AMD XC2V8000-4FF1517I

Overview

XC2V8000-4FF1517I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 8 million system gates, 46,592 CLB slices, 1,456 dedicated 18×18 multipliers, and 168 Digital Clock Manager (DCM) modules. It features 1,108 user I/Os in a 1517-pin flip-chip fine-pitch BGA package and supports LVDS, DDR, PCI-X, and HSTL I/O standards for telecom, networking, and video processing applications.

For engineers reviewing the XC2V8000-4FF1517I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability, clock management specs, DCI termination support, and real-world deployment context - all grounded in DS031 (v3.5) November 2007 official documentation.

Technical Context

The XC2V8000-4FF1517I implements a fully SRAM-based, reprogrammable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates Configurable Logic Blocks (CLBs), 18-Kb dual-port Block SelectRAM™, Digitally Controlled Impedance (DCI) I/O, and 16 global clock multiplexer buffers.

Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, GTL) and differential (LVDS, BLVDS, LVPECL, LDT) signaling with optional DDR registers per path. The 168 DCMs provide precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution), enabling deterministic timing across high-speed interfaces up to 840 Mb/s.

Key Specifications

Pinout & Package

XC2V8000-4FF1517I uses a 1517-ball flip-chip fine-pitch BGA (FF1517) with 1.00 mm pitch, 40 mm × 40 mm body size, and thermal-enhanced construction. The package supports 1,108 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V6000-4FF1152I and XC3S5000-4FG900I, the XC2V8000-4FF1517I delivers 33% more logic resources, 34% more I/Os, and full DCM+DCI capabilities essential for carrier-grade timing and signal integrity - making it irreplaceable in high-end infrastructure where deterministic performance is non-negotiable.

Availability

XC2V8000-4FF1517I is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed networking equipment, and medical imaging systems requiring stable component supply and long-term industrial temperature support (–40°C to +100°C).

Supply support for XC2V8000-4FF1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-first platform FPGAs with integrated IP and system-level architectures.

The Virtex-II family - including XC2V8000-4FF1517I - was engineered for high-performance, high-density applications in telecommunications, wireless infrastructure, and video processing, emphasizing clock precision, I/O flexibility, and system integration.

FAQ

What is the operating temperature range for XC2V8000-4FF1517I?

The XC2V8000-4FF1517I is rated for industrial operation from –40°C to +100°C junction temperature (Tj), as indicated by the "I" suffix in its part number. This makes it suitable for base station radios, network routers, and other uncontrolled-environment deployments where extended thermal stability is required. All DC and switching characteristics in DS031 Module 3 are validated across this full range.

Does XC2V8000-4FF1517I support on-chip termination for I/O standards?

Yes, XC2V8000-4FF1517I implements Digitally Controlled Impedance (DCI) for on-chip series or split termination across multiple I/O standards including LVCMOS, HSTL, SSTL, and GTL. DCI eliminates the need for external resistors and dynamically matches impedance to PCB trace characteristics - a feature confirmed in DS031 Module 2 Table 3 and Section "Digitally Controlled Impedance (DCI)".

How many Digital Clock Manager (DCM) modules does XC2V8000-4FF1517I include?

The XC2V8000-4FF1517I integrates 168 Digital Clock Manager (DCM) modules, as specified in Table 1 of DS031 Module 1. Each DCM provides fully digital clock deskew, frequency synthesis (M/D ratio), coarse/fine phase shifting, and jitter reduction - enabling precise timing control across 1,108 I/Os and internal logic domains without external clock ICs.

Is XC2V8000-4FF1517I compatible with PCI-X 133 MHz interfaces?

Yes, XC2V8000-4FF1517I supports PCI-X 133 MHz at 3.3 V, as explicitly listed under "SelectIO™-Ultra Technology" in DS031 Module 1 Summary of Features. Its IOBs meet timing and electrical requirements for PCI-X compliance, including setup/hold margins and driver strength - confirmed in the "PCI-X compatible (133 MHz and 66 MHz) at 3.3V" bullet point.

What configuration modes are supported by XC2V8000-4FF1517I?

XC2V8000-4FF1517I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). Mode selection is controlled by M0–M2 pins, and configuration data can be encrypted using Triple-DES keys. These modes are documented in DS031 Module 1 Section "Configuration" and Module 2 Section "Detailed Description".