AMD XC2V40-4FG256I

Overview

XC2V40-4FG256I from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FG256) package, operating over –40°C to +100°C industrial temperature range. It integrates 256 Configurable Logic Blocks (CLBs), 8 dedicated 18×18 multipliers, 4 Digital Clock Managers (DCMs), and supports up to 88 user I/Os with SelectIO-Ultra technology including LVDS, PCI, and SSTL interfaces. It is used in telecom line-card control, industrial protocol bridging, and embedded video preprocessing.

For engineers reviewing the XC2V40-4FG256I datasheet, pinout, applications, or equivalent options, key selection considerations include its 1.5 V core supply, DCI-enabled on-die termination for HSTL/SSTL, dual-port Block SelectRAM configuration (up to 512 × 36 bits), and DCM-based clock deskew and phase-shifting for synchronous interface timing closure.

Technical Context

The XC2V40-4FG256I implements a hierarchical SRAM-based architecture with four major logic resources: CLBs containing dual 4-input LUTs and flip-flops, 18-Kb dual-port Block SelectRAM modules, dedicated 18×18 multipliers, and fully digital DCMs for clock synthesis and skew compensation. Its Active Interconnect routing provides predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, PCI, SSTL, HSTL) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) enabling on-chip series or split termination. The FG256 package uses 1.00 mm pitch wire-bond BGA construction and excludes flip-chip I/O enhancements present in larger Virtex-II variants.

Key Specifications

Pinout & Package

XC2V40-4FG256I uses the FG256 (Fine-Pitch BGA, 1.00 mm pitch, 17 mm × 17 mm) wire-bond package with 256 balls arranged in a 16 × 16 array. Pin definitions are documented in DS031 Module 4 (Pinout Information), with 88 user I/Os, 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD), and power/ground balls distributed across the perimeter and interior.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V40-4FG256I, XCV300E-4PQ240I offers higher gate count but lacks DCM precision and DCI, increasing board complexity; XC3S200-4PQ240I trades integrated memory and clocking for lower cost and power, limiting suitability for synchronous high-speed I/O or DSP workloads.

Availability

XC2V40-4FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and embedded vision applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for XC2V40-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance, system-level integration.

The Virtex-II family was designed for high-speed, high-density logic implementation in telecommunications, networking, and DSP applications-emphasizing clock management, memory hierarchy, and I/O flexibility over raw gate count.

FAQ

What is the maximum operating temperature range for the XC2V40-4FG256I?

The XC2V40-4FG256I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is guaranteed across all speed grades and I/O configurations, and applies to both configuration and user logic operation. Thermal derating is not required within this range, and the device meets Xilinx's production qualification standards for industrial environments.

Does the XC2V40-4FG256I support LVDS I/O at 840 Mb/s?

Yes, the XC2V40-4FG256I supports LVDS signaling at up to 840 Mb/s per differential pair, as confirmed in DS031 Module 1. This capability relies on its SelectIO-Ultra architecture, matched internal termination, and DCM-synchronized DDR registers. Actual achievable rate depends on PCB layout, termination, and signal integrity-but the silicon and IOB design are validated for this performance level.

How many Block SelectRAM modules does the XC2V40-4FG256I contain, and what are their configurations?

The XC2V40-4FG256I contains 4 Block SelectRAM modules, each 18 Kb in size. Each block supports dual-port operation with independent read/write clocks and three read-during-write modes. Configurable depths/widths include 16K×1, 8K×2, 4K×4, 2K×9, 1K×18, and 512×36 bits. These blocks are essential for embedded FIFOs, coefficient storage, and frame buffers in XC2V40-4FG256I-based designs.

Can the XC2V40-4FG256I perform bitstream encryption?

Yes, the XC2V40-4FG256I supports Triple DES (3DES) bitstream encryption using an on-chip decryptor. One or two 3DES key sets can be programmed into the device to secure configuration data against unauthorized readback or cloning. This feature is enabled during bitstream generation in Xilinx ISE and requires proper key management-no additional hardware is needed for XC2V40-4FG256I implementation.

What configuration modes are supported by the XC2V40-4FG256I?

The XC2V40-4FG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at power-up. Master modes use internal oscillators to drive CCLK; SelectMAP supports parallel loading at up to 100 MHz; boundary-scan enables in-system programming and verification without dedicated configuration circuitry.