AMD XC2V4000-6FFG1517C

Overview

XC2V4000-6FFG1517C from Xilinx is a 4-million-system-gate Virtex-II platform FPGA in a 1517-pin flip-chip fine-pitch BGA (FF1517) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 23,040 Configurable Logic Blocks (CLBs), 120 Digital Clock Managers (DCMs), 120 Block SelectRAM™ modules (912 Kbits total RAM), and supports 912 user I/Os with SelectIO™-Ultra technology including LVDS, SSTL, HSTL, and PCI-X interfaces for high-speed telecom and networking systems.

For engineers reviewing the XC2V4000-6FFG1517C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, DCM timing parameters, CLB resource count, and FF1517 package-specific routing and thermal characteristics - all critical for FPGA-based system-on-module design, DDR memory controller implementation, and multi-standard interface consolidation.

Technical Context

The XC2V4000-6FFG1517C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and 40 double lines - enabling predictable, fanout-independent delays up to 420 MHz internal clock speed. Its IOBs support dual-data-rate (DDR) input/output registers with 180° phase-shifted clocks generated by integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, two storage elements (DFF/latch), carry chains, and horizontal cascade logic; each Block SelectRAM provides dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with read-during-write capability. The device uses 1.5V VCCINT core supply, 3.3V VCCAUX auxiliary supply, and programmable VCCO per bank (1.5V–3.3V).

Key Specifications

Pinout & Package

XC2V4000-6FFG1517C is housed in a 40 mm × 40 mm flip-chip fine-pitch BGA (FF1517) package with 1517 balls, 912 user I/Os, and 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK–TDO, TMS, HSWAP_EN, DXN/DXP, RSVD). Thermal performance is enhanced by flip-chip construction enabling higher power density handling versus wire-bond alternatives.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2V6000-6FF1152C and XC2V3000-6FF896C, the XC2V4000-6FFG1517C uniquely balances 4M logic resources with maximum 912 I/Os in the FF1517 package - making it optimal for I/O-bound applications such as multi-protocol bridging, high-channel-count data acquisition, and memory-rich embedded vision systems where both pin count and logic density are concurrently critical.

Availability

XC2V4000-6FFG1517C is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed memory subsystems, PCI-X peripheral interfacing, and multi-standard video processing requiring stable component supply and long-term obsolescence management.

Supply support for XC2V4000-6FFG1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for hardware acceleration and system-level integration.

The Virtex-II family was designed for high-performance, high-density applications in telecommunications, networking, and digital signal processing - delivering scalable logic, memory, and I/O resources with advanced clock management and security features.

FAQ

What is the maximum operating frequency of the XC2V4000-6FFG1517C internal logic?

The XC2V4000-6FFG1517C supports up to 420 MHz internal clock speed as specified in the Virtex-II Advance Data documentation. This applies to synchronous logic paths under typical conditions with -6 speed grade timing models. Actual achievable frequency depends on design placement, routing, and clock domain constraints - verified through Xilinx ISE timing analysis using the -6 speed file for FF1517 package.

Does the XC2V4000-6FFG1517C support DDR2 memory interfaces natively?

The XC2V4000-6FFG1517C does not include hard DDR2 PHY blocks, but its SelectIO™-Ultra I/Os with built-in DDR input/output registers and DCM-generated 180° phase-shifted clocks enable robust soft DDR2 controller implementation. Supported I/O standards include SSTL2_I/II and SSTL3_I/II at 2.5V/3.3V, meeting JEDEC DDR2 signaling requirements when combined with proper board layout and termination.

How many Block SelectRAM™ modules does the XC2V4000-6FFG1517C contain?

The XC2V4000-6FFG1517C contains 120 Block SelectRAM™ modules, each providing 18 Kb of dual-port RAM. This yields 912 Kbits of total block RAM, configurable in depths from 16K×1 to 512×36 bits per module, with three read-during-write modes and cascading capability for larger memory structures.

Is the XC2V4000-6FFG1517C compatible with Xilinx ISE 14.7 software?

No - the XC2V4000-6FFG1517C is supported only by Xilinx ISE Design Suite versions up to 10.1, as confirmed in DS031 v3.5 documentation. ISE 14.7 targets 7-series and later FPGAs. Using ISE 10.1 ensures correct place-and-route, timing closure, and bitstream generation for the Virtex-II architecture and -6 speed grade.

What power supplies are required for the XC2V4000-6FFG1517C?

The XC2V4000-6FFG1517C requires three dedicated supplies: 1.5V ±3% for VCCINT (core logic), 3.3V ±5% for VCCAUX (auxiliary circuits including DCMs and JTAG), and programmable VCCO per I/O bank (1.5V, 1.8V, 2.5V, or 3.3V depending on selected I/O standard). All supplies must meet transient response and decoupling requirements specified in Module 3 of DS031.