AMD XC2V4000-6FFG1152C

Overview

XC2V4000-6FFG1152C from Xilinx is a 4-million-system-gate Virtex-II platform FPGA in a 1152-pin flip-chip fine-pitch BGA (FFG1152) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 23,040 Configurable Logic Blocks (CLBs), 120 Digital Clock Managers (DCMs), 120 Block SelectRAM™ modules (912 Kbits total RAM), and supports up to 912 user I/Os with SelectIO™-Ultra technology including LVDS, SSTL, HSTL, and PCI-X interfaces. It is used in high-bandwidth networking line cards requiring deterministic clock management and DDR memory interfacing.

For engineers reviewing the XC2V4000-6FFG1152C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, validated I/O standard support (including DCI-enabled LVDCI_25 and LVDS_25_DCI), confirmed DCM timing parameters, and real-world FPGA deployment context for telecom infrastructure and video processing systems.

Technical Context

The XC2V4000-6FFG1152C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and dedicated global clock networks - enabling predictable timing closure independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs that provide 90°/180°/270° coarse shifts and 1/256-cycle fine-grained phase adjustment.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), carry chains, and horizontal cascade logic; each Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with three read-during-write modes. The device uses a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V VCCINT, 3.3 V VCCAUX, and programmable VCCO per bank.

Key Specifications

Pinout & Package

XC2V4000-6FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FFG1152) package with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high I/O count and signal integrity in dense PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V4000-6FFG1152C, the XC6VLX365T-2FF1156C reduces board area and power by ~40% but sacrifices 25% I/O count and native PCI-X compatibility; the XCVU3P-2FFVD1760E enables 5× logic capacity and hardened 100G interfaces but requires full RTL and PCB redesign due to architectural discontinuity.

Availability

XC2V4000-6FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial protocol gateway applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for XC2V4000-6FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II family was engineered for high-performance, high-density system-on-chip integration in wireline/wireless infrastructure, video processing, and DSP-intensive applications - emphasizing deterministic timing, multi-standard I/O flexibility, and embedded memory/multiplier resources.

FAQ

What is the maximum supported I/O standard voltage for XC2V4000-6FFG1152C?

The XC2V4000-6FFG1152C supports I/O voltages from 1.5 V to 3.3 V per bank, with VCCO configurable independently for each I/O bank. Valid standards include LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL2_I/II, SSTL3_I/II, HSTL_I–IV, and PCI-X at 3.3 V. The device does not support 5 V I/O directly but allows limited 5 V-tolerant input operation with external current-limiting resistors.

Does XC2V4000-6FFG1152C support DDR2 SDRAM interfaces?

Yes, XC2V4000-6FFG1152C supports DDR2 SDRAM through its SelectIO™-Ultra I/O banks with programmable drive strength, adjustable input delays, and DCM-controlled clock generation. It meets JEDEC DDR2 timing requirements up to 400 MHz data rate (200 MHz clock) when implemented with proper PCB layout and termination. The device's 912 I/Os allow full 32-bit or 64-bit data bus plus address/control signals without multiplexing.

How many Digital Clock Managers (DCMs) are available in XC2V4000-6FFG1152C?

XC2V4000-6FFG1152C contains 120 Digital Clock Managers (DCMs). Each DCM provides fully digital clock deskewing, frequency synthesis (M/D ratio), and coarse (90°/180°/270°) plus fine-grained (1/256 cycle) phase shifting. These DCMs are distributed across the die to minimize routing delay and support independent clock domains for multi-protocol interfaces like PCI-X, DDR, and LVDS.

Is XC2V4000-6FFG1152C compatible with Xilinx ISE Design Suite?

Yes, XC2V4000-6FFG1152C is fully supported by Xilinx ISE Design Suite 14.7 and earlier versions. It is not supported by Vivado, as Virtex-II devices were retired prior to Vivado's introduction. ISE provides complete synthesis, place-and-route, timing analysis, and bitstream generation for this device, including DCM wizard, Core Generator IP, and ChipScope Pro for in-system debugging.

What is the purpose of the VCCAUX supply in XC2V4000-6FFG1152C?

VCCAUX is a dedicated 3.3 V ±5% auxiliary power supply required for XC2V4000-6FFG1152C to operate DCMs, Block SelectRAM controllers, configuration logic, JTAG TAP controller, and internal bias circuitry. Unlike VCCO (which is bank-selectable), VCCAUX is global and must be stable across all operating conditions; decoupling capacitors must be placed near designated VCCAUX balls per Xilinx DS031 layout guidelines.