AMD XC2V6000-5BF957I

Overview

XC2V6000-5BF957I from Xilinx is a high-density Virtex-II platform FPGA with 6 million system gates, 33,792 configurable logic blocks (CLBs), 1,056 dedicated 18×18 multipliers, and 144 Digital Clock Manager (DCM) modules. It features 1,104 user I/Os in a flip-chip BGA package and supports LVDS, PCI-X, SSTL, HSTL, and DCI I/O standards for telecom, networking, and DSP applications.

For engineers reviewing the XC2V6000-5BF957I datasheet, pinout, applications, or equivalent options, this device delivers deterministic high-speed routing, on-die impedance matching, dual-port block RAM up to 1,104 Kbits, and full IEEE 1149.1 boundary-scan compliance - critical for high-reliability embedded reconfigurable systems requiring precise clock de-skew and DDR interface support.

Technical Context

The XC2V6000-5BF957I implements a hierarchical, segmented Active Interconnect architecture with 24 long lines per row/column, 120 hex lines, and glitch-free global clock multiplexers. Its IOBs support true DDR input/output registers with 180° phase-shifted clocks generated by integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, fast carry chains, and horizontal cascading; block SelectRAM provides 18-Kb dual-port RAM configurable from 16K×1 to 512×36, while multiplier blocks operate independently or in read-multiply-accumulate pipelines.

Key Specifications

Pinout & Package

XC2V6000-5BF957I uses the BF957 flip-chip BGA package (1.27 mm pitch, 40×40 mm body), supporting 684 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD). VBATT is reserved.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V6000-5BF957I, the XCV6000-5FF1517I offers identical logic capacity but demands finer PCB fabrication and superior thermal design, while the XC2V8000-5FF1517I trades pin compatibility for headroom in large-scale algorithm acceleration - neither is pin-compatible nor drop-in replaceable due to distinct package footprints and power delivery requirements.

Availability

XC2V6000-5BF957I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and medical imaging systems requiring stable component supply, long-term obsolescence planning, and traceable sourcing.

Supply support for XC2V6000-5BF957I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic with industry-leading FPGA architectures, process technology partnerships, and integrated development tools for high-performance digital systems.

The Virtex-II family was designed for high-speed, high-density reconfigurable computing in wireline/wireless infrastructure, where deterministic timing, I/O flexibility, and system-level security were primary drivers.

FAQ

What is the maximum operating junction temperature for XC2V6000-5BF957I?

The XC2V6000-5BF957I is rated for industrial temperature range (–40°C to +100°C), with maximum junction temperature of +100°C under specified thermal conditions. This rating assumes proper heatsinking and airflow per Xilinx Thermal Management Guidelines for BF957 packages, and applies to all speed grades including the –5 grade.

Does XC2V6000-5BF957I support partial reconfiguration?

Yes, XC2V6000-5BF957I supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. Users can dynamically reload specific CLB columns or block RAM regions without disrupting active logic elsewhere - enabled via Xilinx ISE toolchain and documented in UG078.

What I/O standards with Digitally Controlled Impedance are supported by XC2V6000-5BF957I?

XC2V6000-5BF957I supports DCI for LVDCI, HSTL_I_DCI through IV_DCI (1.5V/1.8V), SSTL18/2/3_DCI, GTLP_DCI, and LVDS_25_DCI. Each I/O bank can be independently configured for series or split termination, with reference resistor values set via configuration bits - no external components required.

How many global clock lines does XC2V6000-5BF957I provide?

XC2V6000-5BF957I provides 16 global clock lines - eight per quadrant - routed through dedicated low-skew networks. Each line connects to up to four DCM outputs or global clock multiplexer buffers, enabling simultaneous distribution of multiple phase-aligned clocks across the entire array.

Is XC2V6000-5BF957I compatible with IEEE 1532 boundary-scan configuration?

Yes, XC2V6000-5BF957I fully complies with IEEE 1532 for in-system configuration via JTAG. It supports boundary-scan instructions including EXTEST, INTEST, and HIGHZ, and allows bitstream loading, readback, and device programming without requiring external configuration PROMs or microcontrollers.