AMD XC2V40-6FGG256C

Overview

XC2V40-6FGG256C from Xilinx is a 40K-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FGG256) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 256 Configurable Logic Blocks (CLBs), 8 18×18 multipliers, 4 Block SelectRAM™ modules (72 Kbits total), 4 Digital Clock Managers (DCMs), and supports up to 88 user I/Os. It is used in high-speed telecommunication interface logic, PCI-compliant embedded controllers, and DDR-based video frame buffers.

For engineers reviewing the XC2V40-6FGG256C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (88), DCM count (4), CLB density (256), 1.5 V core supply compatibility, and FGG256 package footprint constraints for board layout and thermal management.

Technical Context

The XC2V40-6FGG256C implements a SRAM-based, reprogrammable architecture built on a 0.15 µm/0.12 µm 8-layer metal CMOS process. Its logic fabric comprises 256 CLBs-each containing four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascading-enabling high-density combinatorial and synchronous logic synthesis.

It features four independent DCM blocks supporting precise clock de-skew, integer/non-integer frequency synthesis (M/D ratio), and coarse/fine phase shifting (1/256 period resolution). I/O subsystem includes Digitally Controlled Impedance (DCI) for on-chip termination across LVCMOS, SSTL, HSTL, and GTL standards, plus native LVDS and BLVDS support at up to 840 Mb/s.

Key Specifications

Pinout & Package

XC2V40-6FGG256C uses a 256-ball fine-pitch ball grid array (FGG256) package with 1.00 mm pitch, Pb-free finish, and 17 × 17 mm body size. The package supports 88 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.

Compared with XC2V40-6FGG256C, the -5 variant trades timing margin for cost, while the XC2V80-6FGG256C offers higher logic density and I/O count at the expense of requiring new PCB layout - neither is pin-compatible, making XC2V40-6FGG256C the optimal choice for fixed-footprint, mid-density, commercial-grade reconfigurable logic.

Availability

XC2V40-6FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, and PCI-based data acquisition systems requiring stable component supply across extended production lifecycles.

Supply support for XC2V40-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, now part of AMD, specializing in FPGAs, adaptive SoCs, and AI inference platforms for high-performance computing and embedded systems.

The Virtex-II family, including XC2V40-6FGG256C, was engineered for high-speed, high-density logic implementation in telecommunications, networking, and video processing - emphasizing clock management, I/O flexibility, and system-level integration.

FAQ

What is the maximum number of user I/Os supported by XC2V40-6FGG256C?

XC2V40-6FGG256C supports exactly 88 user I/O pins in the FGG256 package. This count excludes 15 dedicated configuration and JTAG pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The I/O count is fixed for this device/package combination and cannot be increased via configuration.

Does XC2V40-6FGG256C support DDR memory interfaces?

Yes, XC2V40-6FGG256C natively supports DDR SDRAM interfaces through its SelectIO-Ultra I/O banks, which include dedicated DDR input and output registers, programmable drive strength (2–24 mA), and DCM-controlled phase alignment. It meets JEDEC-compliant timing for 133 MHz DDR operation at 3.3 V.

Is XC2V40-6FGG256C compatible with 5V-tolerant I/O standards?

No, XC2V40-6FGG256C is not 5V-tolerant. Its I/Os operate at VCCO levels of 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on standard. As an input, it can interface with 5V signals only when external current-limiting resistors are used; as an output, it must never drive 5V buses directly.

What configuration modes does XC2V40-6FGG256C support?

XC2V40-6FGG256C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Mode selection is controlled by M0–M2 pins at power-up; all modes use the same CCLK, DIN/DOUT, and DONE signals with distinct timing and data framing.

Can XC2V40-6FGG256C perform partial reconfiguration?

Yes, XC2V40-6FGG256C supports partial reconfiguration - a feature allowing dynamic replacement of logic modules during operation without resetting the entire device. This requires Xilinx ISE tools with Partial Reconfiguration license and careful floorplanning to isolate reconfigurable regions.