AMD XC2V40-4CSG144C
- Part No.:
- XC2V40-4CSG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-TFBGA, CSPBGA
- Datasheet:
-
XC2V40-4CSG144C.pdf
- Description:
- IC FPGA 88 I/O 144CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2V40-4CSG144C from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 144-ball chip-scale BGA (CSG144) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 256 Configurable Logic Blocks (CLBs), 8 18×18 multipliers, 4 Block SelectRAM™ modules (72 Kbits total), and 4 Digital Clock Managers (DCMs), targeting high-speed I/O interfacing and embedded logic acceleration in telecom and DSP systems.
For engineers reviewing the XC2V40-4CSG144C datasheet, pinout, applications, or equivalent options, key selection criteria include its 88-user-I/O count, 1.5 V core supply, DCI-enabled LVCMOS/LVDS I/O support, and compatibility with Xilinx Foundation/Alliance design tools for SRAM-based in-system configuration.
Technical Context
The XC2V40-4CSG144C implements a hierarchical architecture with IOBs supporting DDR registers, programmable sink current (2–24 mA), and Digitally Controlled Impedance (DCI) for on-die termination across 19 single-ended and 6 differential I/O standards. Its CLB array comprises 256 blocks (8×8 grid), each containing four slices with dual 4-input LUTs, dual flip-flops/latches, and fast carry chains.
Routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column, predictable delay independent of fanout, and shared timing models across IOBs, CLBs, SelectRAM, multipliers, and DCMs. Each of the 4 DCMs provides de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 40,000 - logic capacity benchmark aligned with ASIC gate count for RTL synthesis estimation |
| User I/O Pins | 88 - maximum configurable bidirectional I/Os in CSG144 package, excluding 15 dedicated control pins |
| Core Voltage (VCCINT) | 1.5 V - fixed low-voltage supply enabling reduced dynamic power and higher switching density |
| Configurable Logic Blocks | 256 CLBs - each contains 4 slices with dual LUTs and dual storage elements, supporting combinatorial logic and synchronous state machines |
| Block RAM | 4 × 18-Kb dual-port SelectRAM™ - 72 Kbits total, configurable from 16K×1 to 512×36, with read-during-write capability |
| Digital Clock Managers | 4 DCMs - fully digital, self-calibrating clock modules for de-skew, multiplication/division, and ±180° phase shift |
| I/O Standards Support | LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V), PCI, SSTL, HSTL, LVDS, BLVDS, LVPECL - enabling direct interface to memory, processors, and serial links |
Pinout & Package
XC2V40-4CSG144C is housed in a 144-ball Chip-Scale BGA (CSG144) package with 0.80 mm pitch, 12 mm × 12 mm body size, and Pb-free construction. The package supports wire-bond interconnect and delivers 88 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master or slave serial/SelectMAP mode; requires stable 0–100 MHz clock |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream loading and device initialization |
| M0–M2 | Mode Selection Inputs | Three-pin binary encoding selects one of five configuration modes (slave-serial, master-serial, etc.) at power-up |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts configuration sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and verification |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series or split termination resistors auto-matched to external reference resistors, eliminating discrete termination components for LVCMOS/HSTL/SSTL |
| DDR I/O Registers | Dual-edge-clocked input/output registers per IOB enable true double-data-rate signaling without external FIFOs or clock doublers |
| 18×18 Multiplier Blocks | Hardwired arithmetic units delivering 36-bit product in single cycle, accelerating FIR filters, FFTs, and DSP datapaths |
| SelectRAM™ Memory Hierarchy | 72 Kbits of block RAM + distributed RAM resources provide flexible, low-latency embedded memory for buffers, FIFOs, and lookup tables |
| Triple-DES Bitstream Encryption | On-chip hardware decryptor secures configuration data using one or two 168-bit keys, preventing IP theft during field programming |
Applications
| Telecom Line Card Interface | Industrial Motion Control |
|---|---|
Use Scenario: Implementing protocol bridging and packet processing between T1/E1 framer ICs and backplane Ethernet switches in modular base station equipment. IC Role / Device Role / Timing Role: Programmable logic fabric handles time-division multiplexing, HDLC framing, and CRC generation while DCMs synchronize to 2.048 MHz line clocks. Use Value: 88 user I/Os directly connect to multiple framer devices; LVDS I/O supports 840 Mb/s backplane signaling; DCI eliminates external termination for HSTL memory interfaces. |
Use Scenario: Real-time closed-loop servo control in CNC machine tool drives, coordinating encoder feedback, PWM generation, and safety monitoring. IC Role / Device Role / Timing Role: FPGA executes position loop algorithms at 20 kHz, manages isolated I/O via parallel bus, and routes fault signals to safety PLCs. Use Value: 4 DCMs generate jitter-free 20 MHz PWM carrier and synchronized 100 kHz sampling clocks; 256 CLBs implement custom PID+feedforward controllers with <500 ns latency. |
| Medical Imaging Data Acquisition | Avionics Display Processor |
Use Scenario: Aggregating parallel ADC streams from ultrasound transducer arrays and compressing raw RF data before transmission to host processor. IC Role / Device Role / Timing Role: High-speed I/O captures 16-bit × 40 MSPS ADC outputs; block RAM buffers frames; multipliers accelerate wavelet transforms. Use Value: LVDS inputs handle 800 Mb/s aggregate ADC data; 72 Kbits block RAM stores two full 1024-sample frames; 18×18 multipliers execute real-time beamforming coefficients. |
Use Scenario: Rendering synthetic vision graphics and overlaying flight symbology onto cockpit displays in certified avionics systems. IC Role / Device Role / Timing Role: Configurable logic generates VGA/TFT timing, composites video layers, and validates ARINC 661 widget states. Use Value: 1.5 V core enables low-power operation in convection-cooled enclosures; boundary-scan (IEEE 1149.1) supports DO-254 compliance testing; encrypted bitstream protects display firmware IP. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V40-5CSG144C | Same architecture and package, but -5 speed grade offers 15% higher maximum clock frequency and tighter setup/hold margins | Suitable for designs requiring >120 MHz system clocks or stricter timing closure in high-fanout paths | Select when timing margin is critical and cost premium for faster grade is acceptable |
| XC3S50-4PQG208C | Spartan-3 generation; 50K logic cells, 208-pin PQFP package, 1.2 V core, no DCMs (only DLL), no DCI, lower I/O count (112) | Better suited for cost-sensitive, lower-performance control logic where advanced clock management or on-die termination is unnecessary | Choose for non-critical timing applications with simpler I/O requirements and budget constraints |
Compared with XC2V40-4CSG144C, the -5 speed grade improves timing headroom without changing footprint or toolflow, while the Spartan-3 alternative trades clock precision and I/O flexibility for lower unit cost and power-making it viable only where DCM-based skew control and DCI are not required.
Availability
XC2V40-4CSG144C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and avionics display systems requiring stable component supply across extended production lifecycles.
Supply support for XC2V40-4CSG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference accelerators for high-performance computing and embedded systems.
The Virtex-II family was designed for high-density, high-speed applications including telecommunications, wireless infrastructure, networking, video processing, and DSP-emphasizing I/O bandwidth, clock management, and embedded memory integration.
FAQ
What is the maximum operating frequency of the XC2V40-4CSG144C?
The XC2V40-4CSG144C has a -4 speed grade, meaning its internal logic can operate up to 400 MHz under typical conditions, with DCM outputs supporting up to 420 MHz (advance data). Actual achievable frequency depends on design complexity, routing, and I/O standard selection-verified via Xilinx ISE timing analysis using the specific -4 speed file.
Does the XC2V40-4CSG144C support JTAG boundary-scan testing?
Yes, the XC2V40-4CSG144C fully complies with IEEE 1149.1 (JTAG) and supports BYPASS, SAMPLE, PRELOAD, EXTEST, INTEST, HIGHZ, IDCODE, and USERCODE instructions. Its Test Access Port (TAP) enables configuration, debug, and production test without requiring additional test circuitry.
Can the XC2V40-4CSG144C interface directly with DDR SDRAM?
Yes, the XC2V40-4CSG144C supports DDR SDRAM interfaces through its SelectIO-Ultra I/O banks, which provide dedicated DDR input and output registers, programmable drive strength, and SSTL_2_I/II compatibility. External termination and careful PCB layout are required, but no external logic is needed for basic read/write operations.
Is bitstream encryption available on the XC2V40-4CSG144C?
Yes, the XC2V40-4CSG144C includes on-chip Triple-DES decryption hardware. When enabled, it secures the configuration bitstream using one or two 168-bit keys stored in non-volatile memory, preventing unauthorized readback or cloning of the programmed logic design.
What development tools are compatible with the XC2V40-4CSG144C?
The XC2V40-4CSG144C is supported by Xilinx Foundation Series and Alliance Series design environments, including ISE 6.x–14.7. These tools provide VHDL/Verilog synthesis, place-and-route, timing analysis, and configuration bitstream generation specifically validated for the Virtex-II architecture and -4 speed grade.
XC2V40-4CSG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 144-TFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 64
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 73728
- Number of I/O:
- 88
- Number of Gates:
- 40000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-LCSBGA (12x12)
XC2V40-4CSG144C FAQ
1.How can I place an order for XC2V40-4CSG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V40-4CSG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V40-4CSG144C reliable?
The price and inventory of XC2V40-4CSG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V40-4CSG144C is usually 5 days.
3.What payment methods are accepted for XC2V40-4CSG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V40-4CSG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V40-4CSG144C?
XC2V40-4CSG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V40-4CSG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V40-4CSG144C?
For technical support, including XC2V40-4CSG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V40-4CSG144C requirements.
6.How does Aetrix verify that XC2V40-4CSG144C is sourced from the original manufacturer or authorized distributors?
All XC2V40-4CSG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V40-4CSG144C meets industry standards.
7.What is the process for return or replacement of XC2V40-4CSG144C?
All XC2V40-4CSG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V40-4CSG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V40-4CSG144C part is unused and in its original packaging.
Return procedure for XC2V40-4CSG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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