AMD XC2V40-4FGG256C

Overview

XC2V40-4FGG256C from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, featuring 8 Configurable Logic Blocks (CLBs), 4 Digital Clock Managers (DCMs), 4 18-Kb Block SelectRAM™ modules, and support for LVDS, PCI, and SSTL I/O standards. It targets low-density high-performance logic in telecom and embedded control applications requiring deterministic clock management and dual-port memory.

For engineers reviewing the XC2V40-4FGG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard compatibility, DCM timing parameters, CLB resource count, and wire-bond BGA package constraints - all specific to the -4 speed grade and commercial temperature range (0°C to +85°C).

Technical Context

The XC2V40-4FGG256C implements a 0.15 µm/0.12 µm 8-layer metal CMOS architecture with SRAM-based configuration, 1.5V core supply (VCCINT), and separate 3.3V auxiliary (VCCAUX) and I/O (VCCO) supplies. Its IOBs support 19 single-ended and 6 differential I/O standards including LVDS, SSTL, and PCI-X, with Digitally Controlled Impedance (DCI) for on-chip termination.

Each of its 8 CLBs contains 4 slices (256 total LUTs), two 18-bit x 18-bit multipliers, and four 18-Kb dual-port Block SelectRAM modules delivering up to 72 Kbits of embedded RAM. Four DCMs provide de-skewed clock distribution, integer/non-integer frequency synthesis, and ±180° phase shifting with 1/256-cycle resolution.

Key Specifications

Pinout & Package

XC2V40-4FGG256C uses the FGG256 package: a 17 mm × 17 mm, 1.00 mm pitch, Pb-free wire-bond ball grid array with 256 solder balls arranged in a 16 × 16 array. Pin definitions follow Xilinx's standardized Virtex-II IOB layout, with dedicated power (VCCINT, VCCAUX, VCCO), ground (GND), configuration (PROG_B, CCLK, DONE), and boundary-scan (TCK/TMS/TDI/TDO) balls. All user I/Os are assigned to perimeter rows A–P and columns 1–16 per DS031 Module 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V40-4FGG256C, the -5 variant offers higher guaranteed performance at identical density and footprint, while the XC2V80-4FGG256C provides scalable logic resources within the same package - enabling cost-optimized prototyping followed by seamless migration to higher gate counts.

Availability

XC2V40-4FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and embedded vision systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V40-4FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance digital system design.

The Virtex-II family was engineered for high-speed, high-density logic implementation in telecommunications, networking, and DSP applications - emphasizing clock precision, memory integration, and I/O flexibility over cost-optimized alternatives.

FAQ

What is the maximum operating junction temperature for XC2V40-4FGG256C?

The XC2V40-4FGG256C is rated for commercial temperature range operation, with a maximum junction temperature (Tj) of +85°C. This specification applies under continuous operation with proper PCB thermal design, including adequate copper pour and airflow. The 'C' suffix in the part number explicitly denotes this commercial-grade thermal envelope, and operation beyond +85°C may result in configuration loss or timing violation.

Does XC2V40-4FGG256C support LVDS I/O without external termination resistors?

Yes, XC2V40-4FGG256C supports LVDS signaling with on-chip termination via its Digitally Controlled Impedance (DCI) feature when configured as LVDS_25_DCI or LVDS_33_DCI. This eliminates the need for external 100 Ω differential termination resistors, reducing BOM count and PCB area - provided VCCO is set to 2.5 V or 3.3 V respectively and DCI calibration is enabled during configuration.

How many independent clock domains can be managed using the DCMs in XC2V40-4FGG256C?

XC2V40-4FGG256C integrates four Digital Clock Managers (DCMs), each capable of generating up to two independent output clocks with distinct frequencies, phases, and duty cycles. This enables direct support for at least four fully autonomous clock domains - for example, one for PCI interface logic, one for ADC sampling, one for video pixel clocking, and one for internal control state machine - all synchronized to a common reference without external PLLs.

Is XC2V40-4FGG256C compatible with modern Xilinx development tools?

XC2V40-4FGG256C is supported exclusively by legacy Xilinx ISE Design Suite (v14.7 and earlier). It is not compatible with Vivado, as Virtex-II architecture was deprecated prior to Vivado's introduction. Users must obtain ISE WebPACK or licensed ISE versions from AMD's archived tool repository and use Spartan-3 or later devices for Vivado-based workflows.

Can XC2V40-4FGG256C perform partial reconfiguration in-system?

Yes, XC2V40-4FGG256C supports partial reconfiguration through its SelectMAP interface and dedicated configuration logic. This allows dynamic swapping of functional modules (e.g., changing filter coefficients or communication protocols) without resetting the entire device or halting other active logic - provided the design adheres to Xilinx's floorplanning and routing constraints for reconfigurable partitions as defined in UG079.