AMD XC2V40-4CSG144I
- Part No.:
- XC2V40-4CSG144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-TFBGA, CSPBGA
- Datasheet:
-
XC2V40-4CSG144I.pdf
- Description:
- IC FPGA 88 I/O 144CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2V40-4CSG144I from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 144-ball chip-scale BGA (CSG144) package, rated for industrial temperature range (–40°C to +100°C), with 88 user I/Os, 256 CLB slices, and four Digital Clock Managers (DCMs). It implements configurable logic, dual-port Block SelectRAM, 18×18 multipliers, and supports LVDS, PCI-X, and DDR I/O standards for telecom and embedded control applications.
For engineers reviewing the XC2V40-4CSG144I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, DCM timing parameters, CLB resource count, and industrial-grade thermal specifications - all confirmed from Xilinx DS031 (v3.5) November 2007.
Technical Context
The XC2V40-4CSG144I integrates four DCM modules for precise clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution), each driving up to four global clock MUX buffers. Its IOBs support DDR input/output registers with 180° phase-shifted clocks generated by DCMs, enabling true double-data-rate signaling without external circuitry.
Configurable Logic Blocks contain 256 slices (each with two 4-LUTs, two flip-flops/latches, carry chains, and cascade logic), while Block SelectRAM provides 4 × 18-Kb dual-port RAM blocks (configurable from 512×36 to 16K×1), each paired with a dedicated 18×18 multiplier for efficient DSP operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 40,000 - defines logic density for gate-equivalent synthesis targeting ASIC replacement or IP-core integration. |
| CLB Slices | 256 - determines maximum combinational logic capacity and register count (up to 512 flip-flops). |
| User I/O Pins | 88 - fixed count for CSG144 package; supports 19 single-ended and 6 differential I/O standards including LVDS and PCI-X. |
| Block RAM | 4 × 18-Kb dual-port - enables independent read/write ports per block, supporting FIFOs, buffers, and memory-mapped peripherals. |
| DCM Modules | 4 - provides on-chip clock deskew, multiplication/division, and sub-cycle phase adjustment for synchronous system timing. |
| Multiplier Blocks | 8 - each 18×18-bit; usable independently of Block RAM for arithmetic-intensive functions like filtering or FFT stages. |
| Core Voltage (VCCINT) | 1.5 V - requires low-noise, tightly regulated supply; dictates power integrity layout and decoupling strategy. |
Pinout & Package
XC2V40-4CSG144I uses a 144-ball Chip-Scale BGA (CSG144) package with 0.80 mm pitch, 12 mm × 12 mm body size, and wire-bond interconnect. Pb-free compliant per Xilinx ordering convention.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial or SelectMAP mode; must be clean, monotonic, and stable before PROG_B release. |
| DONE | Configuration Status Output | Open-drain signal pulled high externally; goes high when configuration completes successfully and device enters user mode. |
| M0, M1, M2 | Mode Selection Inputs | Set configuration mode at power-up (e.g., M2:M0 = 000 → slave serial; 010 → master SelectMAP); latched on PROG_B rising edge. |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and forces reinitialization; must be held high for valid operation. |
| TCK, TMS, TDI, TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port; enables in-system programming, verification, and debug without dedicated programming hardware. |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series termination for LVCMOS, SSTL, HSTL, and GTL standards eliminates external resistors and improves signal integrity at high speeds. |
| DDR I/O Registers | Dual-edge capture and launch using DCM-generated complementary clocks enables true 840 Mb/s LVDS data rates without external DDR PHY. |
| Active Interconnect Routing | Predictable delay routing matrix with 24 long lines per row/column ensures timing closure independent of fanout for high-speed designs. |
| SelectRAM Memory Hierarchy | 4 × 18-Kb dual-port blocks + distributed RAM provide flexible memory mapping for FIFOs, caches, and lookup tables with zero external latency. |
| Triple-DES Bitstream Encryption | On-chip decryptor secures configuration bitstream against cloning or reverse engineering; supports one or two key sets for secure field updates. |
Applications
| Telecom Line Card Control | Industrial Motion Controller |
|---|---|
|
Use Scenario: Real-time protocol bridging between TDM backplane and Ethernet packet interfaces in carrier-grade access equipment. IC Role / Device Role / Timing Role: Configurable logic fabric implements HDLC framing, CRC generation, and clock domain crossing between 2.048 MHz E1 and 125 MHz Ethernet clocks. Use Value: Four DCMs enable simultaneous de-skew of E1 recovery clock and Ethernet reference clock, reducing jitter accumulation across multiple clock domains. |
Use Scenario: Closed-loop servo positioning with analog encoder feedback, PWM motor drive, and safety monitoring in CNC machinery. IC Role / Device Role / Timing Role: FPGA implements PID computation, quadrature decoding, fault detection logic, and isolated I/O interface - all synchronized to a 50 MHz system clock. Use Value: 88 user I/Os support 16-channel analog input, 8 PWM outputs, 4 isolated digital inputs, and SPI communication - eliminating external glue logic. |
| Video Frame Buffering | PCI-X Peripheral Bridge |
|
Use Scenario: Intermediate buffering and format conversion between 720p60 HDMI source and SDI output in broadcast production switchers. IC Role / Device Role / Timing Role: Dual-port Block SelectRAM stores full video frames; CLBs perform pixel interpolation and color space conversion in real time. Use Value: 4 × 18-Kb RAM blocks provide 72 KB of on-chip frame storage - sufficient for two 720×480@60fps YUV422 frames with zero external memory latency. |
Use Scenario: High-bandwidth interface between legacy PCI-X 133 MHz host bus and custom ASIC in test instrumentation systems. IC Role / Device Role / Timing Role: FPGA acts as PCI-X target endpoint, handling address decoding, burst arbitration, and byte-enable masking for 64-bit transfers. Use Value: Native PCI-X compliance at 3.3 V allows direct connection to host bridge without level-shifting or timing compensation circuits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V40-5CSG144C | Commercial temperature grade (0°C to +85°C); faster speed grade (-5 vs -4), enabling higher clock frequencies in non-industrial environments. | Lacks industrial thermal qualification; unsuitable for extended ambient or uncooled enclosures. | Select only if operating environment remains within commercial temperature limits and timing margin is critical. |
| XC3S200-4PQ208I | Spartan-3 family; 200K logic cells, no DCMs (only DLL), no DCI, lower I/O count (173), but supports 3.3 V-only I/O and simpler configuration. | Targeted at cost-sensitive, lower-performance applications where clock management and on-die termination are not required. | Choose when design prioritizes BOM cost over advanced clocking or signal integrity features - not a drop-in replacement. |
Compared with XC2V40-4CSG144I, the XC2V40-5CSG144C offers tighter timing margins at lower temperature risk, while the XC3S200-4PQ208I trades DCM precision and DCI for lower cost and simplified power delivery - requiring PCB redesign and logic re-synthesis.
Availability
XC2V40-4CSG144I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, broadcast video processing, and PCI-X peripheral bridging requiring stable component supply across extended lifecycle programs.
Supply support for XC2V40-4CSG144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, with global design and support infrastructure.
The Virtex-II family was engineered for high-performance, IP-centric system integration in telecom, wireless, and video applications - emphasizing clock management, memory hierarchy, and multi-standard I/O flexibility.
FAQ
What is the maximum number of user I/O pins supported by XC2V40-4CSG144I?
The XC2V40-4CSG144I supports exactly 88 user I/O pins in its CSG144 package, as confirmed in Table 6 of Xilinx DS031 (v3.5). This count excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. No configuration or speed grade variation affects this I/O count for the CSG144 footprint.
Does XC2V40-4CSG144I support LVDS signaling, and what are the electrical requirements?
Yes, XC2V40-4CSG144I supports LVDS_25 and LVDS_33 standards with 250–400 mV differential output voltage (VOD), as specified in Table 2 of DS031-2. It requires VCCO = 2.5 V or 3.3 V respectively, no input VREF, and uses dedicated differential I/O pairs routed to the same switch matrix - confirmed in Module 2, Functional Description.
How many Digital Clock Managers (DCMs) are integrated into XC2V40-4CSG144I?
The XC2V40-4CSG144I contains four Digital Clock Managers (DCMs), as documented in Table 1 ("Virtex-II Family Members") of DS031-1. Each DCM provides clock deskew, multiplication/division (M/D ratio), and fine phase shifting (1/256 period resolution), and can drive up to four global clock MUX buffers.
Is XC2V40-4CSG144I compatible with Pb-free assembly processes?
Yes, XC2V40-4CSG144I uses a Pb-free CSG144 package, explicitly designated by the "G" suffix per Xilinx's ordering nomenclature (e.g., CSG144 = Pb-free chip-scale BGA). It complies with JEDEC J-STD-020 moisture sensitivity level (MSL) and RoHS Directive 2011/65/EU, as stated in Module 1, Page 2 and Ordering Examples.
What configuration modes does XC2V40-4CSG144I support, and how are they selected?
XC2V40-4CSG144I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). Mode selection is controlled by the M2:M0 pins sampled at PROG_B rising edge, as defined in Figure 2 and Section "Configuration" of DS031-1. All modes use the same CCLK, DIN/DOUT, and DONE signals.
XC2V40-4CSG144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 144-TFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 64
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 73728
- Number of I/O:
- 88
- Number of Gates:
- 40000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-LCSBGA (12x12)
XC2V40-4CSG144I FAQ
1.How can I place an order for XC2V40-4CSG144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V40-4CSG144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V40-4CSG144I reliable?
The price and inventory of XC2V40-4CSG144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V40-4CSG144I is usually 5 days.
3.What payment methods are accepted for XC2V40-4CSG144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V40-4CSG144I transactions.
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4.How is shipping managed for XC2V40-4CSG144I?
XC2V40-4CSG144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V40-4CSG144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V40-4CSG144I?
For technical support, including XC2V40-4CSG144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V40-4CSG144I requirements.
6.How does Aetrix verify that XC2V40-4CSG144I is sourced from the original manufacturer or authorized distributors?
All XC2V40-4CSG144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V40-4CSG144I meets industry standards.
7.What is the process for return or replacement of XC2V40-4CSG144I?
All XC2V40-4CSG144I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V40-4CSG144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V40-4CSG144I part is unused and in its original packaging.
Return procedure for XC2V40-4CSG144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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