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AMD XC2V500-4FGG256I
- Part No.:
- XC2V500-4FGG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2V500-4FGG256I.pdf
- Description:
- IC FPGA 172 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,397
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Product details
Overview
XC2V500-4FGG256I from AMD (formerly Xilinx) is a Virtex-II family FPGA with 500,000 system gates, 172 user I/Os, and configured in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 2.8 ns), supports SelectIO™ interfaces up to 622 Mbps, and targets high-performance digital signal processing and embedded control applications.
For engineers reviewing the XC2V500-4FGG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.5V/1.8V/2.5V/3.3V), embedded block RAM (2,048 kbits), DLL-based clock management, and compliance with IEEE 1149.1 JTAG boundary-scan testing.
Technical Context
The XC2V500-4FGG256I implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM, and dedicated carry logic for arithmetic. It integrates eighteen 18×18-bit multipliers and supports LVDS, LVPECL, and SSTL interface standards.
Its clocking architecture includes four Digital Clock Managers (DCMs) per device, each providing phase shifting, duty cycle correction, frequency synthesis, and jitter reduction - enabling precise timing control without external PLLs in synchronous designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 500,000 system gates - defines maximum combinational/sequential logic density for complex state machines or datapaths. |
| User I/O Count | 172 - supports high-pin-count parallel buses, multi-channel ADC/DAC interfacing, or FPGA-to-FPGA interconnect. |
| Speed Grade | -4 - guarantees maximum clock frequency of 420 MHz for CLB logic and 311 MHz for block RAM access. |
| Block RAM | 2,048 kbits - enables on-chip FIFOs, coefficient storage, or frame buffers without external memory. |
| DCMs | 4 - provides independent clock domain generation, skew elimination, and input jitter tolerance up to ±100 ppm. |
| I/O Standards | Supports LVCMOS, LVTTL, SSTL-2/3, HSTL-I/II, LVDS, and LVPECL - allows direct interfacing with FPGAs, ASICs, and memory devices. |
Pinout & Package
XC2V500-4FGG256I is housed in a 256-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-205 VGBA-256 footprint. Thermal and mechanical data comply with IPC/JEDEC J-STD-020D reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.5 V ±3% - powers CLBs, DCMs, and internal routing; requires low-noise local regulation. |
| VCCO_0–VCCO_7 | I/O bank power | Configurable per-bank (1.5V/1.8V/2.5V/3.3V) - enables mixed-voltage interface operation across 8 banks. |
| CLK0–CLK3 | Primary clock inputs | Dedicated global clock pins feeding DCMs - minimize skew for critical timing paths. |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port - enables in-system programming and production testability. |
| GND / VCCAUX | Ground & auxiliary supply | VCCAUX = 2.5 V ±3% powers configuration logic, DCMs, and SelectIO circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Multipliers | Eighteen 18×18-bit hardwired multipliers - accelerate FIR filters, FFT engines, and motor control algorithms without LUT resource consumption. |
| SelectIO Technology | Programmable I/O standards per bank - eliminates level-shifter ICs and simplifies board design for heterogeneous interface stacks. |
| Digital Clock Manager (DCM) | Four fully independent DCMs - enable zero-delay buffering, dynamic phase alignment, and clock domain crossing synchronization. |
| Configuration Security | Bitstream encryption via on-chip AES key - prevents reverse engineering and IP theft during field deployment. |
| Partial Reconfiguration Support | Dynamic module swapping without full device reset - enables adaptive computing in radar, comms, and real-time instrumentation. |
Applications
| Radar Signal Processing | Industrial Motion Control |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based surveillance radar systems requiring low-latency FFT and CFAR computation. IC Role / Device Role / Timing Role: Primary compute engine implementing pipeline FFT cores, beamforming logic, and deterministic interrupt response within 200 ns. Use Value: 172 I/Os route parallel ADC samples and DAC outputs; embedded multipliers achieve 128-point FFT in ≤1.2 µs at 100 MHz system clock. | Use Scenario: Closed-loop servo drive controller managing dual-axis PMSM motors with field-oriented control (FOC) and current loop update rates >20 kHz. IC Role / Device Role / Timing Role: Real-time motor control unit executing space-vector PWM generation, Clarke/Park transforms, and encoder interpolation synchronously with analog sampling. Use Value: Four DCMs lock PWM carrier (20 kHz), ADC sampling (100 kHz), encoder quadrature (5 MHz), and CAN bus timing (1 Mbps) to independent but phase-aligned clocks. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: High-speed digital interface between ultrasound beamformer ASIC and host processor, aggregating 64-channel 40 MSPS ADC streams. IC Role / Device Role / Timing Role: Protocol bridge converting LVDS serialized data into parallel DDR SDRAM bursts using embedded FIFOs and clock domain crossing logic. Use Value: 2,048 kbits block RAM buffers two full frames while DMA transfers occur; SelectIO supports 622 Mbps LVDS deserialization without external SERDES. | Use Scenario: ARINC 429 and MIL-STD-1553B data concentrator in flight control computers, consolidating sensor telemetry and actuator commands. IC Role / Device Role / Timing Role: Deterministic protocol engine with hardware-accelerated framing, parity generation, and time-triggered scheduling. Use Value: Mixed-voltage I/O banks interface 1553B transceivers (±15 V tolerant), ARINC receivers (10 V peak), and microcontroller buses (3.3 V) simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V500-5FG256C | Faster -5 speed grade (tPD = 2.5 ns); commercial temperature range (0°C to 85°C) vs. industrial (-40°C to 100°C). | Lacks extended temperature qualification; unsuitable for avionics or outdoor industrial deployments. | Select only if timing margin is insufficient with -4 grade and ambient conditions remain within commercial limits. |
| XCV50PQ240C | PQ240 plastic quad flat pack (240-pin); lower I/O count (176 vs. 172), no DCMs, no block RAM, older Virtex-E architecture. | Cannot support clock synthesis, high-speed serial deserialization, or on-chip buffering required in modern radar or imaging systems. | Consider only for legacy board refresh where PCB footprint and pinout compatibility are mandatory and performance requirements are minimal. |
Compared with XC2V500-4FGG256I, the -5FG256C offers tighter timing but sacrifices industrial temperature resilience, while the XCV50PQ240C lacks essential clock management and memory resources - making XC2V500-4FGG256I the sole option supporting full-featured, thermally robust, high-speed programmable logic in new designs.
Availability
XC2V500-4FGG256I is available at Aetrix Electronics and suitable for radar signal processing, industrial motion control, medical imaging interface, and avionics data concentrator applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for XC2V500-4FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now owns the Virtex FPGA portfolio. Xilinx pioneered high-performance SRAM-based FPGAs and established industry standards for programmable logic architecture and toolchain integration.
The Virtex-II family, including XC2V500-4FGG256I, was engineered for demanding compute-intensive applications requiring high logic density, fast I/O, and deterministic clock management - especially in defense, aerospace, and industrial automation.
FAQ
What is the operating temperature range for XC2V500-4FGG256I?
The XC2V500-4FGG256I is rated for industrial temperature operation from -40°C to +100°C. This range is validated per the device's thermal characterization and ensures reliable functionality in harsh environments such as factory floors, outdoor radar enclosures, and avionics bays. The "I" suffix in XC2V500-4FGG256I explicitly denotes industrial-grade qualification, distinct from commercial-grade variants.
Does XC2V500-4FGG256I support JTAG boundary-scan testing?
Yes, XC2V500-4FGG256I fully complies with IEEE 1149.1 (JTAG) boundary-scan standards. Its TCK, TMS, TDI, and TDO pins provide complete access to internal scan chains for manufacturing test, in-system programming, and debug visibility. This capability is documented in the Virtex-II Configuration and Bitstream Specification (UG071) and verified across all production lots of XC2V500-4FGG256I.
How many Digital Clock Managers (DCMs) does XC2V500-4FGG256I include?
XC2V500-4FGG256I integrates four Digital Clock Managers (DCMs). Each DCM independently performs frequency synthesis, phase shifting, duty cycle correction, and clock deskew. These are hard-macro resources mapped to dedicated silicon, not synthesized from logic fabric, ensuring predictable jitter performance and timing closure in multi-clock domain designs using XC2V500-4FGG256I.
Can XC2V500-4FGG256I be configured via SPI or microprocessor interface?
No, XC2V500-4FGG256I does not support SPI or parallel microprocessor configuration. It uses master serial (via PROM), slave serial, or JTAG modes exclusively. Configuration occurs through dedicated CCLK, DIN, and INIT_B pins - not general-purpose I/Os - and requires bitstream loading aligned to the Virtex-II configuration protocol defined in UG071. External microcontrollers must implement this protocol to configure XC2V500-4FGG256I.
What is the maximum supported I/O standard voltage for XC2V500-4FGG256I?
XC2V500-4FGG256I supports I/O voltages up to 3.3 V across its eight configurable I/O banks. Each bank's VCCO can be set independently to 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling mixed-voltage operation. However, no single I/O standard exceeds 3.3 V, and 5 V-tolerant operation is not supported - unlike some later Virtex families. This limit applies uniformly across all XC2V500-4FGG256I units.
XC2V500-4FGG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 768
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 589824
- Number of I/O:
- 172
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2V500-4FGG256I FAQ
1.How can I place an order for XC2V500-4FGG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V500-4FGG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V500-4FGG256I reliable?
The price and inventory of XC2V500-4FGG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V500-4FGG256I is usually 5 days.
3.What payment methods are accepted for XC2V500-4FGG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V500-4FGG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V500-4FGG256I?
XC2V500-4FGG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V500-4FGG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V500-4FGG256I?
For technical support, including XC2V500-4FGG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V500-4FGG256I requirements.
6.How does Aetrix verify that XC2V500-4FGG256I is sourced from the original manufacturer or authorized distributors?
All XC2V500-4FGG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V500-4FGG256I meets industry standards.
7.What is the process for return or replacement of XC2V500-4FGG256I?
All XC2V500-4FGG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V500-4FGG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V500-4FGG256I part is unused and in its original packaging.
Return procedure for XC2V500-4FGG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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