AMD XC2V40-5FG256I

Overview

XC2V40-5FG256I from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FG256) package, operating at industrial temperature (–40°C to +100°C), with 88 user I/Os, 256 Configurable Logic Blocks (CLBs), and four Digital Clock Managers (DCMs). It delivers high-speed logic implementation for telecom and DSP applications requiring embedded RAM, dedicated multipliers, and precise clock management.

For engineers reviewing the XC2V40-5FG256I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, and validated alternative options for legacy Virtex-II system upgrades and industrial control designs.

Technical Context

The XC2V40-5FG256I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates 256 CLBs (each with two 4-input LUTs and dual flip-flops), four 18-Kb Block SelectRAM modules, eight 18×18 multipliers, and four DCMs supporting de-skew, frequency synthesis, and ±1/256-cycle phase shifting.

It supports 19 single-ended and six differential I/O standards-including LVDS, BLVDS, LVPECL, SSTL-2/3, HSTL-I/II, and PCI-X 133 MHz-with Digitally Controlled Impedance (DCI) for on-die series or split termination. Routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout, and configuration occurs via Slave/Master SelectMAP or JTAG (IEEE 1532).

Key Specifications

Pinout & Package

XC2V40-5FG256I is housed in a 256-ball fine-pitch ball grid array (FG256) package with 1.00 mm pitch, 17 mm × 17 mm body size, and wire-bond interconnect. The package supports 88 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V40-5FG256I, XC2V40-4FG256I trades performance for cost and power efficiency, while XC2V80-5FG256I offers scalable logic and memory resources within identical mechanical and thermal constraints-enabling drop-in upgrades without layout revision.

Availability

XC2V40-5FG256I is available at Aetrix Electronics and suitable for industrial motion control, telecom infrastructure, video processing, and legacy bus bridge applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V40-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for high-speed, high-density logic implementation in telecom, networking, and DSP systems-emphasizing clock management, memory integration, and I/O flexibility for complex system-on-chip replacements.

FAQ

What is the maximum operating junction temperature for XC2V40-5FG256I?

The XC2V40-5FG256I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is guaranteed under specified VCCINT = 1.5 V ±3%, VCCAUX = 3.3 V ±5%, and VCCO = 1.5–3.3 V conditions, and applies to all functional modes including configuration, user mode, and boundary-scan testing. Thermal derating is required above 85°C ambient when power dissipation exceeds 1.2 W.

Does XC2V40-5FG256I support LVDS I/O at 840 Mb/s?

Yes, XC2V40-5FG256I supports LVDS I/O at up to 840 Mb/s as specified in the Virtex-II DS031 documentation. This capability requires proper PCB layout (controlled impedance 100 Ω differential pairs), correct VCCO = 2.5 V or 3.3 V assignment per bank, and use of dedicated LVDS_25 or LVDS_33 IOSTANDARD attributes. Signal integrity validation must be performed per Xilinx UG071 guidelines.

How many Block SelectRAM modules does XC2V40-5FG256I contain?

XC2V40-5FG256I contains four 18-Kb Block SelectRAM modules. Each module is independently configurable as dual-port RAM (e.g., 512 × 36 bits) or single-port RAM (e.g., 16K × 1 bit), supports three read-during-write modes, and connects directly to four switch matrices for flexible routing. Total embedded RAM capacity is 72 Kb, usable for FIFOs, lookup tables, or coefficient storage.

Is XC2V40-5FG256I pin-compatible with other Virtex-II devices in FG256 packaging?

Yes, all Virtex-II devices offered in FG256/FGG256 packages-including XC2V40, XC2V80, and XC2V250-are pinout compatible per Table 6 of DS031. This allows direct substitution within the same package footprint, provided I/O banking constraints, VCCO requirements, and CLB/RAM resource demands of the target design are satisfied. No PCB redesign is needed for migration among these variants.

What configuration modes are supported by XC2V40-5FG256I?

XC2V40-5FG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration data is loaded into internal SRAM cells; security features include optional Triple-DES bitstream encryption. All modes use the same 15-pin configuration interface (CCLK, DONE, M0–M2, PROG_B, etc.) with defined power-on reset behavior.