AMD XC2V40-5FGG256C

Overview

XC2V40-5FGG256C from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating at commercial temperature range (0°C to +85°C) with -5 speed grade. It integrates 256 Configurable Logic Blocks (CLBs), 8 18×18 multipliers, 4 Block SelectRAM™ modules (72 Kbits total), and 4 Digital Clock Managers (DCMs), targeting high-speed I/O interfacing in telecom and DSP systems.

For engineers reviewing the XC2V40-5FGG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DC/switching characteristics, and validated alternative FPGAs for migration or second-sourcing - all grounded in DS031 (v3.5) November 2007 specification.

Technical Context

The XC2V40-5FGG256C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by DCM-generated 180°-phase-shifted clocks for precise source-synchronous timing.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, fast carry chains, and horizontal cascade logic; each Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with three read-during-write modes and dedicated 18×18 multiplier pairing.

Key Specifications

Pinout & Package

XC2V40-5FGG256C uses the FGG256 package: 256-ball Fine-Pitch Ball Grid Array (1.00 mm pitch), Pb-free wire-bond construction, 17 × 17 mm body size, and 88 user I/O pins plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V40-5FGG256C, XC2V40-5FG256C offers identical functionality with legacy packaging, while XC3S50-4PQ208C trades clock precision, I/O flexibility, and memory bandwidth for lower unit cost and power - making it viable only when Virtex-II-specific capabilities are unnecessary.

Availability

XC2V40-5FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging preprocessing, and avionics display controller applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XC2V40-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and historically responsible for defining the FPGA architecture standard through innovations like SRAM-based configuration, hierarchical routing, and integrated clock management.

The Virtex-II family was designed specifically for high-performance, system-level integration in telecommunications, wireless base stations, and digital signal processing - delivering platform-level features including PCI-X compliance, LVDS I/O, and embedded memory/multiplier blocks before industry-wide adoption.

FAQ

What is the maximum operating frequency of the XC2V40-5FGG256C?

The XC2V40-5FGG256C has a -5 speed grade, which guarantees a maximum internal clock frequency of 420 MHz per Advance Data in DS031 (v3.5). This applies to logic paths within the CLB array; actual system-level performance depends on placement, routing, and I/O timing constraints. The DCMs support output frequencies up to 500 MHz with appropriate input clock and multiplication ratios.

Does the XC2V40-5FGG256C support DDR SDRAM interfaces?

Yes, the XC2V40-5FGG256C supports DDR SDRAM interfaces via its SelectIO™-Ultra I/O banks, which include dedicated DDR input and output registers per pin and programmable I/O standards such as SSTL_2_I/II and SSTL_3_I/II. Its DCMs provide precise phase alignment and de-skew required for reliable DDR timing closure at data rates up to 200 MHz.

How many Block SelectRAM modules does the XC2V40-5FGG256C contain?

The XC2V40-5FGG256C contains 4 Block SelectRAM modules, each providing 18 Kbits of true dual-port RAM. These modules are configurable from 16K×1 to 512×36 bits, support three read-during-write modes, and can be cascaded to build larger memory structures. Total embedded RAM capacity is 72 Kbits.

Is the XC2V40-5FGG256C RoHS compliant?

Yes, the XC2V40-5FGG256C is RoHS compliant. The "G" in FGG256 denotes Pb-free wire-bond construction, consistent with Xilinx's Pb-free packaging initiative documented in DS031 (v3.5). It uses lead-free solder spheres and meets JEDEC J-STD-020 moisture sensitivity level (MSL) requirements for surface-mount assembly.

Can the XC2V40-5FGG256C perform bitstream encryption?

Yes, the XC2V40-5FGG256C includes an on-chip Triple-DES decryptor that secures configuration bitstreams using one or two key sets. This feature prevents unauthorized readback and cloning of design IP. Encryption is enabled during bitstream generation in Xilinx ISE tools and requires proper key provisioning during programming.