-5FF1152I is sourced from the original manufacturer or authorized distributors?

All XC2V4000-5FF1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V4000-5FF1152I meets industry standards.

7.What is the process for return or replacement of XC2V4000-5FF1152I?

All XC2V4000-5FF1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V4000-5FF1152I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V4000-5FF1152I part is unused and in its original packaging.

Return procedure for XC2V4000-5FF1152I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2V4000-5FF1152I Tags

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  • XC2V4000-5FF1152I Datasheet
  • XC2V4000-5FF1152I Specifications
  • XC2V4000-5FF1152I Images
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