AMD XC2V500-4FG256I

Overview

XC2V500-4FG256I from Xilinx is a 500K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FG256) package, operating across –40°C to +100°C industrial temperature range. It integrates 3,072 Configurable Logic Blocks (CLBs), 96 dedicated 18×18 multipliers, 32 Block SelectRAM™ modules (576 Kbits total), and 8 Digital Clock Managers (DCMs), targeting high-speed telecommunication, DSP, and video processing systems requiring DDR I/O, LVDS, and PCI-X interfaces.

For engineers reviewing the XC2V500-4FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource mapping, and industrial-grade thermal/power specifications - all confirmed against DS031 (v3.5) November 2007.

Technical Context

The XC2V500-4FG256I implements a hierarchical SRAM-based architecture with four core resource types: Configurable Logic Blocks (CLBs) containing dual 4-input LUTs and flip-flops per slice; 18-Kb dual-port Block SelectRAM™ modules supporting read-during-write modes; dedicated 18×18 multipliers tightly coupled to SelectRAM for DSP acceleration; and fully digital Digital Clock Managers (DCMs) enabling precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period).

Its IOB structure supports simultaneous single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) for on-chip series or split termination. Routing uses Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2V500-4FG256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FG256) package with 1.00 mm pitch, 17 mm × 17 mm body size, and wire-bond interconnect. The package supports 264 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XC2V500-4FG256I, the -5FG256I trades timing margin for cost and power efficiency, while the -4FG456I expands I/O capacity at the expense of package size and layout effort - neither is pin-compatible, making them functional alternatives rather than drop-in replacements.

Availability

XC2V500-4FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video encoding, and PCI-X embedded controller applications requiring stable component supply, long-term lifecycle management, and traceable sourcing.

Supply support for XC2V500-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and known for industry-leading FPGA and adaptive SoC architectures.

The Virtex-II family was designed for high-performance, high-density system-level integration in telecommunications, wireless infrastructure, and video processing - delivering scalable logic, memory, DSP, and clocking resources in a single SRAM-based platform.

FAQ

What is the maximum operating junction temperature for XC2V500-4FG256I?

The XC2V500-4FG256I is rated for industrial temperature range: –40°C to +100°C junction temperature (Tj). This specification is defined in DS031 Module 1, General Description, and validated across all speed grades and packages within the Virtex-II family. Thermal design must ensure sustained operation stays within this limit under worst-case power dissipation conditions.

Does XC2V500-4FG256I support DDR2 SDRAM interfaces?

Yes, XC2V500-4FG256I supports DDR2 SDRAM interfaces through its SelectIO™-Ultra I/O banks configured for SSTL-18 Class II standards, with programmable drive strength (2–24 mA) and Digitally Controlled Impedance (DCI) for on-die termination. DCM-generated phase-aligned clocks ensure precise timing alignment required for DDR2 command/address and data strobe signals.

How many Digital Clock Managers (DCMs) does XC2V500-4FG256I contain?

XC2V500-4FG256I contains exactly 8 Digital Clock Managers (DCMs), as specified in Table 1 of DS031 Module 1. Each DCM provides independent clock synthesis, de-skew, and phase-shifting capabilities - sufficient to manage multiple clock domains for complex systems such as video pipelines with separate pixel, memory, and interface clocks.

Is XC2V500-4FG256I compatible with Xilinx ISE 14.7 software?

No, XC2V500-4FG256I requires Xilinx ISE Foundation or Alliance Series software versions 6.x through 10.1, as documented in the Virtex-II Software Support Guide (UG112). ISE 14.7 targets 7-series and later FPGAs; attempting synthesis or place-and-route with unsupported tools will fail or produce incorrect bitstreams.

What configuration modes are supported by XC2V500-4FG256I?

XC2V500-4FG256I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. These are detailed in Module 1, Configuration section of DS031. Mode selection is controlled by M2:M0 pins at power-up, and all modes use the same CCLK, DIN/DOUT, and DONE signals with distinct timing requirements.