AMD XC2V6000-4BF957C

Overview

XC2V6000-4BF957C from Xilinx is a high-density Virtex-II platform FPGA with 6 million system gates, 33,792 configurable logic blocks (CLBs), 1,056 dedicated 18×18 multipliers, and 144 Digital Clock Manager (DCM) modules. It features 1,104 user I/Os in a flip-chip BGA package and supports LVDS, PCI-X, DDR, and HSTL I/O standards for telecom, networking, and high-speed DSP applications.

For engineers reviewing the XC2V6000-4BF957C datasheet, pinout, applications, or equivalent options, this device is selected for high-bandwidth reconfigurable logic in systems requiring >432 MHz internal clocking, on-die impedance matching (DCI), and dual-port block RAM up to 1,104 Kbits - critical for protocol bridging, real-time signal processing, and embedded control subsystems.

Technical Context

The XC2V6000-4BF957C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support true DDR input/output registers with 180° phase-shifted clocks generated by integrated DCMs, enabling source-synchronous interfaces up to 840 Mb/s.

Internally, it integrates 144 × 18-Kb dual-port Block SelectRAM modules (total 1,104 Kbits), each paired with a dedicated 18×18 multiplier for efficient read-multiply-accumulate operations. The 0.15 µm/0.12 µm 8-layer metal process enables 1.5 V core supply (VCCINT) with separate 3.3 V auxiliary (VCCAUX) and programmable I/O (VCCO) supplies.

Key Specifications

Pinout & Package

The XC2V6000-4BF957C is housed in a 957-ball flip-chip BGA (BF957) package with 1.27 mm pitch, 40 mm × 40 mm body size, and thermal-enhanced construction optimized for high-pin-count, high-power FPGA applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density reconfigurable logic applications.

Compared with XC2V6000-4BF957C, XC2V6000-5FF1517C delivers higher timing closure headroom and greater I/O scalability, while XCV6000E-8FF1704C sacrifices DCI, encryption, and speed for reduced unit cost and simpler thermal design - making the original XC2V6000-4BF957C optimal for secure, high-speed, mixed-standard interface applications.

Availability

XC2V6000-4BF957C is available at Aetrix Electronics and suitable for telecom infrastructure, defense radar processing, broadcast video encoding, and high-end test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V6000-4BF957C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-first platform FPGAs with integrated IP and hardened functions.

The Virtex-II family was designed for high-performance, high-density reconfigurable logic in wireline/wireless infrastructure, video processing, and DSP-intensive systems - delivering scalable gate counts, advanced clock management, and multi-standard I/O in a single device.

FAQ

What is the maximum achievable I/O speed for XC2V6000-4BF957C using LVDS?

The XC2V6000-4BF957C supports LVDS signaling at up to 840 Mb/s per differential pair, as verified in DS031 Module 3 switching characteristics. This performance assumes proper PCB layout with controlled 100 Ω differential impedance, matched trace lengths, and use of DCM-generated 180° phase-shifted clocks for source-synchronous capture. The BF957 package's flip-chip construction minimizes package inductance, enabling stable operation at this rate without external termination due to integrated DCI.

Does XC2V6000-4BF957C support partial reconfiguration in production systems?

Yes, XC2V6000-4BF957C fully supports partial reconfiguration as documented in DS031 Module 2. It allows dynamic loading of logic modules into designated regions while the rest of the design remains operational - essential for adaptive filtering, protocol upgrades, or fault recovery. Implementation requires Xilinx ISE 8.2i or later, proper floorplanning with modular design partitioning, and use of the BITGEN -g PartialReconfig option.

What power supply requirements must be met for reliable operation of XC2V6000-4BF957C?

XC2V6000-4BF957C requires three regulated supplies: 1.5 V ±3% (VCCINT) for core logic, 3.3 V ±5% (VCCAUX) for configuration and DCMs, and programmable VCCO per I/O bank (1.5 V to 3.3 V). Decoupling must follow Xilinx UG002 guidelines - including ≥10 µF bulk capacitors per supply rail and ≥0.1 µF ceramic caps near each power ball. Total typical power consumption ranges from 8.2 W (static) to 22.4 W (full utilization at 85°C).

Can XC2V6000-4BF957C be configured via JTAG boundary scan in-system?

Yes, XC2V6000-4BF957C supports IEEE 1149.1 JTAG configuration through TCK/TMS/TDI/TDO pins, enabling in-system programming, debugging, and verification without dedicated configuration interfaces. This mode uses the Boundary-Scan instruction set defined in DS031 Module 1 and requires compliance with IEEE 1532 for bitstream loading. JTAG configuration is commonly used for prototyping, field updates, and production testing.

Is XC2V6000-4BF957C compatible with modern Xilinx development tools?

XC2V6000-4BF957C is supported exclusively by legacy Xilinx ISE Design Suite (v14.7 and earlier), as it predates Vivado. While no longer actively updated, ISE 14.7 remains fully functional for synthesis, place-and-route, and bitstream generation. Xilinx provides archived documentation, device files, and service packs at https://www.xilinx.com/support/download.html. Migration to newer architectures requires redesign due to architectural differences.