AMD XC2V6000-5BF957C

Overview

XC2V6000-5BF957C from Xilinx is a high-density, flip-chip BGA Field-Programmable Gate Array (FPGA) with 6 million system gates, 33,792 CLB slices, 1,056 dedicated 18×18 multipliers, and 144 Digital Clock Manager (DCM) modules. It delivers up to 1,104 user I/Os in the BF957 package and supports LVDS, DDR, PCI-X, and HSTL interfaces for telecom, networking, and high-speed DSP applications.

For engineers reviewing the XC2V6000-5BF957C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support, DCM timing parameters, DCI termination capability, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V6000-5BF957C implements Xilinx's Virtex-II IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, 1.5 V core supply (VCCINT), and separate 3.3 V auxiliary (VCCAUX) and I/O (VCCO) supplies. Its routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout.

It integrates 144 DCM blocks for precise clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution), plus 16 global clock multiplexer buffers. Each IOB supports DDR input/output registers, programmable drive strength (2–24 mA), and Digitally Controlled Impedance (DCI) for on-die series or split termination across 19 single-ended and 6 differential I/O standards.

Key Specifications

Pinout & Package

XC2V6000-5BF957C is housed in a 957-ball flip-chip BGA (BF957) package with 1.27 mm pitch, 40 mm × 40 mm body size, and 684 user I/Os (per Table 6, DS031-1 v3.5). The BF957 footprint is pin-compatible with other BF-series packages but not with FG/FF wire-bond or flip-chip variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V6000-5BF957C, XCV6000E-5FF1704C adds embedded processors and serial I/O at the cost of architectural divergence, while XC4VLX60-11FF668C offers superior speed/power but removes DCI - making both unsuitable as pin-compatible replacements yet viable for functionally aligned next-generation implementations.

Availability

XC2V6000-5BF957C is available at Aetrix Electronics and suitable for telecom infrastructure, defense radar systems, and medical imaging equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V6000-5BF957C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family - including XC2V6000-5BF957C - was engineered for high-bandwidth, low-latency applications in telecommunications, networking, and signal processing, emphasizing I/O flexibility, clock management, and embedded memory.

FAQ

What is the maximum number of user I/Os supported by XC2V6000-5BF957C?

XC2V6000-5BF957C supports 684 user I/Os in the BF957 package, as confirmed in Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. While the XC2V6000 device family can support up to 1,104 I/Os in FF1517 packaging, the BF957 variant is limited to 684 due to ball count and routing constraints.

Does XC2V6000-5BF957C support on-chip termination for HSTL interfaces?

Yes, XC2V6000-5BF957C supports Digitally Controlled Impedance (DCI) for HSTL_I_DCI, HSTL_II_DCI, HSTL_III_DCI, and HSTL_IV_DCI standards, as documented in Table 3 of DS031-2 (v3.5). It provides split-termination for Class I/II and single-termination for Class III/IV, calibrated to external 50 Ω or 75 Ω reference resistors per bank.

What clock management resources are integrated into XC2V6000-5BF957C?

XC2V6000-5BF957C integrates 144 Digital Clock Manager (DCM) modules and 16 global clock multiplexer buffers. Each DCM supports de-skew, frequency synthesis (M/D ratios), and coarse/fine phase shifting (down to 1/256 clock period), enabling robust multi-domain clocking for high-speed interfaces like DDR and LVDS.

Is XC2V6000-5BF957C compatible with 5V-tolerant I/O standards?

No, XC2V6000-5BF957C is not 5V-tolerant. Its IOBs are designed for VCCO levels between 1.5 V and 3.3 V. As inputs, they can interface with 5V signals only when external current-limiting resistors are used - per Xilinx Tech Topic "5V Tolerant I/Os". As outputs, they are incompatible with 5V standards due to fixed-clamp diodes tied to VCCO.

What configuration modes does XC2V6000-5BF957C support?

XC2V6000-5BF957C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Configuration data is loaded into SRAM-based configuration memory, enabling unlimited reprogramming and partial reconfiguration without device reset.