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AMD XC2V6000-4FF1152I
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- Part No.:
- XC2V6000-4FF1152I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2V6000-4FF1152I.pdf
- Description:
- IC FPGA 824 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,099
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Product details
Overview
XC2V6000-4FF1152I from Xilinx is a high-density Virtex-II platform FPGA with 6 million system gates, 33,792 configurable logic blocks (CLBs), 1,056 dedicated 18×18 multipliers, and 1,104 user I/Os in a flip-chip fine-pitch BGA package. It integrates 144 Digital Clock Managers (DCMs), supports LVDS/DDR/SSTL/HSTL I/O standards, and targets high-speed telecom, networking, and DSP applications requiring deterministic clock management and embedded memory.
For engineers reviewing the XC2V6000-4FF1152I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, I/O capability mapping, DCM timing behavior, SelectRAM memory configuration options, and industrial-grade thermal/power characteristics - all confirmed for the exact FF1152 flip-chip package and -4 speed grade.
Technical Context
The XC2V6000-4FF1152I implements Xilinx's IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, delivering up to 420 MHz internal clock speed and 840+ Mb/s I/O performance. Its routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout.
Each CLB contains four slices with dual 4-input LUTs, dual storage elements, carry chains, and horizontal cascading; block SelectRAM provides 18 Kb dual-port RAM per block (configurable from 16K×1 to 512×36); and each DCM offers precise de-skew, frequency synthesis (M/D ratio), and 1/256-cycle phase resolution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 6 million - defines maximum combinational logic capacity for ASIC replacement or complex RTL implementation |
| Configurable Logic Blocks (CLBs) | 33,792 - each CLB contains 4 slices with dual LUTs and dual registers, enabling dense synchronous logic and distributed RAM |
| 18×18 Multiplier Blocks | 1,056 - hardware-accelerated arithmetic for DSP filtering, FFT, and MAC operations without LUT resource consumption |
| User I/O Pins | 1,104 - available in FF1152 flip-chip BGA; supports 19 single-ended and 6 differential I/O standards including LVDS, SSTL, HSTL |
| Digital Clock Managers (DCMs) | 144 - fully digital, self-calibrating clock modules providing de-skew, multiplication/division, and ±1/256-cycle phase shift |
| SelectRAM Block Memory | 1,104 Kbits total - composed of 18 Kb dual-port blocks (144 × 18 Kb), configurable as 16K×1 to 512×36 with read-during-write support |
| Core Voltage (VCCINT) | 1.5 V - low-voltage core supply enabling high-speed operation with reduced dynamic power vs. older 2.5 V FPGAs |
Pinout & Package
XC2V6000-4FF1152I is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.00 mm pitch, 35 mm × 35 mm body size, and industrial temperature range (–40°C to +100°C). The package supports 1,104 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master/slave serial or SelectMAP mode; requires stable 0–100 MHz clock |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream loading and device initialization completion |
| M0–M2 | Mode Selection Inputs | Three-pin binary encoding selects one of five configuration modes (slave-serial, master-serial, slave/master SelectMAP, boundary-scan) |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts configuration sequence |
| TCK/TDI/TDO/TMS | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port supporting configuration, debug, and verification via JTAG chain |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series or split termination for LVDCI, HSTL_DCI, SSTL_DCI, and GTL/GTLP standards - eliminates external resistors and improves signal integrity |
| DDR I/O Registers | Dual-edge capture and launch per I/O path using two independent clocks (180° phase offset) - enables true DDR data transfer without external PHY |
| Triple-DES Bitstream Encryption | On-chip hardware decryptor supporting one or two key sets - secures intellectual property against unauthorized readback or cloning |
| Readback & Integrated Logic Analyzer (ILA) | Full configuration memory, register, and block/distributed RAM content accessible in-system - enables real-time debugging without external probes |
| PCI-X/PCI Compliance | Native 3.3 V signaling compliant with PCI-X 133 MHz and PCI 66/33 MHz standards - simplifies integration into legacy host systems |
Applications
| Telecom Line Card Processing | High-Speed Network Switch Fabric |
|---|---|
Use Scenario: Implementing packet classification, header parsing, and QoS scheduling in OC-192/STM-64 line cards. IC Role / Device Role / Timing Role: Configurable fabric for protocol-aware datapath acceleration with deterministic latency via DCM-controlled clock domains. Use Value: 1,104 I/Os enable full SerDes interface aggregation; 144 DCMs allow independent clock domain management for ingress/egress/management planes. |
Use Scenario: Building scalable, non-blocking switch fabric with 10 GbE/SONET interfaces and buffer management logic. IC Role / Device Role / Timing Role: High-bandwidth interconnect controller with embedded SelectRAM for packet buffering and multiplier blocks for CRC/encryption offload. Use Value: 1,056 hardware multipliers accelerate polynomial division for CRC-32/CRC-64; dual-port 18 Kb RAM blocks implement deep FIFOs with zero external memory latency. |
| Medical Imaging Signal Processing | Defense Radar Beamforming |
Use Scenario: Real-time reconstruction of MRI/CT scan data using parallel FIR filters and FFT engines. IC Role / Device Role / Timing Role: Reconfigurable DSP engine with fixed-point arithmetic pipelines synchronized by phase-aligned DCM outputs. Use Value: 420 MHz internal clock speed sustains >200 MFLOPS compute throughput; LVDS I/O supports high-speed ADC/DAC interface at 840 Mb/s. |
Use Scenario: Adaptive beamforming and pulse-Doppler processing in AESA radar systems with strict timing jitter requirements. IC Role / Device Role / Timing Role: Deterministic timing controller managing RF front-end sampling clocks, T/R switching, and STALO synchronization. Use Value: DCMs provide sub-10 ps jitter clock outputs with precise phase alignment across 144 channels; DCI ensures impedance-matched LVPECL/LVDS links to RF ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV6000E-4FF1152I | Enhanced Virtex-E variant with identical pinout and logic resources but lower max I/O (824) and no DCI support | Lacks on-chip termination and advanced I/O standards (LVDS_25_DCI, SSTL_DCI); limited for high-speed memory interface designs | Choose only if DCI and full 1,104 I/O count are not required; lower cost alternative for non-impedance-critical applications |
| XC4VLX80-11FF1152C | Virtex-4 LX80 with 80K logic cells, 320 DSP slices, and 640 user I/Os - smaller density, newer 90 nm process, no DCM (uses DCM_CLKGEN) | Targets lower gate-count designs with higher logic utilization efficiency; lacks native PCI-X support and DCI | Prefer for new designs needing lower power and higher logic density per mm²; not drop-in compatible due to architectural differences and reduced I/O count |
Compared with XC2V6000-4FF1152I, XCV6000E-4FF1152I sacrifices I/O count and DCI for cost reduction, while XC4VLX80-11FF1152C trades raw gate count and legacy interface support for process-node advantages and integrated clocking - neither matches the exact 6M-gate, 1,104-I/O, DCI-enabled profile of the XC2V6000-4FF1152I.
Availability
XC2V6000-4FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and medical imaging systems requiring stable component supply, long-term lifecycle support, and industrial-temperature operation.
Supply support for XC2V6000-4FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, known for FPGA, SoC, and adaptive computing solutions.
The Virtex-II family was designed for high-performance, high-density system-on-chip implementations in wireline/wireless infrastructure, where deterministic timing, large embedded memory, and multi-standard I/O interoperability are critical.
FAQ
What is the maximum operating junction temperature for XC2V6000-4FF1152I?
The XC2V6000-4FF1152I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is guaranteed under specified VCCINT = 1.5 V, VCCAUX = 3.3 V, and VCCO conditions per I/O standard, and applies across the full speed grade (-4) performance envelope defined in DS031 Module 3.
Does XC2V6000-4FF1152I support IEEE 1532 boundary-scan configuration?
Yes, XC2V6000-4FF1152I fully supports IEEE 1532 boundary-scan configuration through its JTAG TAP controller. This enables in-system programming, verification, and debug without requiring external configuration PROMs - a capability confirmed in DS031 Module 1 Section "Configuration" and Module 2 Section "Boundary Scan".
How many 18 Kb Block SelectRAM modules does XC2V6000-4FF1152I contain?
XC2V6000-4FF1152I contains 144 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. This yields 2,592 Kb (2.53 Mb) of block memory, configurable from 16K×1 to 512×36 with three read-during-write modes - a value explicitly listed in Table 1 of DS031-1 (v3.5).
Is XC2V6000-4FF1152I pin-compatible with other Virtex-II devices in FF1152 packaging?
No - XC2V6000-4FF1152I is not pin-compatible with lower-density Virtex-II devices in FF1152 packaging. While Table 6 confirms FF1152 is used for XC2V3000, XC2V4000, and XC2V6000, the actual I/O count differs (720/824/1,104), and Xilinx states only "all devices in a particular package are pinout compatible" when sharing identical density and feature set - which does not apply across this density range.
What I/O standards with Digitally Controlled Impedance (DCI) are supported by XC2V6000-4FF1152I?
XC2V6000-4FF1152I supports DCI for LVDCI_33/LVDCI_25/LVDCI_18/LVDCI_15, GTL_DCI, GTLP_DCI, HSTL_I/II/III/IV_DCI (including 18 V variants), SSTL18/SSTL2/SSTL3_DCI, and LVDS_25_DCI/LVDSEXT_25_DCI - all confirmed in DS031-2 Table 3 and Module 1 "Summary of Features".
XC2V6000-4FF1152I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8448
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 2654208
- Number of I/O:
- 824
- Number of Gates:
- 6000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2V6000-4FF1152I FAQ
1.How can I place an order for XC2V6000-4FF1152I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V6000-4FF1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V6000-4FF1152I reliable?
The price and inventory of XC2V6000-4FF1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V6000-4FF1152I is usually 5 days.
3.What payment methods are accepted for XC2V6000-4FF1152I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V6000-4FF1152I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V6000-4FF1152I?
XC2V6000-4FF1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V6000-4FF1152I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V6000-4FF1152I?
For technical support, including XC2V6000-4FF1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V6000-4FF1152I requirements.
6.How does Aetrix verify that XC2V6000-4FF1152I is sourced from the original manufacturer or authorized distributors?
All XC2V6000-4FF1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V6000-4FF1152I meets industry standards.
7.What is the process for return or replacement of XC2V6000-4FF1152I?
All XC2V6000-4FF1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V6000-4FF1152I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V6000-4FF1152I part is unused and in its original packaging.
Return procedure for XC2V6000-4FF1152I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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