AMD XC2V500-4FGG256C

Overview

XC2V500-4FGG256C from Xilinx is a 500K-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FGG256) package, operating at commercial temperature range (0°C to +85°C), with 32 Configurable Logic Blocks (CLBs), 96 dedicated 18×18 multipliers, and 8 Digital Clock Managers (DCMs). It delivers up to 264 user I/Os and supports LVDS, PCI-X, SSTL, and HSTL interfaces for high-speed telecom and DSP applications.

For engineers reviewing the XC2V500-4FGG256C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support, DCM timing parameters, CLB resource count, and confirmed wire-bond BGA package mapping - all extracted from DS031 (v3.5) November 2007.

Technical Context

The XC2V500-4FGG256C implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with SRAM-based configuration, 1.5 V core supply (VCCINT), and separate 3.3 V auxiliary (VCCAUX) and programmable I/O (VCCO) supplies. Its architecture integrates 3,072 CLB slices, 32 Block SelectRAM™ modules (18 Kb each), and Digitally Controlled Impedance (DCI) for on-chip termination across 19 single-ended and 6 differential I/O standards.

It features 16 global clock multiplexer buffers, up to 12 DCMs (8 implemented), and Active Interconnect routing with 24 long lines per row/column. The device supports DDR I/O registers per IOB path, IEEE 1149.1 boundary scan, and triple-DES bitstream encryption - all validated for wire-bond FGG256 packaging with 1.00 mm pitch and 17×17 mm footprint.

Key Specifications

Pinout & Package

XC2V500-4FGG256C uses a wire-bond fine-pitch BGA package (FGG256) with 1.00 mm ball pitch, 17×17 mm body size, and 256 balls arranged in a 16×16 grid. Pin definitions follow Xilinx DS031 Module 4, with dedicated power (VCCINT, VCCAUX, VCCO), configuration (CCLK, DONE, PROG_B), JTAG (TCK/TDI/TDO/TMS), and user I/O banks grouped by voltage domain.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V500-4FGG256C, the -5 speed grade offers guaranteed higher-frequency operation without altering pinout or power delivery, while XC2V1000-4FGG456C expands logic capacity and I/O count at the cost of larger footprint and higher static power - both require design re-synthesis but no schematic or layout revision beyond package adaptation.

Availability

XC2V500-4FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, PCI-X controller development, and high-speed test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC2V500-4FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-II family, including XC2V500-4FGG256C, was engineered for high-speed wired/wireless infrastructure and DSP applications - delivering scalable logic density, integrated memory, and advanced clock management in wire-bond BGA packages.

FAQ

What is the maximum number of user I/Os supported by XC2V500-4FGG256C?

XC2V500-4FGG256C supports 264 user I/Os in the FGG256 package, as confirmed in Table 6 of DS031 (v3.5). This count excludes 15 dedicated control pins (CCLK, DONE, PROG_B, etc.) and VBATT. All 264 I/Os are configurable as single-ended or differential signals with programmable drive strength and on-chip termination via DCI.

Does XC2V500-4FGG256C support DDR I/O interfaces?

Yes, XC2V500-4FGG256C supports DDR I/O through dedicated input and output registers in each IOB block, enabled by two 180°-phase-shifted clocks generated by its DCMs. It natively interfaces with DDR SDRAM, QDR SRAM, and source-synchronous protocols - validated in DS031 Module 2 and Module 3 timing tables.

What power supply voltages does XC2V500-4FGG256C require?

XC2V500-4FGG256C requires three distinct supplies: 1.5 V ±3% for VCCINT (core logic), 3.3 V ±5% for VCCAUX (DCMs and configuration), and programmable 1.5/1.8/2.5/3.3 V for VCCO (I/O banks). Each VCCO rail powers a specific I/O bank and determines compatible signaling standards per DS031 Table 1 and Table 2.

Is XC2V500-4FGG256C compatible with Pb-free soldering processes?

Yes, XC2V500-4FGG256C uses the FGG prefix, denoting Xilinx's Pb-free wire-bond fine-pitch BGA packaging. It complies with JEDEC J-STD-020 moisture sensitivity level (MSL) 3 and supports lead-free reflow profiles up to 260°C peak temperature, as documented in Xilinx's Pb-Free Packaging Notice (www.xilinx.com/pbfree).

Can XC2V500-4FGG256C perform partial reconfiguration?

Yes, XC2V500-4FGG256C supports partial reconfiguration as specified in DS031 Module 1. This capability allows dynamic swapping of logic modules (e.g., protocol engines or filter coefficients) without resetting the entire device - enabled by its SRAM-based configuration memory and dedicated configuration port resources.