AMD XC2V4000-5FFG1152C

Overview

XC2V4000-5FFG1152C from Xilinx is a 4-million-system-gate Virtex-II platform FPGA in an 1152-pin flip-chip fine-pitch BGA (FF1152) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 23,040 Configurable Logic Blocks (CLBs), 120 Digital Clock Managers (DCMs), 120 Block SelectRAM™ modules (912 Kb total RAM), and supports up to 912 user I/Os with SelectIO™-Ultra technology including LVDS, SSTL, HSTL, and PCI-X interfaces. It is deployed in high-bandwidth telecom infrastructure and DSP-accelerated video processing systems.

For engineers reviewing the XC2V4000-5FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include verified 420 MHz internal clock speed, 840+ Mb/s I/O performance, DCM-based clock de-skew and phase-shifting capability, dual-port 18-Kb Block RAM configuration flexibility, and DCI-enabled on-die termination for single-ended standards.

Technical Context

The XC2V4000-5FFG1152C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support DDR input/output registers clocked by 180°-phase-shifted DCM outputs, enabling true double-data-rate signaling without external logic.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), fast carry chains, and horizontal cascade logic; each Block SelectRAM supports synchronous dual-port operation (e.g., 512 × 36 bits) with three read-during-write modes and is paired with a dedicated 18×18 multiplier for efficient MAC operations.

Key Specifications

Pinout & Package

XC2V4000-5FFG1152C uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.00 mm pitch), offering 912 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V4000-5FFG1152C, XC2V6000-5FF1152C offers higher capacity in identical packaging but consumes ~25% more power; XC3S1600E-4FG456C reduces cost and power significantly but lacks DCM-based phase alignment and DCI, limiting use in jitter-critical or high-speed memory interfaces.

Availability

XC2V4000-5FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, PCI-X server acceleration, and radar signal processing requiring stable component supply across extended production lifecycles.

Supply support for XC2V4000-5FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and historically known for industry-first FPGA architectures and EDA toolchains.

The Virtex-II family was designed for high-performance, IP-centric systems in telecom, wireless, and video - delivering platform-level integration of logic, memory, DSP, and I/O with predictable timing and silicon-proven reliability.

FAQ

What is the maximum internal clock speed supported by XC2V4000-5FFG1152C?

The XC2V4000-5FFG1152C supports up to 420 MHz internal clock speed per Advance Data specifications in DS031 (v3.5). This speed is achievable under worst-case commercial conditions (-5 speed grade, 0°C to +85°C) with proper PCB layout, power delivery, and timing closure using Xilinx ISE tools. Actual system frequency depends on design complexity and placement/routing.

Does XC2V4000-5FFG1152C support DDR memory interfaces?

Yes, XC2V4000-5FFG1152C natively supports DDR SDRAM and DDR SRAM interfaces through its SelectIO™-Ultra I/O banks, which include built-in DDR input and output registers. The device also supports DQS-aligned capture using DCM-generated 90°-phase-shifted clocks, enabling reliable 200+ MHz data rates with proper board-level termination and layout.

How many Block SelectRAM modules does XC2V4000-5FFG1152C contain?

The XC2V4000-5FFG1152C contains 120 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. These modules collectively deliver 912 Kb of on-chip memory, configurable from 16K × 1 to 512 × 36 bits per block, with three read-during-write modes and cascading capability for larger memory structures.

Is XC2V4000-5FFG1152C compatible with 5V-tolerant I/O standards?

No, XC2V4000-5FFG1152C is not 5V-tolerant. Its IOBs are designed for VCCO levels from 1.5 V to 3.3 V and lack internal 5V clamping. As inputs, they can interface with 5V signals only when external current-limiting resistors are used per Xilinx Tech Topic "5V Tolerant I/Os"; as outputs, they are incompatible with 5V bus environments without level-shifting circuitry.

What configuration modes are supported by XC2V4000-5FFG1152C?

The XC2V4000-5FFG1152C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at power-up, and configuration data may be encrypted using on-chip Triple-DES decryption for secure bitstream loading.