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AMD XC2V4000-5FFG1152I
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- Part No.:
- XC2V4000-5FFG1152I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2V4000-5FFG1152I.pdf
- Description:
- IC FPGA 824 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,004
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Product details
Overview
XC2V4000-5FFG1152I from Xilinx is a high-density Virtex-II platform FPGA with 4 million system gates, 23,040 configurable logic blocks (CLBs), 120 Digital Clock Manager (DCM) modules, and 912 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It operates across –40°C to +100°C industrial temperature range and supports LVDS, DDR, PCI-X, and SSTL I/O standards for telecom, networking, and video processing systems.
For engineers reviewing the XC2V4000-5FFG1152I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, DCM timing parameters, SelectRAM memory configurations, and industrial-grade thermal/power specifications directly traceable to DS031 (v3.5).
Technical Context
The XC2V4000-5FFG1152I implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with SRAM-based configuration, supporting partial reconfiguration and Triple DES bitstream encryption. Its architecture integrates 120 DCMs for precise clock de-skew, frequency synthesis (M/D ratio), and 1/256-period phase shifting - each driving up to four global clock MUX buffers.
Logic resources include 23,040 CLBs (each with two 4-input LUTs and dual storage elements), 120 18-Kb dual-port Block SelectRAM modules (configurable from 16K×1 to 512×36), and 720 dedicated 18×18 multipliers. I/O subsystem features Digitally Controlled Impedance (DCI) for on-chip termination across 19 single-ended and 6 differential standards including LVDS, LVPECL, and SSTL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 4 million - defines maximum combinational logic capacity for complex digital systems |
| Configurable Logic Blocks (CLBs) | 23,040 - each contains two 4-LUTs and dual flip-flops/latches for synchronous logic implementation |
| Digital Clock Managers (DCMs) | 120 - provide fully digital clock de-skew, multiplication/division, and fine-grained phase shift (1/256 period) |
| User I/O Pins | 912 - available in FF1152 flip-chip BGA package with 1.00 mm pitch and industrial temperature rating |
| Block SelectRAM Memory | 912 Kbits - 120 × 18-Kb dual-port RAM blocks, configurable as 16K×1 to 512×36 with read-during-write capability |
| Multiplier Blocks | 720 - dedicated 18×18-bit hardware multipliers optimized for DSP filtering and arithmetic acceleration |
| I/O Standards Support | 19 single-ended (LVCMOS, SSTL, HSTL, PCI-X) and 6 differential (LVDS, LVPECL, BLVDS) - enables direct interfacing with DDR SDRAM, QDR SRAM, and high-speed serial links |
Pinout & Package
XC2V4000-5FFG1152I uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.00 mm pitch), offering 912 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master/slave serial or SelectMAP mode; requires stable 0–100 MHz clock |
| DONE | Configuration Status Output | Open-drain output indicating successful configuration completion; pulled high externally after initialization |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, slave SelectMAP, etc.) at power-up; sampled on PROG_B rising edge |
| PROG_B | Program Initiate Input | Active-low signal that resets configuration logic and clears internal memory prior to new bitstream loading |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port enabling in-system programming, verification, and debug |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series/split termination for 19 single-ended I/O standards eliminates external resistors and improves signal integrity |
| Double Data Rate (DDR) I/O Registers | Integrated input/output DDR registers per IOB enable 840 Mb/s LVDS and source-synchronous interfaces without external logic |
| Active Interconnect Technology | Predictable routing delay independent of fanout via fourth-generation segmented routing matrix and hierarchical switch fabric |
| Triple DES Bitstream Encryption | On-chip decryptor secures configuration data using one or two 168-bit keys - prevents IP theft and unauthorized cloning |
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation - critical for adaptive computing and runtime protocol switching |
Applications
| Telecom Line Card Processing | High-Speed Network Switch Fabric |
|---|---|
Use Scenario: Implementing packet classification, header parsing, and traffic shaping in OC-192/STM-64 line cards. IC Role / Device Role / Timing Role: Configurable logic fabric executing custom ASIC-like datapaths with deterministic latency via DCM-controlled clocks. Use Value: 912 I/Os and LVDS support enable direct connection to multiple SerDes PHYs and DDR2 memory controllers without glue logic. |
Use Scenario: Building scalable, low-latency switching matrices in enterprise and data center routers. IC Role / Device Role / Timing Role: High-bandwidth interconnect engine managing parallel 16-bit × 200 MHz data paths between ingress/egress ports. Use Value: 120 DCMs allow independent clock domain management for each port interface, eliminating skew-induced packet loss. |
| Video Compression Acceleration | Industrial Machine Vision Controller |
Use Scenario: Real-time H.264 encoding/decoding pipelines with motion estimation and transform kernels. IC Role / Device Role / Timing Role: Programmable DSP accelerator leveraging 720 18×18 multipliers and 912 Kbits of block RAM for coefficient storage and frame buffering. Use Value: Dedicated multiplier blocks achieve >2× throughput over soft-core implementations for 1080p60 video streams. |
Use Scenario: Synchronizing multi-camera acquisition, FPGA-based image preprocessing, and GigE Vision output in factory automation. IC Role / Device Role / Timing Role: Deterministic real-time controller managing camera triggers, pixel clock generation, and DDR3 memory arbitration. Use Value: Industrial temperature rating (–40°C to +100°C) and 1.5V core supply ensure reliability in uncooled embedded enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V6000-5FF1152I | 6M system gates, 33,792 CLBs, 144 DCMs, 1104 I/Os - higher density and I/O count in same FF1152 package | Required for designs exceeding 4M gate utilization or needing >912 I/Os; larger die area increases power and cost | Select when XC2V4000-5FFG1152I resource usage exceeds 90% in place-and-route; verify thermal margin for same PCB footprint |
| XC3S1500-4FGG456C | Spartan-3 family, 1.5M system gates, 21,760 logic cells, no DCMs (uses DCMs only in Spartan-3E), 376 I/Os, commercial temp only | Lower-cost alternative for non-critical timing applications without advanced clock management or industrial temp requirement | Choose only if design fits within Spartan-3 logic budget and does not require DCM-based phase alignment or industrial operating range |
Compared with XC2V6000-5FF1152I, the XC2V4000-5FFG1152I offers optimal balance of gate count, I/O, and clock resources for mid-scale telecom and video systems; versus XC3S1500-4FGG456C, it provides guaranteed industrial temperature operation, integrated DCMs, and 2.7× more I/Os - essential for high-reliability infrastructure equipment.
Availability
XC2V4000-5FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial machine vision, and high-speed network switch applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XC2V4000-5FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984, specializing in FPGAs, SoCs, and adaptive compute acceleration platforms for high-performance digital systems.
The Virtex-II family was designed for high-speed, high-density applications in telecommunications, wireless infrastructure, and video processing - delivering industry-first features like DCI, integrated DCMs, and 840 Mb/s LVDS I/O in a scalable platform architecture.
FAQ
What is the maximum operating junction temperature for XC2V4000-5FFG1152I?
The XC2V4000-5FFG1152I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is defined in the DS031 (v3.5) datasheet Module 3, Electrical Characteristics, and applies to all speed grades (-4, -5, -6) in the FF1152 package. Thermal design must maintain junction temperature within this limit under worst-case power dissipation conditions.
Does XC2V4000-5FFG1152I support DDR2 memory interfaces?
Yes, XC2V4000-5FFG1152I supports DDR2 SDRAM interfaces through its SelectIO-Ultra I/O banks configured for SSTL_18_I or SSTL_18_II standards with programmable drive strength (2–24 mA) and on-die termination (DCI). The device's built-in DDR input/output registers and DCM-controlled clocking enable reliable 400+ Mbps per pin operation, as validated in Xilinx application notes XAPP466 and XAPP695.
How many 18-Kb Block SelectRAM modules does XC2V4000-5FFG1152I contain?
XC2V4000-5FFG1152I contains 120 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. These modules support configurations from 16K×1 to 512×36 bits, with three read-during-write modes and cascading capability. Total embedded RAM capacity is 912 Kbits, as specified in Table 1 of DS031-1 (v3.5) Module 1.
Is XC2V4000-5FFG1152I pin-compatible with other Virtex-II devices in the FF1152 package?
No - XC2V4000-5FFG1152I is not pin-compatible with other Virtex-II devices in the FF1152 package. While FF1152 is used across XC2V3000, XC2V4000, XC2V6000, and XC2V8000, Table 6 in DS031-1 confirms different I/O counts (720, 824, 824, 824 respectively), indicating distinct pin assignments and bank allocations. Pin compatibility exists only within the same device density grade and speed bin.
What configuration modes are supported by XC2V4000-5FFG1152I?
XC2V4000-5FFG1152I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is controlled via M0–M2 pins at power-up, with CCLK driving the clock and DONE signaling completion. Fast SelectMAP mode enables sub-100 ms configuration times for high-availability systems, as detailed in Module 2 of DS031.
XC2V4000-5FFG1152I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5760
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 2211840
- Number of I/O:
- 824
- Number of Gates:
- 4000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2V4000-5FFG1152I FAQ
1.How can I place an order for XC2V4000-5FFG1152I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V4000-5FFG1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V4000-5FFG1152I reliable?
The price and inventory of XC2V4000-5FFG1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V4000-5FFG1152I is usually 5 days.
3.What payment methods are accepted for XC2V4000-5FFG1152I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V4000-5FFG1152I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V4000-5FFG1152I?
XC2V4000-5FFG1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V4000-5FFG1152I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V4000-5FFG1152I?
For technical support, including XC2V4000-5FFG1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V4000-5FFG1152I requirements.
6.How does Aetrix verify that XC2V4000-5FFG1152I is sourced from the original manufacturer or authorized distributors?
All XC2V4000-5FFG1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V4000-5FFG1152I meets industry standards.
7.What is the process for return or replacement of XC2V4000-5FFG1152I?
All XC2V4000-5FFG1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V4000-5FFG1152I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V4000-5FFG1152I part is unused and in its original packaging.
Return procedure for XC2V4000-5FFG1152I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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