AMD XC2V8000-4FFG1152C

Overview

XC2V8000-4FFG1152C from Xilinx is a high-density, flip-chip fine-pitch BGA FPGA with 8 million system gates, 46,592 CLB slices, 1,456 dedicated 18×18 multipliers, and 168 Digital Clock Managers (DCMs). It delivers up to 1,108 user I/Os in the FF1152 package and supports LVDS, DDR, PCI-X, and HSTL interfaces for telecom and high-speed data acquisition systems.

For engineers reviewing the XC2V8000-4FFG1152C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support, DCM timing parameters, SelectRAM memory configurations, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V8000-4FFG1152C implements Xilinx's Virtex-II IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, 1.5 V core supply (VCCINT), and separate 3.3 V auxiliary (VCCAUX) and programmable I/O (VCCO) supplies. Its routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, GTL) and differential (LVDS, BLVDS, LVPECL, LDT) standards, with Digitally Controlled Impedance (DCI) enabling on-chip termination. The device integrates 3,024 Kbits of distributed RAM and 1,108 Kbits of dual-port block SelectRAM, plus 16 global clock MUX buffers driven by up to 12 DCMs per quadrant.

Key Specifications

Pinout & Package

XC2V8000-4FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high I/O count and signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V8000-4FFG1152C, the XC7VX690T-2FFG1927I provides 15× more logic resources and modern memory interfaces but requires higher power and larger footprint, while the XCVU9P-2FLGA2104I delivers hardened high-speed serial I/O and AI-optimized DSP slices at the cost of complete architectural discontinuity.

Availability

XC2V8000-4FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging, defense radar, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V8000-4FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance, system-level programmable logic solutions.

The Virtex-II platform was engineered for wireline/wireless infrastructure and high-end DSP applications demanding scalable logic density, precise clock management, and multi-standard I/O flexibility.

FAQ

What is the maximum operating junction temperature for XC2V8000-4FFG1152C?

The XC2V8000-4FFG1152C is rated for commercial temperature range (0°C to +85°C junction), as indicated by the final "C" in its part number. This specification applies under specified VCCINT, VCCAUX, and VCCO supply conditions and assumes adequate board-level thermal management per Xilinx Thermal Management Guidelines UG075.

Does XC2V8000-4FFG1152C support JTAG boundary-scan testing?

Yes, XC2V8000-4FFG1152C fully complies with IEEE 1149.1 and supports boundary-scan testing via TCK, TMS, TDI, and TDO pins. It implements BYPASS, SAMPLE, EXTEST, INTEST, and HIGHZ instructions, enabling in-circuit verification, interconnect testing, and configuration debugging without requiring functional firmware.

Can XC2V8000-4FFG1152C be configured via SPI flash memory?

No, XC2V8000-4FFG1152C does not support native SPI flash configuration. It requires master serial, slave serial, or SelectMAP configuration modes using parallel PROMs or microcontrollers. External SPI-to-parallel bridge ICs may be used, but Xilinx does not validate or recommend such implementations for production use.

What is the purpose of the HSWAP_EN pin on XC2V8000-4FFG1152C?

The HSWAP_EN pin on XC2V8000-4FFG1152C controls hot-swap I/O behavior during power-up. When pulled high, it enables weak pull-up/pull-down resistors on unused I/Os to prevent floating states; when grounded, all unused I/Os default to high-impedance. This feature simplifies board-level hot-swap compliance and ESD protection design.

How many global clock lines are available in XC2V8000-4FFG1152C?

XC2V8000-4FFG1152C provides 16 global clock lines - eight per quadrant - routed through dedicated low-skew networks. Each line can be driven by a DCM output or a global clock MUX buffer, supporting simultaneous clock distribution to multiple logic regions with guaranteed skew <100 ps across the die.