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AMD XC2V40-4FGG256I
- Part No.:
- XC2V40-4FGG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2V40-4FGG256I.pdf
- Description:
- IC FPGA 88 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,413
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Product details
Overview
XC2V40-4FGG256I from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, rated for industrial temperature range (–40°C to +100°C), with 88 user I/Os, four Digital Clock Managers (DCMs), and 1.5 V core supply. It implements configurable logic blocks (CLBs), 18-Kb Block SelectRAM, and 18×18 multipliers for telecom and DSP applications requiring high-speed I/O and deterministic clock management.
For engineers reviewing the XC2V40-4FGG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, DCI termination capability, and industrial-grade thermal performance - all specific to the XC2V40-4FGG256I variant.
Technical Context
The XC2V40-4FGG256I integrates 256 CLB slices (1,024 LUTs), four 18-Kb dual-port Block SelectRAM modules (72 Kb total RAM), and eight 18×18 multipliers. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.
It features four DCMs supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period steps). I/Os support 19 single-ended standards (including LVCMOS15–33, SSTL, HSTL, PCI-X) and six differential standards (LVDS, BLVDS, LVPECL), with Digitally Controlled Impedance (DCI) for on-chip series/split termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 40,000 - defines logic capacity for synthesizing medium-complexity digital systems |
| User I/O Pins | 88 - fixed count for FGG256 package; supports mixed-voltage I/O banks (1.5V–3.3V) |
| Core Voltage (VCCINT) | 1.5 V ± 3% - powers CLBs and internal logic; requires tight regulation for timing stability |
| DCM Count | 4 - enables independent clock domain management, jitter reduction, and phase-aligned outputs |
| Block RAM | 4 × 18-Kb dual-port - provides 72 Kb embedded memory; configurable as 16K×1 to 512×36 |
| I/O Standards | 19 single-ended + 6 differential - includes LVDS (840 Mb/s), PCI-X (133 MHz), and DCI-enabled SSTL/HSTL |
| Speed Grade | -4 - specifies worst-case internal propagation delay (e.g., TCKO = 2.2 ns for DCM output) |
Pinout & Package
XC2V40-4FGG256I uses the FGG256 package: 256-ball Fine-Pitch BGA (1.00 mm pitch, 17 mm × 17 mm body), Pb-free, wire-bond construction. It contains 88 user I/Os, 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, etc.), and power/ground balls distributed across the array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial/SelectMAP configuration; must be clean, monotonic, and ≤ 50 MHz |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream loading and initialization |
| M0–M2 | Mode Selection Inputs | Set configuration mode at power-up (e.g., M2:M0 = 000 → Slave Serial) |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts loading |
| VCCINT | Core Power Supply | 1.5 V supply for CLBs, RAM, and multipliers; requires low-noise decoupling near package corners |
| VCCAUX | Auxiliary Power Supply | 3.3 V supply for DCMs, configuration logic, and JTAG interface; must be stable before VCCINT |
| VCCO_0–VCCO_3 | I/O Bank Power Supplies | Independent 1.5–3.3 V supplies per I/O bank; define voltage thresholds and drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Four fully digital DCMs provide zero-delay buffering, ±120 ps phase shift resolution, and 2×–256× frequency synthesis without external PLL components |
| Digitally Controlled Impedance (DCI) | On-die series/split termination resistors (e.g., 50 Ω, 75 Ω) eliminate external resistors for SSTL/HSTL/LVDS, reducing board area and signal integrity risk |
| SelectIO-Ultra I/O Architecture | Supports simultaneous mixed-voltage operation across four I/O banks, enabling direct interfacing to DDR SDRAM, QDR SRAM, and PCI-X peripherals |
| Block SelectRAM Memory | 72 Kb of true dual-port RAM with three read-during-write modes allows concurrent data access and processing in filtering or buffering applications |
| 18×18 Multiplier Blocks | Eight dedicated hard multipliers enable cycle-accurate MAC operations for real-time FIR filters and FFT engines without LUT resource overhead |
Applications
| Telecom Line Card Interface | Industrial Motion Control |
|---|---|
Use Scenario: High-density line cards in carrier-grade DSLAMs and packet gateways require protocol bridging between TDM, ATM, and Ethernet domains. IC Role / Device Role / Timing Role: XC2V40-4FGG256I serves as the programmable fabric for SERDES framing, HDLC processing, and clock domain crossing between 8 kHz TDM and 125 MHz Ethernet clocks. Use Value: Four DCMs enable independent deskewing of E1/T1 recovery clocks and Ethernet reference clocks, while LVDS I/O supports 840 Mb/s backplane links with <15 ps jitter accumulation. |
Use Scenario: CNC machine controllers demand deterministic real-time response to encoder feedback and servo command updates at ≥20 kHz loop rates. IC Role / Device Role / Timing Role: XC2V40-4FGG256I implements closed-loop PID computation, quadrature decoding, and PWM generation with sub-microsecond latency. Use Value: 18×18 multipliers execute position-error correction in one clock cycle; distributed RAM stores lookup tables for non-linear compensation; DCI ensures clean 50 Ω termination on encoder A/B/Z signals. |
| Medical Imaging Data Acquisition | Avionics Sensor Fusion Hub |
Use Scenario: Ultrasound front-ends digitize RF echo data from 128-channel transducer arrays at 40 MSPS per channel, requiring massive parallel processing and low-latency beamforming. IC Role / Device Role / Timing Role: XC2V40-4FGG256I hosts time-aligned sample buffering, FIR filtering, and dynamic apodization logic using its Block SelectRAM and multiplier resources. Use Value: Dual-port RAM enables ping-pong acquisition buffers; 88 I/Os route parallel ADC outputs and control signals; -4 speed grade guarantees ≤2.2 ns register-to-output delay for timing-critical trigger paths. |
Use Scenario: UAV flight controllers aggregate inertial measurement unit (IMU), GPS, and barometric pressure data to compute attitude and altitude estimates at 1 kHz update rate. IC Role / Device Role / Timing Role: XC2V40-4FGG256I acts as sensor interface hub, performing timestamp synchronization, Kalman filter pre-processing, and ARINC-429 bus arbitration. Use Value: PCI-X compatible I/O drives legacy avionics buses at 66 MHz; industrial temperature rating (–40°C to +100°C) ensures reliability in unheated airframes; triple-DES bitstream encryption secures firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V40-5FGG256I | Same architecture and package, but -5 speed grade (faster timing: TCKO = 1.9 ns vs. 2.2 ns) | Required for designs exceeding -4 timing closure margins, especially at >120 MHz system clocks | Select when targeting higher clock frequencies or tighter setup/hold slack; otherwise, XC2V40-4FGG256I offers optimal cost/performance balance. |
| XC2V40-4FG256I | Identical speed grade and functionality, but non-Pb-free FG256 package (SnPb solder, 1.00 mm pitch) | Suitable only for legacy RoHS-exempt programs; lacks Pb-free compliance documentation and reflow profile validation | Prefer XC2V40-4FGG256I for new designs requiring RoHS compliance, extended thermal cycling life, and modern assembly processes. |
Compared with XC2V40-5FGG256I and XC2V40-4FG256I, the XC2V40-4FGG256I delivers certified Pb-free manufacturability and industrial-temperature robustness at the baseline -4 timing grade - making it the default choice for cost-sensitive, environmentally compliant, mid-performance embedded FPGA deployments.
Availability
XC2V40-4FGG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and avionics sensor fusion applications requiring stable component supply, long-term lifecycle assurance, and industrial-temperature operation.
Supply support for XC2V40-4FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA architecture and tools for high-performance programmable logic, with leadership in adaptive computing, system-level integration, and silicon-proven IP cores.
The Virtex-II family - including XC2V40-4FGG256I - was engineered for demanding signal processing, high-speed I/O interfacing, and deterministic clock management in telecom, aerospace, and industrial systems.
FAQ
What is the maximum operating junction temperature for XC2V40-4FGG256I?
The XC2V40-4FGG256I is rated for industrial temperature range: –40°C to +100°C junction temperature. This specification is validated per DS031 Module 1 and applies under specified power dissipation and PCB thermal design conditions. Thermal derating is required above 85°C ambient if power exceeds 1.2 W; full performance is guaranteed up to 100°C TJ. The XC2V40-4FGG256I datasheet defines thermal resistance (θJA) as 22.5°C/W for standard 4-layer board layout.
Does XC2V40-4FGG256I support partial reconfiguration?
Yes, XC2V40-4FGG256I supports partial reconfiguration via Xilinx's Dynamic Reconfiguration Port (DRP) and frame-based bitstream loading, as documented in DS031 Module 2. This enables runtime logic updates without resetting the entire device - critical for fault-tolerant systems and adaptive signal processing. The XC2V40-4FGG256I requires use of Xilinx ISE 8.2i or later tools and adherence to module boundary constraints during design partitioning.
What I/O standards with Digitally Controlled Impedance (DCI) are supported by XC2V40-4FGG256I?
The XC2V40-4FGG256I supports DCI for LVDCI (LVCMOS), GTL_DCI, GTLP_DCI, HSTL_I/II/III/IV_DCI, SSTL18/2/3_DCI, and LVDS_25_DCI - totaling 16 DCI-capable standards. Each I/O bank can configure termination independently, with series (50 Ω, 75 Ω) or split (25 Ω + 25 Ω) topologies. This eliminates external termination resistors and improves signal integrity for high-speed interfaces like DDR SDRAM and QDR SRAM. All DCI settings are defined in the XC2V40-4FGG256I UCF or XDC constraints file.
Can XC2V40-4FGG256I be configured via JTAG boundary scan?
Yes, XC2V40-4FGG256I supports IEEE 1532-compliant boundary-scan configuration through its dedicated Test Access Port (TAP), enabling in-system programming and verification without requiring dedicated configuration pins. The XC2V40-4FGG256I TAP implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions per DS031 Module 1. JTAG configuration is commonly used for prototyping, debugging, and field firmware updates.
Is bitstream encryption available on XC2V40-4FGG256I?
Yes, XC2V40-4FGG256I includes an on-chip Triple DES (3DES) decryptor for secure bitstream loading, as specified in DS031 Module 1. It supports one or two 168-bit key sets stored in non-volatile memory, enabling encrypted configuration from external PROM or flash. This feature protects intellectual property against reverse engineering and unauthorized cloning. Encryption is enabled during bitstream generation in Xilinx ISE using the "Bitstream Encryption" option; the XC2V40-4FGG256I enforces decryption before configuration commit.
XC2V40-4FGG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 64
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 73728
- Number of I/O:
- 88
- Number of Gates:
- 40000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2V40-4FGG256I FAQ
1.How can I place an order for XC2V40-4FGG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V40-4FGG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V40-4FGG256I reliable?
The price and inventory of XC2V40-4FGG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V40-4FGG256I is usually 5 days.
3.What payment methods are accepted for XC2V40-4FGG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V40-4FGG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V40-4FGG256I?
XC2V40-4FGG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V40-4FGG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V40-4FGG256I?
For technical support, including XC2V40-4FGG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V40-4FGG256I requirements.
6.How does Aetrix verify that XC2V40-4FGG256I is sourced from the original manufacturer or authorized distributors?
All XC2V40-4FGG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V40-4FGG256I meets industry standards.
7.What is the process for return or replacement of XC2V40-4FGG256I?
All XC2V40-4FGG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V40-4FGG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V40-4FGG256I part is unused and in its original packaging.
Return procedure for XC2V40-4FGG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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