AMD XC2V500-4FGG456C

Overview

XC2V500-4FGG456C from Xilinx is a 500K-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG456) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 3,072 Configurable Logic Blocks (CLBs), 96 dedicated 18×18 multipliers, 32 Block SelectRAM™ modules (264 Kbits total RAM), and 8 Digital Clock Managers (DCMs). It targets high-speed telecommunication and DSP systems requiring LVDS, DDR, and PCI-X interfaces.

For engineers reviewing the XC2V500-4FGG456C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource count, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V500-4FGG456C implements a hierarchical SRAM-based architecture with four core logic elements: Configurable Logic Blocks (CLBs), 18-Kb dual-port Block SelectRAM™, 18×18 multipliers, and fully digital Digital Clock Managers (DCMs). Each CLB contains four slices with dual 4-input LUTs, flip-flops/latches, carry chains, and horizontal cascading logic.

Its I/O subsystem supports 19 single-ended and 6 differential standards-including LVDS (840 Mb/s), PCI-X (133 MHz), and SSTL/HSTL-with Digitally Controlled Impedance (DCI) for on-chip termination. All 264 user I/Os are routed through programmable IOBs with optional DDR input/output registers and independent clock enables.

Key Specifications

Pinout & Package

XC2V500-4FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.00 mm pitch, Pb-free construction, and 264 user I/Os. The package includes 15 dedicated configuration and boundary-scan control pins (e.g., CCLK, DONE, TCK, TDI, TDO, TMS, PROG_B) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V500-4FGG456C, the -5 variant offers verified timing margin improvement without architectural change, while XCV50PFG456C represents a legacy, lower-density alternative with no DCM or high-speed I/O capability-making it unsuitable for timing-critical or interface-rich applications.

Availability

XC2V500-4FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, and video processing applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V500-4FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for high-bandwidth, low-latency applications in telecommunications, networking, and DSP-delivering scalable logic density, hardened arithmetic, and advanced clock management in a 0.15 µm process.

FAQ

What is the maximum operating frequency of the XC2V500-4FGG456C?

The XC2V500-4FGG456C has a -4 speed grade specifying a maximum internal clock frequency of 420 MHz under typical commercial conditions. This value is guaranteed by timing analysis using Xilinx ISE tools and confirmed in DS031 Module 3 switching characteristics tables for CLB-to-CLB paths and DCM outputs.

Does the XC2V500-4FGG456C support DDR2 memory interfaces?

No, the XC2V500-4FGG456C supports DDR SDRAM (not DDR2) via its SelectIO-Ultra I/O banks with dedicated DDR input/output registers. DDR2 requires higher I/O voltage tolerance (2.5 V VDDQ), tighter timing closure, and on-die termination not implemented in Virtex-II architecture.

Can the XC2V500-4FGG456C be configured via JTAG only?

Yes, the XC2V500-4FGG456C supports IEEE 1532 boundary-scan configuration through its TCK/TDI/TDO/TMS pins. This method allows programming, readback, and partial reconfiguration without external PROM or flash memory-ideal for prototyping and field updates.

How many global clock lines does the XC2V500-4FGG456C provide?

The XC2V500-4FGG456C provides 16 global clock lines-eight per quadrant-with each line driven by a global clock multiplexer buffer. These lines distribute low-skew clocks from DCM outputs or external sources to all logic regions with predictable delay.

Is the XC2V500-4FGG456C RoHS compliant?

Yes, the XC2V500-4FGG456C uses Pb-free packaging (FGG prefix denotes lead-free fine-pitch BGA), meeting RoHS Directive 2011/65/EU requirements. Xilinx confirms compliance in its Pb-Free Packaging documentation and DS031 revision history.