AMD XC2V40-5FGG256I

Overview

XC2V40-5FGG256I from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating at -5 speed grade and rated for industrial temperature range (–40°C to +100°C). It integrates 256 Configurable Logic Blocks (CLBs), 8 dedicated 18×18 multipliers, 4 Digital Clock Managers (DCMs), and supports up to 88 user I/Os with SelectIO-Ultra technology including LVDS, SSTL, HSTL, and PCI-compliant interfaces - deployed in telecom baseband processing and industrial control logic.

For engineers reviewing the XC2V40-5FGG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, DCM timing parameters, CLB resource mapping, and industrial-grade thermal/power specifications directly traceable to DS031 (v3.5).

Technical Context

The XC2V40-5FGG256I implements a 0.15 µm/0.12 µm 8-layer metal CMOS architecture with SRAM-based configuration, 1.5V core (VCCINT), 3.3V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its logic fabric comprises 256 CLBs (each with four slices), 4 block SelectRAM™ modules (18 Kb total), and 8 multiplier blocks - all interconnected via Active Interconnect Technology routing with predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, PCI, SSTL, HSTL) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) for on-chip termination. Clocking is managed by four DCMs offering precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution), driving 16 global clock MUX buffers.

Key Specifications

Pinout & Package

XC2V40-5FGG256I uses the FGG256 package: a Pb-free, wire-bond, fine-pitch ball grid array with 1.00 mm pitch, 17 mm × 17 mm body size, and 256 solder balls arranged in a 16×16 array. The package supports 88 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O applications.

Compared with XC2V40-5FGG256I, the -4 variant trades 40 MHz clock headroom for lower cost and power, while the FG256 alternative retains identical functionality but lacks Pb-free compliance - making XC2V40-5FGG256I the optimal choice for new industrial designs requiring both performance headroom and environmental compliance.

Availability

XC2V40-5FGG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and test instrumentation requiring stable component supply across extended lifecycle programs.

Supply support for XC2V40-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II family was designed for high-performance, high-density logic implementation in telecom, networking, and DSP applications - delivering scalable gate counts, integrated clock management, and advanced I/O flexibility in a single-platform architecture.

FAQ

What is the maximum operating junction temperature for XC2V40-5FGG256I?

The XC2V40-5FGG256I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is guaranteed under continuous operation with proper PCB thermal design, including adequate copper pour, thermal vias under the package, and airflow management - consistent with Xilinx DS031 (v3.5) Section 3.2.

Does XC2V40-5FGG256I support DDR SDRAM interfaces?

Yes, XC2V40-5FGG256I supports DDR SDRAM interfaces through its SelectIO-Ultra I/O banks configured for SSTL_2_I or SSTL_2_II standards, combined with built-in DDR input/output registers in IOBs and precise DCM-controlled clocking - enabling reliable 200+ MHz data rates as documented in DS031 Module 2.

How many configuration modes does XC2V40-5FGG256I support?

XC2V40-5FGG256I supports five configuration modes: slave serial, master serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). Mode selection is controlled by the M0–M2 pins, and all modes are fully supported in the FGG256 package per DS031 Module 1 Section "Configuration".

Is XC2V40-5FGG256I compatible with Xilinx ISE 14.7 software?

XC2V40-5FGG256I is fully supported in Xilinx ISE Design Suite versions up to 14.7, including synthesis, place-and-route, and bitstream generation. While newer tools like Vivado do not support Virtex-II, ISE 14.7 remains the final official release with complete XC2V40 device libraries and timing models.

Can XC2V40-5FGG256I perform partial reconfiguration?

Yes, XC2V40-5FGG256I supports partial reconfiguration as specified in DS031 Module 2. This capability allows dynamic swapping of logic modules (e.g., filter coefficients or protocol engines) without resetting the entire device - enabled via dedicated configuration logic and frame-based bitstream addressing.