AMD XC2V8000-4FF1152I

Overview

XC2V8000-4FF1152I from Xilinx is an 8-million-system-gate Virtex-II platform FPGA in a 1152-pin flip-chip fine-pitch BGA package, operating across –40°C to +100°C industrial temperature range. It integrates 46,592 CLBs, 1,456 dedicated 18×18 multipliers, 168 Digital Clock Managers (DCMs), and supports up to 1,108 user I/Os with SelectIO-Ultra technology including LVDS, SSTL, HSTL, and DCI termination. It is deployed in high-bandwidth telecom line cards requiring deterministic clock management and DDR memory interfacing.

For engineers reviewing the XC2V8000-4FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count scalability, DCM phase-shifting resolution (1/256 clock period), dual-port Block SelectRAM configuration flexibility (512×36 to 16K×1), and compliance with PCI-X 133 MHz and DDR SDRAM interfaces.

Technical Context

The XC2V8000-4FF1152I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support true DDR input/output paths using two independently clocked registers per I/O, driven by DCM-generated 180°-phase-shifted clocks.

Each CLB contains four slices with dual 4-LUTs, dual storage elements, fast carry chains, and horizontal cascade logic; each Block SelectRAM provides synchronous dual-port RAM (18 Kb) with three read-during-write modes and direct association with a dedicated 18×18 multiplier for efficient DSP filtering.

Key Specifications

Pinout & Package

XC2V8000-4FF1152I uses a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction. The package supports 1,108 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V8000-4FF1152I, the XC2VP70-5FF1704I adds processor subsystems and serial transceivers at the cost of layout compatibility, while the XC2VP70-5FF1704I trades raw logic density for hardened peripherals-making XC2V8000-4FF1152I optimal for pure programmable logic scaling in established PCI-X platforms.

Availability

XC2V8000-4FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, military avionics, and industrial automation systems requiring stable component supply across extended lifecycle commitments.

Supply support for XC2V8000-4FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, specializing in FPGAs, SoCs, and adaptive compute acceleration platforms.

The Virtex-II family was designed for high-performance, high-density applications in telecommunications, wireless infrastructure, and video processing-emphasizing clock management precision, I/O flexibility, and system gate scalability.

FAQ

What is the maximum achievable internal clock frequency for XC2V8000-4FF1152I?

The XC2V8000-4FF1152I is rated for 420 MHz internal clock speed per Advance Data specifications. This performance is guaranteed under industrial temperature conditions (–40°C to +100°C) and with proper power delivery and PCB layout. Actual timing closure depends on design utilization, routing congestion, and DCM configuration-but the -4 speed grade ensures this frequency target is met in typical high-fanout logic paths within the XC2V8000-4FF1152I device.

Does XC2V8000-4FF1152I support 5V-tolerant I/Os?

No, XC2V8000-4FF1152I does not support native 5V-tolerant I/Os. Its IOBs are designed for VCCO levels of 1.5V, 1.8V, 2.5V, or 3.3V only. As inputs, they can interface with 5V signals only when external current-limiting resistors are used to prevent damage to clamp diodes. Xilinx explicitly states that outputs are incompatible with 5V standards, and no internal protection circuitry exists for 5V operation-so XC2V8000-4FF1152I must be used in mixed-voltage systems with level-shifting or isolation.

How many Block SelectRAM modules does XC2V8000-4FF1152I contain, and what configurations are supported?

XC2V8000-4FF1152I contains 168 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. Supported configurations include 16K×1, 8K×2, 4K×4, 2K×9, 1K×18, and 512×36 bits per block. Each port operates synchronously and independently, with three read-during-write modes (WRITE_FIRST, READ_FIRST, NO_CHANGE). Cascading across multiple blocks enables larger memory depths or widths-critical for frame buffering in video pipelines and packet buffering in networking applications using XC2V8000-4FF1152I.

Can XC2V8000-4FF1152I perform partial reconfiguration in the field?

Yes, XC2V8000-4FF1152I supports IEEE 1532-compliant partial reconfiguration. This allows dynamic replacement of specific logic modules-such as protocol engines or filter coefficients-without resetting the entire device or halting system operation. Implementation requires Xilinx ISE tools with PlanAhead support and careful floorplanning to isolate reconfigurable regions. Field updates are performed via JTAG or SelectMAP interface, making XC2V8000-4FF1152I suitable for adaptive radar, software-defined radio, and mission-critical systems requiring zero-downtime upgrades.

What is the role of Digitally Controlled Impedance (DCI) in XC2V8000-4FF1152I, and which I/O standards does it support?

Digitally Controlled Impedance (DCI) in XC2V8000-4FF1152I provides on-chip series or split termination resistors for single-ended I/O standards including LVCMOS, SSTL, HSTL, GTL, and GTLP-eliminating the need for external resistors and improving signal integrity. DCI automatically calibrates against external reference resistors (typically 50 Ω) and supports both series (for source termination) and split (for stub-series terminated logic) topologies. It is not available for differential standards like LVDS or LVPECL, which rely on external termination; DCI functionality is fully integrated and controllable per-bank in XC2V8000-4FF1152I.