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AMD XC2V6000-4FFG1152C
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- Part No.:
- XC2V6000-4FFG1152C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2V6000-4FFG1152C.pdf
- Description:
- IC FPGA 824 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,427
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Product details
Overview
XC2V6000-4FFG1152C from Xilinx is a high-density Virtex-II platform FPGA with 6 million system gates, 33,792 configurable logic blocks (CLBs), 1,056 dedicated 18-bit × 18-bit multipliers, and 144 Digital Clock Manager (DCM) modules. It features 1,104 user I/Os in a 1152-pin flip-chip fine-pitch BGA package (FFG1152), supporting LVDS, PCI-X, SSTL, HSTL, and DCI I/O standards for telecom and high-speed interface applications.
For engineers reviewing the XC2V6000-4FFG1152C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability mapping, DCM timing parameters, SelectRAM memory configurations, and real-world deployment context for high-bandwidth programmable logic design.
Technical Context
The XC2V6000-4FFG1152C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path with 180° phase-shifted clocks generated by integrated DCMs.
Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), fast carry chains, and horizontal cascade logic; block SelectRAM provides 18-Kb dual-port RAM configurable from 16K×1 to 512×36, with associated multiplier blocks enabling efficient read-multiply-accumulate operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 6 million - defines maximum combinational logic capacity for complex ASIC replacement or IP-core integration |
| Configurable Logic Blocks (CLBs) | 33,792 - each contains 4 slices with dual LUTs and dual registers, enabling high register/LUT density for synchronous control and datapath logic |
| User I/O Count | 1,104 - available in FF1152 flip-chip BGA; supports up to 840 Mb/s LVDS and PCI-X 133 MHz at 3.3V |
| Digital Clock Managers (DCMs) | 144 - provide jitter-free clock de-skew, M/D frequency synthesis, and ±1/256-cycle phase resolution for multi-clock domain synchronization |
| SelectRAM Memory | 1,104 Kbits total - composed of 144 × 18-Kb dual-port blocks; enables embedded FIFOs, frame buffers, and coefficient tables without external memory |
| Multiplier Blocks | 1,056 × 18-bit × 18-bit - hardwired DSP resources supporting pipelined MAC operations at up to 420 MHz internal clock speed |
| Core Voltage (VCCINT) | 1.5 V - low-voltage CMOS process reduces dynamic power while maintaining high-speed operation |
Pinout & Package
XC2V6000-4FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FFG1152) with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high I/O count and signal integrity. The package supports 1,104 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial or slave serial configuration; must be stable during bitstream loading |
| DONE | Configuration Status Output | Open-drain signal indicating successful configuration completion and internal initialization |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, SelectMAP, boundary-scan) at power-up |
| PROG_B | Program Initiate Input | Active-low signal that clears configuration memory and resets internal state for reconfiguration |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, verification, and debug |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-die series or split termination for LVCMOS, SSTL, HSTL, GTL/GTLP - eliminates external resistors and improves signal integrity for point-to-point interfaces |
| DDR I/O Registers | Dual-edge capture/output per I/O using 180° phase-shifted clocks from DCM - enables true double-data-rate signaling without external PHY |
| SelectIO-Ultra Technology | Support for 19 single-ended and 6 differential I/O standards including LVDS, BLVDS, LDT, LVPECL - simplifies interface to memory, processors, and serial links |
| Triple-DES Bitstream Encryption | On-chip hardware decryptor with one or two key sets - protects intellectual property in SRAM-based configuration against reverse engineering |
| Integrated Logic Analyzer (ILA) | Embedded core for real-time visibility into internal signals, registers, and memory contents during operation - accelerates system-level debug without physical probes |
Applications
| Telecom Line Card Processing | High-Speed Network Switch Fabric |
|---|---|
|
Use Scenario: Implementing packet classification, header parsing, and QoS policy enforcement in OC-192/STM-64 line cards. IC Role / Device Role / Timing Role: Configurable datapath engine performing parallel lookups and stateful processing on 10 Gbps+ data streams. Use Value: 1,104 I/Os and 144 DCMs enable simultaneous SerDes interfacing, memory controller co-location, and deterministic latency control across multiple traffic classes. |
Use Scenario: Building scalable, non-blocking switch fabric with distributed buffering and crosspoint arbitration for enterprise routers. IC Role / Device Role / Timing Role: Central switching matrix orchestrating 64+ port ingress/egress pipelines with synchronized clock domains. Use Value: 1,056 hard multipliers and 1,104 Kbits of dual-port SelectRAM allow real-time buffer management, CRC computation, and flow control logic within a single device. |
| Video Broadcast Signal Processing | Medical Imaging Data Pipeline |
|
Use Scenario: Real-time HD/4K video scaling, color space conversion, and compression preprocessing in broadcast encoders. IC Role / Device Role / Timing Role: Parallel pixel-processing engine with pixel-clock-synchronized I/O and frame-buffer memory subsystem. Use Value: LVDS I/O at 840 Mb/s and DDR-capable IOBs support direct connection to image sensors and display interfaces while maintaining sub-pixel timing accuracy. |
Use Scenario: High-fidelity acquisition and preprocessing of CT/MRI scan data before transfer to host CPU or GPU. IC Role / Device Role / Timing Role: Deterministic front-end controller managing ADC sampling, channel calibration, and raw data staging. Use Value: 144 DCMs provide precise clock de-skew across 64+ ADC channels, and DCI termination ensures clean analog-to-digital signal integrity at >100 MSPS rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V8000-4FF1517C | Higher density (8M gates), 1,108 I/Os, larger FF1517 package (40 mm × 40 mm); same 1.5 V core, DCM count increased to 168 | Required for designs exceeding 6M gate utilization or needing >1,104 I/Os; not drop-in due to larger footprint and thermal profile | Select when gate count or I/O count exceeds XC2V6000-4FFG1152C capacity; verify PCB layout and thermal management for FF1517 |
| XC3V1000-4FG320C | Virtex-3 generation; lower density (1M gates), 224 I/Os, smaller FG320 package; includes enhanced DCM+, Block RAM, and PowerPC 405 hard core | Better suited for embedded processor-centric designs with moderate logic but higher integration needs; lacks DCI and LVDS performance of Virtex-II | Choose for cost-sensitive, lower-gate-count applications requiring soft/hard processor integration; not suitable for bandwidth-constrained telecom/video roles |
Compared with XC2V6000-4FFG1152C, XC2V8000-4FF1517C offers higher scalability at the cost of board space and power, while XC3V1000-4FG320C trades raw I/O bandwidth and gate density for embedded processor capability and lower system-level component count.
Availability
XC2V6000-4FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed networking, broadcast video processing, and medical imaging systems requiring stable component supply and long-term obsolescence management.
Supply support for XC2V6000-4FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the first commercial FPGA and continues to lead in adaptive computing architectures.
The Virtex-II family was designed for high-performance, high-density programmable logic applications in telecommunications, wireless infrastructure, and digital signal processing - emphasizing I/O bandwidth, clock management precision, and embedded memory/multiplier resources.
FAQ
What is the maximum operating frequency of the XC2V6000-4FFG1152C core logic?
The XC2V6000-4FFG1152C supports an internal clock speed of up to 420 MHz, as specified in the Advance Data section of DS031. This applies to synchronous logic paths within the CLB array under optimal placement and routing conditions; actual system frequency depends on design complexity, I/O constraints, and DCM configuration.
Does the XC2V6000-4FFG1152C support 5V-tolerant I/Os?
No, the XC2V6000-4FFG1152C does not support native 5V-tolerant I/Os. Its IOBs are incompatible with 5V standards as outputs and not normally 5V tolerant as inputs. External current-limiting resistors may enable limited 5V input use, but this requires careful validation per Xilinx Tech Topic "5V Tolerant I/Os" and is not guaranteed across temperature/voltage corners.
How many block SelectRAM resources does the XC2V6000-4FFG1152C include?
The XC2V6000-4FFG1152C includes 144 block SelectRAM modules, each providing 18 Kb of dual-port RAM. This yields a total of 1,104 Kbits of dedicated block memory, configurable in widths from 1 to 36 bits and depths from 512 to 16,384 words, with full read-during-write capability.
What configuration modes are supported by the XC2V6000-4FFG1152C?
The XC2V6000-4FFG1152C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is performed via dedicated pins (CCLK, DIN, PROG_B, DONE, M0–M2), and bitstream encryption using Triple-DES is available for secure deployment.
Is the XC2V6000-4FFG1152C pin-compatible with other Virtex-II devices in the FF1152 package?
Yes, all Virtex-II devices offered in the FF1152 package - including XC2V3000, XC2V4000, and XC2V6000 - share identical pinouts and footprint. This allows scalable design reuse: a board designed for XC2V3000-4FFG1152C can be upgraded to XC2V6000-4FFG1152C without PCB revision, provided power delivery and thermal design accommodate the higher gate count.
XC2V6000-4FFG1152C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8448
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 2654208
- Number of I/O:
- 824
- Number of Gates:
- 6000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2V6000-4FFG1152C FAQ
1.How can I place an order for XC2V6000-4FFG1152C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V6000-4FFG1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V6000-4FFG1152C reliable?
The price and inventory of XC2V6000-4FFG1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V6000-4FFG1152C is usually 5 days.
3.What payment methods are accepted for XC2V6000-4FFG1152C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V6000-4FFG1152C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V6000-4FFG1152C?
XC2V6000-4FFG1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V6000-4FFG1152C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V6000-4FFG1152C?
For technical support, including XC2V6000-4FFG1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V6000-4FFG1152C requirements.
6.How does Aetrix verify that XC2V6000-4FFG1152C is sourced from the original manufacturer or authorized distributors?
All XC2V6000-4FFG1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V6000-4FFG1152C meets industry standards.
7.What is the process for return or replacement of XC2V6000-4FFG1152C?
All XC2V6000-4FFG1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V6000-4FFG1152C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V6000-4FFG1152C part is unused and in its original packaging.
Return procedure for XC2V6000-4FFG1152C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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